ANSI IEEE 575-2014 Guide for Bonding Shields and Sheaths of Single-Conductor Power Cables Rated 5 kV through 500 kV.pdf

1、 IEEE Guide for Bonding Shields and Sheaths of Single-Conductor Power Cables Rated 5 kV through 500 kV Sponsored by the Insulated Conductors Committee IEEE 3 Park Avenue New York, NY 10016-5997 USA IEEE Power and Energy Society IEEE Std 575-2014 (Revision of IEEE Std 575-1988) IEEE Std 575-2014 (Rev

2、ision of IEEE Std 575-1988) IEEE Guide for Bonding Shields and Sheaths of Single-Conductor Power Cables Rated 5 kV through 500 kV Sponsor Insulated Conductors Committee of the IEEE Power and Energy Society Approved 12 June 2014 IEEE-SA Standards Board Abstract: The most common shield/sheath-bonding

3、systems now in use on medium through extra high-voltage (5 kV to 500 kV) single-conductor shielded power cables and the methods of calculating the corresponding shield/sheath voltages and currents, when the cables are operated as part of a three-phase system, with the neutral grounded directly or th

4、rough an impedance, are described in this guide. Keywords: bonding, cross bonding, distribution cable, grounding, high-voltage cable, IEEE 575, medium-voltage cable, power cable, sheath, sheath bonding, sheath voltage limiters, shield, shield bonding, shield voltage limiters, single-point bonding, s

5、pecial bonding, SVL, transmission cable The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 10016-5997, USA Copyright 2014 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 18 September 2014. Printed in the United States

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34、of any patent rights, and the risk of infringement of such rights, is entirely their own responsibility. Further information may be obtained from the IEEE Standards Association. Participants At the time this IEEE guide was completed, the C2 Cable System Bonding Working Group had the following member

35、ship: Michael D. Buckweitz, Chair Thomas C. Champion, Vice Chair Torben Aabo Richard W. Allen, Jr. Pierre Argaut Ray Awad Earle C. Bascom, III Mohamed Chaaban John H. Cooper Dennis F. DeCosta Swapan K. Dey Anthony Ernst William G. Hansen Wolfgang B. Haverkamp Dennis E. Johnson Arthur J. Kroese Frede

36、ric Lesur Allen MacPhail Neal K. Parker Ray E. Saccany William D. Wilkens Jay A. Williams The following members of the individual balloting committee voted on this guide. Balloters may have voted for approval, disapproval, or abstention. Saleman Alibhay Senthil Kumar Asok Kumar Peter Balma Thomas Ba

37、rnes G. Bartok Earle E. Bascom, III Wallace Binder William Bloethe Kenneth Bow Gustavo Brunello William Bush Mark Bushnell William Byrd John Cancelosi Paul Cardinal Weijen Chen Robert Christman Luis Coronado Frank Di Guglielmo Gary Donner Randall Dotson Dana Dufield Donald Dunn Gary Engmann Cliff Er

38、ven Dan Evans Jorge Fernandez Daher Rabiz Foda David Garrett David Gilmer Edwin Goodwin Todd Goyette Randall Groves Richard Harp Timothy Hayden Jeffrey Helzer Steven Hensley Lee Herron Gary Heuston Lauri Hiivala Robert Hoerauf Edward Jankowich Dennis E. Johnson A. Jones Gael Kennedy Yuri Khersonsky

39、Robert Kluge Robert Konnik Jim Kulchisky Saumen Kundu Chung-Yiu Lam Michael Lauxman Greg Luri Glenn Luzzi Arturo Maldonado Michael Maytum William McBride Gary Michel Daleep Mohla Rachel Mosier Jerry Murphy Arun Narang Dennis Neitzel Arthur Neubauer Michael Newman Joe Nims Gary Nissen Lorraine Padden

40、 Bansi Patel S. Patel Percy Pool Moises Ramos Robert Resuali Michael Roberts Lei Rong Thomas Rozek Bartien Sayogo Dennis Schlender Hamid Sharifnia Devki Sharma Gil Shultz Michael Smalley Jerry Smith John Spare Nagu Srinivas Gregory Stano Ryan Stargel Gary Stoedter Peter Sutherland David Tepen Peter

41、Tirinzoni James Tomaseski John Vergis Mark Walton Daniel Ward Lee Welch Yingli Wen Kenneth White Jonathan Woodworth Jian Yu Dawn Zhao Tiebin Zhao J. Zimnoch Copyright 2014 IEEE. All rights reserved. vi When the IEEE-SA Standards Board approved this guide on 12 June 2014, it had the following members

42、hip: John Kulick, Chair Jon Walter Rosdahl, Vice Chair Richard H. Hulett, Past Chair Konstantinos Karachalios, Secretary Peter Balma Farooq Bari Ted Burse Clint Chaplain Stephen Dukes Jean-Phillippe Faure Gary Hoffman Michael Janezic Jeffrey Katz Joseph L. Koepfinger* David J. Law Hung Ling Oleg Log

43、vinov Ted Olsen Glenn Parsons Ron Peterson Adrian Stephens Peter Sutherland Yatin Trivedi Phil Winston Don Wright Yu Yuan *Member Emeritus Also included are the following nonvoting IEEE-SA Standards Board liaisons: Richard DeBlasio, DOE Representative Michael Janezic, NIST Representative Don Messina

44、 IEEE-SA Standards Technical Community Malia Zaman IEEE-SA Standards Technical Community Copyright 2014 IEEE. All rights reserved. vii Introduction This introduction is not part of IEEE Std 575-2014, IEEE Guide for Bonding Shields and Sheaths of Single-Conductor Power Cables Rated 5 kV through 500 k

45、V. This document is a revision of IEEE 575-1988, which had been reaffirmed multiple times without change in years past. The current revision changes the document title to more appropriately reflect the intent of the guide. Most clauses of the guide were revised and updated to better clarify recommen

46、dations and procedures. Advances in computer technology now allow many of the equations to be programmed and solved rapidly using software that can analyze the corresponding circuit configuration and make recommendations for application of specialized bonding. Considerations for shield/sheath optimi

47、zation have been included in Clause 5. A major addition is Annex F, which provides new information on current and voltage distribution on cable shields/sheaths in situations involving installations with multiple cables per phase. Copyright 2014 IEEE. All rights reserved. viii Contents 1. Overview 1

48、1.1 Scope . 1 1.2 Purpose 2 2. Normative references 2 3. Definitions 2 3.1 Special terms 5 4. Background 5 5. Shield optimization . 6 6. Special bonding techniques 7 6.1 Design 9 6.2 Safety considerations for specially bonded cable systems . 10 6.3 Single-point bonding . 10 6.4 Impedance-bonding met

49、hods . 14 6.5 Cross bonding 15 6.6 Sheath sectionalizing joints . 20 6.7 Choice of bonding system . 20 6.8 Sheath standing voltage . 22 6.9 Transient voltage analysis 23 7. Sheath voltage limiters . 24 7.1 Introduction . 24 7.2 Nonlinear resistances . 25 7.3 Nonlinear resistances in series with spark gap 25 7.4 Spark gaps . 25 7.5 Selection of shield/sheath voltage limiters 26 7.6 Use of shield/sheath voltage limiters . 29 8. Effect on parallel communication and control cables . 29 8.1 Coupling 30 8.2 Shielding 30 8.3 Common-mode and metallic voltages . 30 Annex A (inform