BS PD IEC TS 62686-1-2015 Process management for avionics Electronic components for aerospace defence and high performance (ADHP) applications General requirements for hig.pdf

1、BSI Standards Publication Process management for avionics Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors PD IEC/TS 62686-1:2015National foreword This Published Doc

2、ument is the UK implementation of IEC/TS 62686-1:2015. It supersedes PD IEC/TS 62686-1:2012 which is now withdrawn. The UK participation in its preparation was entrusted to Technical Committee GEL/107, Process management for avionics. A list of organizations represented on this committee can be obta

3、ined on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2015. Published by BSI Standards Limited 2015 ISBN 978 0 580 88254 8 ICS 03.100.50; 31.020;

4、49.060 Compliance with a British Standard cannot confer immunity from legal obligations. This Published Document was published under the authority of the Standards Policy and Strategy Committee on 30 April 2015. Amendments/corrigenda issued since publication Date Text affected PUBLISHED DOCUMENT PD

5、IEC/TS 62686-1:2015 IEC TS 62686-1 Edition 2.0 2015-04 TECHNICAL SPECIFICATION Process management for avionics Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors INTER

6、NATIONAL ELECTROTECHNICAL COMMISSION ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2645-2 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. PD IEC/TS 62686-1:2015 2 IEC TS 62686-1:2015 IEC 2015

7、CONTENTS FOREWORD . 6 INTRODUCTION . 8 1 Scope 9 2 Normative references 9 3 Terms, definitions and abbreviations . 10 3.1 Terms and definitions 10 3.2 Abbreviations 12 4 Technical requirements . 14 4.1 General . 14 4.2 Procedures . 14 4.2.1 General . 14 4.2.2 Product discontinuance . 14 4.2.3 ESD pr

8、otection during manufacture . 14 4.2.4 Specification control 15 4.2.5 Traceability including anti-counterfeit measures 15 4.3 Product or process change notification (PCN) . 15 4.3.1 General . 15 4.3.2 Notification 15 4.3.3 Notification details . 15 4.3.4 Notifiable changes . 16 4.4 Shipment controls

9、 . 16 4.4.1 General . 16 4.4.2 Shipping container and date code marking 16 4.4.3 Date code remarking . 16 4.4.4 Inner container formation . 16 4.4.5 Date code age on delivery . 17 4.4.6 ESD marking . 17 4.4.7 MSL . 17 4.4.8 Lead-free marking . 17 4.4.9 Labels . 17 4.5 Electrical . 18 4.5.1 General .

10、 18 4.5.2 Electrical test . 18 4.5.3 Electrical parameter assessment . 18 4.5.4 SDRAM memories . 18 4.5.5 Logic families 19 4.5.6 Power MOSFETs . 19 4.5.7 Silicon rectifier diodes . 19 4.6 Mechanical . 19 4.6.1 General . 19 4.6.2 Device marking 19 4.6.3 Small packages . 19 4.6.4 Moisture sensitivity

11、 19 4.6.5 Robustness of hermetic seals 19 4.6.6 Termination finishes 20 4.7 Audit capability . 20 PD IEC/TS 62686-1:2015IEC TS 62686-1:2015 IEC 2015 3 4.7.1 General . 20 4.7.2 Internal quality audits 20 4.7.3 Subcontract manufacturing 20 4.8 Quality assurance . 21 4.8.1 General . 21 4.8.2 Quality sy

12、stem . 21 4.8.3 Sampling plans 21 4.8.4 Failure analysis support . 21 4.8.5 Outgoing quality 21 4.9 Supplier performance monitoring by the user 22 4.9.1 General . 22 4.9.2 Lot acceptance 22 4.9.3 Suspension of deliveries 23 4.9.4 Loss of approval 23 4.9.5 AQL figures . 23 4.9.6 100 % screening 23 4.

