AIR FORCE MIL-HDBK-419 A VOL 2-1987 GROUNDING BONDING AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES APPLICATIONS《电子设备的接地、搭接和屏蔽和设施应用》.pdf

1、MIL-HDBK-417A VOL 2 EM 7777770 003773b 7 E /3-OP-b/ MIL-HDBK-419A 29 DECEMBER 1989 SUPERSEDING MIL-HDBK-419 21 JANUARY1982 MILITARY HANDBOOK GROUNDING, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES VOLUME II OF 2 VOLUMES APPLICATIONS AMSC NIA EMCS/SLHC/TCTS DISTRIBUTION STATEMENT A

2、. Approved for public release; distribution is unlimited /THIS DOCUMENT CONTAINS ayyA PAGES. y b Licensed by Information Handling ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEPARTMENT OF DEFENSE WASHINGTON DC 20301 MIL-HDBK-419A GROUNDIN

3、G, BONDING, AND SHIELDING FOR ELECTRONIC EQUIPMENTS AND FACILITIES 1. This standardization handbook was developed by the Department of Defense in accordance with established procedure. 2. This publication was approved on 29 December 1987 for printing and inclusion in the military standardization han

4、dbook series. Vertical lines and asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. 3. This document provides basic and application information on grounding, bonding, and shielding practices recommended for electron

5、ic equipment. It will provide valuable information and guidance to personnel concerned with the preparation of specifications and the procurement of electrical and electronic equipment for the Defense Communications System. The handbook is not intended to be referenced in purchase specifications exc

6、ept for informational purposes, nor shall it supersede any specification requirements. 4. Every effort has been made to reflect the latest information on the interrelation of considerations of electrochemistry, metallurgy, electromagnetics, and atmospheric physics. It is the intent to review this ha

7、ndbook periodically to insure its completeness and currency. Users of this document are encouraged to report any errors discovered and any recommendations for changes or inclusions to: Commander, 1842 EEGDEITE, Scott AFB IL 62225-6348. 5. Copies of Federal and Military Standards, Specifications and

8、associated documents (including this handbook) listed in the Department of Defense Index of Specifications and Standards (DODISS) should be obtained from the DOD Single Stock Point: Commanding Officer, Naval Publications and Forms Center, 5801 Tabor Avenue, Philadelphia PA 19120. Single copies may b

9、e obtained on an emergency basis by calling (AUTOVON) 442-3321 or Area Code (215)-697-3321. Copies of industry association documents should be obtained from the sponsor. Copies of all other listed documents should be obtained from the contracting activity or as directed by the contracting officer. L

10、icensed by Information Handling ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-RIL-HDBK-4LSA VOL 2 ER 9799970 0037738 om MIL-HDRK-419A PREFACE This volume is one of a two-volume series which sets forth the grounding, bonding, and shielding a

11、pplications for communications electronics (C-E) equipments and facilities. Grounding, bonding, and shielding are complex subjects about which in the past there has existed a good deal of misunderstanding. The subjects themselves are interrelated and involve considerations of a wide range of topics

12、from electrochemistry and metallurgy to electromagnetic field theory and atmospheric physics. These two volumes reduce these varied considerations into a usable set of principles and practices which can be used by all concerned with, and responsible for, the safety and effective,operation of complex

13、 C-E systems. Where possible, the principles are reduced to specific steps. Because of the large number of interrelated factors, specific steps cannot be set forth for every possible situation. However, once the requirements and constraints of a given situation are defined, the appropriate steps for

14、 solution of the problem can be formulated utilizing the principles set forth. Both volumes (Volume I, Basic Theory and Volume II, Applications) implement the Grounding, Bonding, and Shielding requirements of MIL-STD-188-124A which is mandatory for use within the Department of Defense. The purpose o

15、f this standard is to ensure the optimum performance of ground-based telecommunications equipment by reducing noise and providing adequate protection against power system faults and lightning strikes. This handbook emphasizes the necessity for including considerations of grounding, bonding, and shie

16、lding in all phases of design, construction, operation, and maintenance of electronic equipment and facilities. Volume I, Basic Theory, develops the principles of personnel protection, fault protection, lightning protection, interference reduction, and EMP protection for C-E facilities. In addition,

