1、STD-EIA b77-ENGL 1777 323ibOO 05808b0 TLb = ANSI/ EIA-69 9-19 97 Approved: January 14, 1997 EIA STANDARD Test Method for the Visual Inspection of Quartz Crystal Resonator Blanks EIA-699 FEBRUARY 1997 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT NOTICE EIA Engineering Standards and Public
2、ations are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular ne
3、ed. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EIA fiom manufacturing or selmg products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those o
4、ther than ELA members, whether the standard is to be used either domestically or internationally. Standards and hiblications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to any patent owner, no
5、r does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the
6、 EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or ail applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and hdth practices and to determine t
7、he applicability of regulatory Iimitations before its use. (From Standards Proposal No. 3622, fomulated under the cognizance of the EIA P-1 1 Piezoelectric Devices Committee.) Published by OELECTRONIC INDUSTRIES ASSOCIATION 1997 Engineering Department 2500 Wilson Boulevard Arlington, VA 22201 PRICE:
8、 Please refer to the current Catalog of EM, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS or cal Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) Ail rights reserved Printed in U.S.A. STD*EIA b77-ENGL 1777 323qb00 05808b2 877 EIA-699 TEST METHOD FOR
9、THE VISUAL INSPECTION OF QUARTZ CRYSTAL RESONATOR BLANKS c0mNl-s Clause 1 Scope 2 Normative reference 3 Recommended procedures and methods 4 Microscopic evaluation of samples 4 1 EIA-699 This page lefi blank. 11 EI A-699 Page 1 1 Scope This document provides nomenclature, methods, and criteria for c
10、haracterizing acceptable quartz resonator blanks. Its major objective is to aid in the evaluation of the crystal blank through visual inspection of quartz crystal resonator blanks for the purpose of contributing to the complete evaluation of a product. 2 Normative references The following standards
11、contain provisions that, through reference in this text, constitute provisions of this standard. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this standard are encouraged to investigate the possibility of app
12、lying the most recent editions of the standards indicated below. NONE - 2.1 Technical normative elements 2.1.1 Definition For the purpose of this standard, the following definitions apply. 2.1.2 Plated quartz resonator crystal blank A piezoelectric quartz material that has been physically andor chem
13、ically modified to a specified dimension and surface finish and plated with a conductive metal layer or layers and is intended to be placed into an electrical circuit for the purpose of physically vibrating at a specific frequency. 2.1.3 Edge chip A chip that exhibits total removal of quartz through
14、 the thickness of the crystal blank and is located at the periphery of the quartz blank. Chips whose greatest lateral dimension is less than or equal to 0.05 mm (0,002 in) are not considered chips. 2.1.4 Surface chip A chip that intersects the edge and one of the major surfaces of the crystal blank.
15、 Chips whose greatest lateral dimension is less than or equal to 0.05 mm (0.002 in) are not considered chips. 2.1.5 Fracture A crack or fissure in the quartz blank indicating breakage partially or totally through the thickness of the crystal blank. STD-EIA b-ENGL 1997 m 323Lib00 05808b5 5T8 EIA-699
16、Page 2 2.1.6 Quartz scratch A cut in the surface of the quartz blank in which the quartz has been visibly removed. A major scratch can readily be seen with the naked eye fiom all angles of incident lighting. Scratches that can only be seen by specific angles of light with the naked eye are inherent
17、in the process of preparing the major surfaces by abrasion and are considered minor scratches. 2.1.7 Peeled plating Metallization that is visibly lifted fi-om the quartz surface. 2.1.8 Scratched plating A break or fissure in the metallization that extends through to the quartz. 2.1.9 Mounting scratc
18、h A scratch that occurs because of the use of springs, clips, posts or some other type of crystal mount structure for the purpose of fiequency adjustment processing or mounting of the plated crystal blank. 2.1.1 O Plating alignment The centering andor location of the metallization with respect to th
19、e quartz blank. 2.1.1 1 Plating registration, side-to-side The side-to-side metallization alignment. 2.1.12 Plating registration, same side The alignment of multiple metallization layers on the same side of the quartz resonator. 2.1.13 Voids Areas within the metallized region of the crystal blank th
20、at are greater than 0.02 mm (0.001 in) and lack metallization. 2.1.14 Contamination Foreign material visible to the naked eye on the crystal resonator blank surface. Plating build up or discoloration around the blank mount structure is not considered contamination. EIA-699 Page 3 2.1.15 Electrode Th
21、e actual metallization pattern found on the completed quartz resonator blank. The electrode may consist of multiple layers of material and may be of any shape or design. 2.1.16 Electrode flag The portion of the electrode that extends from the major active area to the mounting structure or electrical
22、 connection region. Sometimes known as the tab or flag area. 2.1.17 Blank flats Areas on the periphery of the blank that have been ground or otherwise formed toward the center of the blank as a means of either providing an angle orientation reference or minimizing the dimensions of the blank as a me