13、9.7 Termination determination . 23 4.10 Qualification 23 4.10.1 General . 23 4.10.2 Methodology 24 4.10.3 Test samples . 25 4.10.4 Qualification categories . 26 4.10.5 Maintenance of qualification standard 26 4.10.6 In-process test results . 26 4.10.7 Product monitor results 30 4.10.8 References 30

14、4.10.9 Qualification report 30 4.10.10 Archiving . 30 4.10.11 Qualification by similarity . 30 4.10.12 Similarity assessment 30 4.11 Reliability 31 4.11.1 General . 31 4.11.2 Operating reliability 31 4.11.3 Failure criteria . 31 4.11.4 Corrective action . 32 4.11.5 Warranty 32 4.11.6 Suspension of c

15、ertification . 32 4.11.7 Single event effects (SEE) . 32 4.12 Product monitor 32 4.12.1 General . 32 4.12.2 Monitor programme . 32 4.12.3 Problem notification . 33 4.12.4 Data reporting 33 4.12.5 Samples 33 4.12.6 Corrective action . 33 4.12.7 Product monitor results 33 4.12.8 Accumulated test data

16、. 33 4.13 Environmental, health and safety (EHS) 34 4.13.1 General . 34 PD IEC/TS 62686-1:2015 4 IEC TS 62686-1:2015 IEC 2015 4.13.2 EHS compliance 34 4.13.3 Device handling . 34 4.13.4 Device materials 34 4.14 Shipping containers 34 4.14.1 General . 34 4.14.2 ESD requirements . 34 4.14.3 Magazine r

17、euse . 36 4.14.4 Tubes 36 4.14.5 Trays . 36 4.14.6 Tape and reel 37 4.15 Compliance with internal standards . 37 Annex A (informative) Test code (TC) information 38 A.1 General . 38 A.2 TC1 Autoclave (AC) . 38 A.3 TC2 Bond strength, internal (BS) . 38 A.4 TC3 Die shear strength (DS) 38 A.5 TC4 Elect

18、romigration (EM) . 38 A.6 TC5 Electrostatic discharge (ESD) . 39 A.7 TC6 Electrical test (ET) 39 A.8 TC7 Electrical distributions (ED) 39 A.9 TC8 Flammability (FL) 40 A.10 TC9 Hot carrier injection (HCI) . 40 A.11 TC10 Hermeticity (HE) . 40 A.12 TC11 High temperature bake (HTB) . 40 A.13 TC12 High t

19、emperature blocking bias (HTBB) 41 A.14 TC13 High temperature gate bias (HTGB) 41 A.15 TC14 High temperature reverse bias (HTRB) . 41 A.16 TC15 High temperature operating life (HTOL) 41 A.16.1 General . 41 A.16.2 Qualification conditions 41 A.16.3 Test results assessment 41 A.16.4 Temperature accele

20、ration factor 42 A.16.5 Supply voltage acceleration factor . 42 A.17 TC16 Latch-up (LU) . 43 A.18 TC17 Lead integrity (LI) . 43 A.19 TC18 Lid torque (LT) 43 A.20 TC19 Mechanical sequence (MS) . 43 A.20.1 General . 43 A.20.2 Constant acceleration 44 A.20.3 Vibration (variable frequency) 44 A.20.4 Mec

21、hanical shock 44 A.21 TC20 Marking permanency (MP) 44 A.22 TC21 Non-volatile memory operating life (NVL) 44 A.23 TC22 Time dependent dielectric breakdown (oxide integrity) (OI) . 45 A.24 TC23 Package dimensions (PD) . 45 A.25 TC24 Power cycling (PTC) . 45 A.26 TC25 Resistance to solder heat (RSH) .