17、 the basic theories of earth connections, signal grounding, electromagnetic shielding, and electrical bonding are presented, The subjects are not covered independently, rather they are considered from the standpoint of how they influence the design of the earth electrode subsystem of a facility, the

18、 selection of ground reference networks for equipments and structures, shielding requirements, facility and equipment bonding practices, etc. Volume I also provides the basic background of theory and principles that explain the technical basis for the recommended practices and procedures; illustrate

19、s the necessity for care and thoroughness in implementation of grounding, bonding, and shielding; and provides supplemental information to assist in the solution of those problems and situations not specifically addressed. In Volume II, qpplications, the principles and theories, including RED/BLACK

20、protection, are reduced to the practical steps and procedures which are to be followed in structural and facility development, electronic engineering, and in equipment development. These applications should assure personnel, equipment and structural safety, minimize electromagnetic interference (EMI

21、) .problems in the final operating system; and minimize susceptibility to and generation of undesirable emanations. The emphasis in Volume11 goes beyond development to assembly and construction, to installation and checkout, and to maintenance for long term use. Four appendices are provided as commo

22、n elements in both volumes. Appendix A is a glossary of selected words and terms as they are used herein. If not defined in the glossary, usage is in accordance with Federal Standard 1037, Glossary of Telecommunication Terms. Appendix B is a supplemental bibliography containing selected references i

23、ntended to supply the user with additional material. Appendix C contains the table of contents for the other volume. Appendix D contains the index for the two-volume set. Licensed by Information Handling ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license fro

24、m IHS-,-,-Paragraph Page 1.1 INTRODUCTION . 1-1 1.2 EARTH ELECTRODE SUBSYSTEM . 1-2 1.2.1 Determination of Site Parameters . 1-2 1.2.1.1 Soil Resistivity 1-2 1.2.1.2 Geological Effects 1-5 1.2.1.3 Physical Features . 1-5 1.2.1.4 Local Climate 1-5 1.2.2 Design Procedure 1-6 1.2.2.1 Selection of Elect

25、rode Configuration 1-6 1.2.2.2 Calculation of Earth Resistance . 1-9 1.2.2.3 Alternate Configurations 1-9 1.2.3 Design Guidelines 1-14 1.2.4 Installation Practices . 1-22 1.3 LIGHTNING PROTECTION FOR STRUCTURES 1-23 1.3.1 Principles of Protection . 1-23 1.3.2 Integral Protection System 1-23 1.3.2.1

26、AirTerminals 1-24 1.3.2.1.1 SizeandMaterials . 1-24 1.3.2.1.2 Location 1-24 1.3.2.2 GroundingConductors . 1-33 1.3.2.2.1 Roof Conductors 1-33 1.3.2.2.2 Down Conductors 1-37 1.3.2.3 Fasteners . 1-39 1.3.3 Separately Mounted Protection Systems 1-40 1.3.3.1 Mast Type 1-40 1.3.3.2 Overhead Ground Wire T

27、ype 1-41 1.3.3.3 Waveguide Installation and Grounding 1-42 1.3.3.4 Cable Installation and Grounding 1-49 1.3.3.5 LightningGenerated Transient Surge Protection . 1-49 1.3.3.5.1 Transient Source and Equipment Damage 1-49 1.3.3.5.2 Minimizing Damage . 1-50 1.3.3.5.3 Susceptible Components . 1-50 1.3.3.

28、5.4 Frequency of Transient Occurrence 1-51 1.3.3.5.5 Transient Definition. AC Service Conductors 1-51 1.3.3.5.6 Methods for Transient Protection on AC Service Conductors 1-56 1.3.3.5.7 Use of Ferrous Metal Conduit. 1-56 1.3.3.5.8 Use of Overhead Guard Wires . 1-56 i Licensed by Information Handling

29、ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-419A TABLE OF CONTENTS (Continued) CHAPTER 1 . NEW FACILITIES DESIGN CRITERIA Paragraph 1.3.3.5.9 Protection of Underground Cables . 1-57 1.3.3.5.10 Buried Guard Wire . 1-57 1.3.3.5.11