23、ans of optimizing crystal blank design. Flats are also known as reference marks. 2.1.18 Etch channels Tunnels or holes that extend into or through the quartz blank. They are formed during deep etching techniques. 2.1. 19 Baseplating A method in which the majority of the metallization is added to the
24、 crystal blank. 2.1.20 Final plating The method in which a metallized crystal blank is adjusted to the final desired frequency. 3 Recommended procedures and methods 3.1 Visual Inspection Visual inspection of the quartz crystal resonator blanks is to be done using a 1OX microscope with an illuminatio
25、n source. Bifrcated halogen lights with adjustable light settings provide excellent lighting conditions for viewing the crystal blanks and also provide flexibility in lighting angles for the examination. Other light sources are to be considered acceptable, with fluorescent lighting being the least d
26、esirable. Note - Magnification enhancement of up to 30X may be used for measuring inspection criteria. EIA-699 Page 4 4 Microscope evaluation of samples 4.1 Defect criteria Unless noted, the following structural features will be considered as defects and rejectable when observed in the course of a 1
27、OX microscopic examination of the plated quartz crystal blanks. Note - Edge imperfections of 0.05 mm (0.002 in) or less are not to be considered as a basis for rejection in any case. These are typical of blank processing during the various blank preparation procedures. 4.1.1 Edge chips a) Edge chips
28、 that extend into the major surface of the blank by more than O. 13 mm (0.005 in) or 2 % of the blank diameter, whichever is greater, on blank diameters of 7.62 mm (0.300 in) or less, and 0.25 mm (0.010 in) or 2 % of the blank diameter, whichever is greater, on blank diameters exceeding 7.62 mm (0.3
29、00 in), b) Excessive edge chipping in which more than 10 % of the crystal blank circumference has been chipped away during either processing or handling of the crystal blanks. 4.1.2 Surface chip Surface chips that extend into the major surface of the blank by O. 13 mm (0.005 in) or 2 % of the blank
30、diameter, whichever is greater, on blank diameters of 7.62 mm (0.300 in) or less, and 0.25 mm (0.010 in) or 2 % ofthe blank diameter, whichever is greater, on blank diameters exceeding 7.62 mm (0.300 in). 4.1.3 Fractures No fractures are allowed. Note - Fractures either along the edge or in the blan
31、k can be seen more readily ifthe parts are edge lit using a bifurcated halogen light. Fractures wiil appear to be bright lines in the blank. Pits and etch channels in the surface of the polished and deeply etched crystal blanks may also be illuminated. However, defect criteria are not established by
32、 this document. 4.1.4 Quartz scratches Only major scratches seen readily by the naked eye and fiom ali angles of incident lighting will be considered means for rejection. Minor scratches are dowable and should be considered typical of crystal manufacturing processing techniques. EI A-699 Page 5 4.1.
33、5 Peeled plating Parts with peeled plating are not allowable. 4.1.6 Scratched plating Plating scratches that are visible with the naked eye are cause for rejection. Scratches of length less than 20 % of the blank electrode or flag diameter or width are allowable. Parts exhibiting more than 10 platin
34、g scratches as defined above shall be cause for rejection. 4.1.7 Mounting scratches Plating scratches occurring in the mount area are allowable as long as the scratches do not exceed 30 % of the width of the flag area prior to cementing and show 20 % or less of the width of the flag area after cemen
35、ting of the part to the mount structure. 4.1.8 Baseplating alignment Plating alignment must be within 2 % of the greatest measured crystal blank diameter. 4.1.9 Plating registration, side-to-side Plating registration, side- to- side, must be within 2 % of the greatest measured crystal blank diameter
36、. Note - In the case where electrode diameters from side to side are of unequal size for the purpose of maintaining quartz crystal blank electrical parameters, 4.1.8 will take precedence. 4.1.10 Plating registration, same side Plating registration, same side, shall be within 0.13 mm (0.005 in) or 2
37、% of the crystal blank diameter, whichever is greater. 4.1.11 Voids Four hundred voids per square inch are allowed with sizes greater than 0.02 mm (0.001 in) and less than or equal to 0.08 mm (0.003 in), Voids that less than 0.02 mm (0.001 in) are not to be considered as voids. Table 1 is provided a
38、s a guide for inspection criteria. The actual allowable number of voids is to be based on the actual number of square inches in the electrode area. STD-EIA b77-ENGL 1777 m 323Lib00 05808b7 1V3 W EIA-699 Page 6 Table 1 - Inspection criteria Electrode diameter (round) Number of voids allowed 5 I 3.51
39、mm (0.137in) I 10 4.75 mm (O. 186 in) 15 5.73 mm (0.225 in) 20 6.56 mm (0.258 in) 1 Area (nonround electrodes) 9.67 mm (0.0149 inn 17.74 mm2(0.0274 in2) 25.80 mm2(0.0399 in3 I 33.86 mm (0.0524 in) 4.1.12 Contamination Contamination that consists of any fibrous or particulate matter in excess of 0.08
40、 mm (0.003 in) in diameter that cannot be removed during normal processing of the device shall be cause for rejection unless the particulate matter can be suitably removed from the device without damage by means of dry antistatic nitrogen guns or similar devices. Discoloration due to plating processes either wet or dry are not to be considered contamination. - STD-EIA b99-ENGL 1997 3234600 0580870 965 S c
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