22、45 A.27 TC26 Solder preconditioning (PC) 45 A.28 TC27 Solderability (SD) . 46 PD IEC/TS 62686-1:2015IEC TS 62686-1:2015 IEC 2015 5 A.29 TC28 Soft error rate (SER). 46 A.30 TC29 Steady state operating life (SSOL) 47 A.31 TC30 Temperature cycling (TC) . 47 A.32 TC31 Temperature humidity reverse bias (

23、THRB) 47 A.33 TC32 Temperature humidity bias (THB or HAST) . 48 A.34 TC33 Terminal strength (TS) 48 A.35 TC34 Thermal resistance (thermal impedance) (TR) 48 A.36 TC35 visual inspection (VI) 48 A.36.1 TC35a External visual inspection 48 A.36.2 TC35b Internal visual inspection . 49 A.37 TC36 Water vap

24、our content, internal (WV) . 49 A.38 TC37 X-ray inspection (XR) . 50 A.39 TC38 Moisture sensitivity level (MSL) 50 A.40 TC39 Ball shear test (BST) 50 A.41 TC40 Negative bias temperature instability (NBTI) . 50 A.42 TC41 Accelerated tin whisker test 50 Annex B (informative) Cross-reference to STACK S

25、pecification S/0001 revision 14 . 51 Bibliography 58 Table 1 Label requirements 18 Table 2 Internal quality audit requirements. 20 Table 3 Outgoing quality 22 Table 4 Incoming test . 23 Table 5 Technology/family qualification and device qualification 27 Table 6 Product monitor tests 34 Table A.1 Con

26、ditions of the DC over voltage stress method of JP001.01 or IEC 62416 test 40 Table A.2 Examples of temperature acceleration factors 42 Table A.3 Dip and look test references. 46 Table A.4 Parameter values for consideration 46 Table A.5 Test conditions. 47 Table A.6 Test methods . 48 PD IEC/TS 62686

27、-1:2015 6 IEC TS 62686-1:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PROCESS MANAGEMENT FOR AVIONICS ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS Part 1: General requirements for high reliability integrated circuits and discrete semiconductors F

28、OREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the

29、electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to

30、 technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International

31、 Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each tec

32、hnical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Pub

33、lications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their na

34、tional and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment s

35、ervices and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, s

36、ervants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the public

37、ation, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibil

38、ity that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical commi

39、ttee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immedi

40、ate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. PD IEC/TS 62686-1:2015IEC TS 62686-1:2015 IEC 2015 7 IEC TS 62686-1, which is a Techn

41、ical Specification, has been prepared by IEC technical committee 107: Process management for avionics. This second edition cancels and replaces the first edition, published in 2012. This edition constitutes a technical revision. This edition includes the following significant technical changes with

42、respect to the previous edition: a) adoption and modification of STACK Specification S/0001 revision 14 notice 3, General requirements for integrated circuits and discrete semiconductors; b) update of IEC semiconductor test methods; c) update of JEDEC semiconductor test methods; including addition o

43、f JEP148A, based on the Physics of Failure Risk and Opportunity assessment; d) update of Annex A with additional JEDEC and IEC test information; e) revision of lead-free termination finish requirements. The text of this technical specification is based on the following documents: Enquiry draft Repor

44、t on voting 107/248/DTS 107/259/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the I

45、EC 62686 series, published under the general title Process management for avionics Electronic components for aerospace, defence and high performance (ADHP) applications, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the s

46、tability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this p

47、ublication may be issued at a later date. PD IEC/TS 62686-1:2015 8 IEC TS 62686-1:2015 IEC 2015 INTRODUCTION This part of IEC 62686 includes all the requirements of STACK Specification S/0001 revision 14 notice 3 and contains revisions for alternative IEC qualification test methods and additional te

48、st information. This Technical Specification complements IEC TS 62564-1 which is used for ADHP applications when additional manufacturers data is required beyond the publicly available manufacturer published data sheets (e.g. when additional thermal performance data is required for thermally challen

49、ging applications or when additional verification data are needed, for example to comply with the requirements of RTCA DO-254/EUROCAE ED-80 for complex components for flight critical applications, etc.). This Technical Specification can also be used to comply with the typical qualification requirements of IEC TS 62564-1. Further guidance is given in IEC TS 62239-1. NOTE With the adoption of the