30、Secondary AC Surge Arrester . 1-59 1.3.3.5.12 Surge Arrester Installation 1-59 1.3.3.5.13 Operating Characteristics of Surge Arresters 1-60 1.3.3.5.14 Desirable Operating Characteristics for Transient Suppressors 1-67 1.3.3.5.15 Characteristics of Different Types of Surge Arresters 1-67 1.3.3.5.16 T

31、ransient Protection for Externally Exposed Equipment Lines . 1-73 1.3.3.5.17 Frequency of Transient Occurrence 1-73 1.3.3.5.18 Amplitudes and Waveforms of Occurring Transients . 1-73 1.3.3.5.19 Equipment Withstand Levels . 1-74 1.3.3.5.20 Protection Methods Against Transients . 1-74 1.3.3.5.21 Enclo

32、sing Cable Runs in Ferrous Metal Conduit . 1-74 1e3.3.5.22 Transient Suppression 1-75 1.3.3.5.23 Types of Available Transient Suppression 1-77 1.3.3.5.24 Operating Characteristics of Transient Suppressors . 1-77 1.3.3.5.25 Transient Suppressor Packaging Design . 1-78 1.3.3.5.26 Coaxial Cable Shield

33、Connection Through an Entrance Plate . 1-78 1.3.3.5.27 Grounding of Unused Wires 1-78 1.3.3.5.28 1.3.3.5.29 Equipment-LevelTransient Suppression 1-79 1.3.3.6 Lightning Generated Transient Protection Evaluation . 1-79 1.3.3.7 Transient Protection . 1-80 1.3.3.7.1 Protection Requirement . 1-80 1.3.3.7

34、.2 Transient Definition . 1-81 1.3.3.7.3 Determination of Equipment Damage (Withstand) Levels . 1-82 1.3.3.7.4 Determination of Need for Transient Protection . 1-83 1.3.3.7.5 Minimizing Transient Damage 1-83 1.3-3.7.6 AC Power Input . 1-84 1.3.3.7.7 Power Supply Transient Suppression 1-89 1.3.3.7.8

35、Landline Transient Suppression 1-89 1.3.3.8 Corrosion Control 1-98 1.3.3.9 Joints . ; 1-99 1.3.3.10 Physical Protection 1-99 1.4 FAULT PROTECTIVE SUBSYSTEM . 1-99 1.4.1 Purpose 1-99 1.4.2 Equipment Fault Protection Subsystem Composition . 1-100 ii Licensed by Information Handling ServicesProvided by

36、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-419A TABLE OF CONTENTS (Continued) CHAPTER 1 . NEW FACILITIES . DESIGN CRITERIA 0 0 : Paragraph Page 1.4.3 Configuration of the Equipment Fault Protection Subsystem 1-100 1.4.4 Pipes and Tubes . 1-102 1.4

37、.5 Electrical Supporting Structures . 1-102 1.4.5.1 Metal Conduit . 1-103 1.4.5.2 CableTrays . 1-103 1.4.5.3 Enclosures . 1-103 1.4.5.4 Cable Armor . 1-103 1.4.5.5 Rotating Machinery 1-103 1.4.6 Power Distribution Systems 1-104 . . . : 1.4.7 Standby AC Generators 1-104 1.4.8 Equipment Fault Protecti

38、on Subsystems for Transportable Equipment . 1-104 1.4.9 MIL-STD-188-124A and NEC Compliance Evaluation. 1-105 1.4.9.1 Measurements 1-105 1.4.9.2 MIL-STD-188-124A and NEC Compliance Inspection . 1-105 1.4.9.3 . Correction of Deficiencies 1-111 1.5 SIGNAL REFERENCE SUBSYSTEM FOR NEW FACILITIES 1-113 1

39、.5.1 Higher Frequency Network 1-113 1.5.1.1 Multipoint Ground System 1-118 1.5.1.1.1 Types of Equipotential Planes . 1-120 1.5.1.1.1.1 Copper Grid Embedded in Concrete 1-120 1.5.1.1.1.2 Equipotential Plane Under Floor Tile or .Carpet 1-120 _- . 1.5.1.1.1.3 Overhead Equipotential Plane 1-120 1.5.1.1.

40、1.4 Raised (Computer) Flooring 1-120 1.5.1.1.1.4.1 Bolted-Grid (Stringer) or Rigid Grid System 1-125 1.5.1.1.1.4.2 Drop-In or Removable Grid System . . i 1-131 1.5.1.1.1.4.3 Free-Standing. Pedestal-Only or Stringerless System . . 1-131 1.5.1.1.1.5 Ground Risers 1-131 1.5.1.1.1.6 Equipment Cabinet Gr

41、ounding . 1-131 1.5.2 Lower Frequency Signal Reference Network . 1-131 1.6 GROUNDING PHILOSOPHY FOR EQUIPMENTS PROCESSING NATIONAL SECURITY RELATED INFORMATION (RED/BLACK EQUIPMENTS) 1-134 1.7 BONDING PRACTICES 1-140 1.7.1 Application Guidelines . 1-140 1.7.2 SurfacePreparation . 1-142 1.7.3 Bond Pr

42、otection Code 1-143 1.7.3.1 Jumper Fasteners . 1-147 1.7.4 TypicalBonds . 1-148 iii Licensed by Information Handling ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-“ MIL-HDBK-qL9A VOL 2 EM W 9999970 0037742 2 MIL-HDBK-419A TABLE OF CONTENTS

43、(Continued) CHAPTER 1 . NEW FACILITIES DESIGN CRITERIA a Paragraph Page 1.7.4.1 CableTrays . 1-148 1,7.4.2 Tubing and Conduit 1-149 1.7.4.3 Other Examples. . 1-149 1.8 SHIBLDING . 1-154 1.8.1 Establishing Requirements 1-154 1.8.2 Design Guidelines 1-159 1.8.3 Selection of Materials 1-160 1.8.4 Const

44、ruction Guidelines . 1-162 1.9 COMMON-MODE NOISE AND INSTRUMENTATION 1-164 1.9.1 Design Practices 1-171 1.9.2 Instrumentation Considerations 1-172 1.10 EMP PROTECTION 1-172 1.10.1 Earth Connection 1-172 140.2 EMP Shield Applications 1-173 1.10.3 EMP Bonding Practices . 1-173 1.10.4 Construction Guid

45、elines . 1-176 1.11 MILITARY MOBILE FACILITIES 1-177 1.11.1 General Tactical Grounding Requirements . 1-177 1.11.1.1 Facility Ground System 1-177 a 1.11.1.1.1 EarthGround 1-177 1.11.1.1.1.1 General Earth Electrode Subsystem Requirements . 1-177 1.11.1.1.1.2 Earth Electrdde Subsystem Types 1-177 1.11

46、.1.1.1.3 Soil Resistance 1-178 1.11.1.1.1.4 Ground Rod Resistance 1-178 1.11.1.1.1.5 Ground Resistance Shells 1-178 1.11.1.1.2 PowerGround . 1-178 1.11.1.1.2.1 Three-phase Power Distribution System 1-178 1.11.1.1.2.2 Single-phase Power Distribution System . 1-179 1.11.1.1.2.3 DC Power System (2-Wire

47、) . 1-179 1.11.1.1.3 Lightning/EMP Protection Subsystem . 1-179 1.11.1.1.3.1 Air Terminals . 1-179 1.11.1.1.3.2 Terminal Protection Devices 1-182 1.11.1.1.4 Signal Reference Subsystem . 1-182 1.11.1.1.5 Fault Protection Subsystem . 1-182 1.11.1.2 Measuring Ground Resistance inTactical Environments 1

48、-182 1.11.1.3 Reducing Ground Resistance in Tactical Environments . 1-182 1.11.1.3.1 Existing Facilities . 1-182 iv Licensed by Information Handling ServicesProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-L MIL-HDBK-419A e TABLE OF CONTENTS (Continue

49、d) CHAPTER 1 . NEW FACILITIES DESIGN CRITERIA Paragraph Page 1.11.1.3.2 Multiple Electrode System 1-185 1.11.1.3.3 Earth Electrode Subsystem 1-185 1.11.1.3.4 Chemical Treatment . 1-185 1.11.2 Detailed Tactical Grounding Requirements 1-185 1.11.2.1 Introduction . 1-185 1.11.2.1.1 Training 1-186 1.11.2.1.2 Testing 1-186 . 1.11.2.2 Stand-AloneEquipment 1-186 1.11.2.2.1 General Description . 1-186 1.11.2.2.2 Grounding Procedur