ANSI IEEE 1591.3-2011 Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable)《螺旋形实用光纤系统(WRAP光纤)用部件合格标准》.pdf

1、g3g3g3IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable) g3Sponsored by thePower System Communications Committee g3IEEE 3 Park Avenue New York, NY 10016-5997 USA7 October 2011 IEEE Power +1 978 750 8400. Permission to photocopy portions of any individu

2、al standard for educational classroom use can also be obtained through the Copyright Clearance Center. Copyright 2011 IEEE. All rights reserved. ivIntroduction This introduction is not part of IEEE Std 1591.3-2011, IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems

3、 (WRAP Cable). This standard covers the design considerations, mechanical and electrical performance, test requirements, environmental considerations, and acceptance criteria for qualifying hardware for use with WRAP cable. The process of qualification includes the hardware functioning with WRAP cab

4、le as a system (see Clause 3). This standard establishes the qualifying test requirements for WRAP cable hardware. This standard is not intended to recommend operating conditions of WRAP cable or hardware. This standard is not intended to supersede any established safety rules, regulations, or pract

5、ices associated with the use of WRAP cable systems. It is the responsibility of the user of this standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations prior to use. Notice to users Laws and regulations Users of these documents shou

6、ld consult all applicable laws and regulations. Compliance with the provisions of this standard does not imply compliance to any applicable regulatory requirements. Implementers of the standard are responsible for observing or referring to the applicable regulatory requirements. IEEE does not, by th

7、e publication of its standards, intend to urge action that is not in compliance with applicable laws, and these documents may not be construed as doing so. Copyrights This document is copyrighted by the IEEE. It is made available for a wide variety of both public and private uses. These include both

8、 use, by reference, in laws and regulations, and use in private self-regulation, standardization, and the promotion of engineering practices and methods. By making this document available for use and adoption by public authorities and private users, the IEEE does not waive any rights in copyright to

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12、2011 IEEE. All rights reserved. vErrata Errata, if any, for this and all other standards can be accessed at the following URL: http:/standards.ieee.org/findstds/errata/index.html. Users are encouraged to check this URL for errata periodically. Interpretations Current interpretations can be accessed

13、at the following URL: http:/standards.ieee.org/findstds/interps/ index.html. Patents Attention is called to the possibility that implementation of this standard may require use of subject matter covered by patent rights. By publication of this standard, no position is taken with respect to the exist

14、ence or validity of any patent rights in connection therewith. A patent holder or patent applicant has filed a statement of assurance that it will grant licenses under these rights without compensation or under reasonable rates, with reasonable terms and conditions that are demonstrably free of any

15、unfair discrimination to applicants desiring to obtain such licenses. Other Essential Patent Claims may exist for which a statement of assurance has not been received. The IEEE is not responsible for identifying Essential Patent Claims for which a license may be required, for conducting inquiries in

16、to the legal validity or scope of Patents Claims or determining whether any licensing terms or conditions provided in connection with submission of a Letter of Assurance, if any, or in any licensing agreements are reasonable or non-discriminatory. Users of this standard are expressly advised that de

17、termination of the validity of any patent rights, and the risk of infringement of such rights, is entirely their own responsibility. Further information may be obtained from the IEEE Standards Association. Copyright 2011 IEEE. All rights reserved. viParticipants At the time this IEEE standard was co

18、mpleted, the Power System Communications Working Group had the following membership: William Byrd, Chair Robert Bratton, Vice Chair Thomas Alderton Gregory Bennet Bhatnagar Chitrangad Corrine Dimnik Robert Emerson John Jones Delavar Khomarlou Eric Miller Mark Naylor John Olenik Craig Pon Jon Potter

19、Jim Ryan Luis-Ramon Sales Tewfik Schehade Tarlochan Singh Monty Tuominen Curt TurnerThe following members of the individual balloting committee voted on this standard. Balloters may have voted for approval, disapproval, or abstention. Gregory Bennett Kenneth Bow Robert Bratton William Byrd Corrine D

20、imnik Gary Donner Gary Engmann Sean Foley George Gela Waymon Goch Jalal Gohari Randall Groves Werner Hoelzl David Horvath Magdi Ishac Laszlo Kadar Joseph L. Koepfinger Jim Kulchisky Chung-Yiu Lam Greg Luri William McBride Jerry Murphy Michael S. Newman Gary Nissen John Olenik Percy Pool Stephen Rodi

21、ck Bartien Sayogo Gil Shultz Tarlochan Singh Jerry Smith Gary Stoedter Monty Tuominen Curt Turner John Vergis Copyright 2011 IEEE. All rights reserved. viiWhen the IEEE-SA Standards Board approved this standard on 10 September 2011, it had the following membership: Richard H. Hulett, Chair John Kuli

22、ck, Vice Chair Robert M. Grow, Past Chair Judith Gorman, Secretary Masayuki Ariyoshi William Bartley Ted Burse Clint Chaplin Wael Diab Jean-Philippe Faure Alexander Gelman Paul Houz Jim Hughes Joseph Koepfinger* David J. Law Thomas Lee Hung Ling Oleg Logvinov Ted Olsen Gary Robinson Jon Walter Rosda

23、hl Sam Sciacca Mike Seavey Curtis Siller Phil Winston Howard Wolfman Don Wright *Member Emeritus Also included are the following nonvoting IEEE-SA Standards Board liaisons: Satish Aggarwal, NRC Representative Richard DeBlasio, DOE Representative Michael Janezic, NIST Representative Michelle Turner I

24、EEE Standards Program Manager, Document Development Erin Spiewak IEEE Standards Program Manager, Technical Program Development Matthew J. Ceglia IEEE Standards Project Manager Copyright 2011 IEEE. All rights reserved. viiiContents 1. Overview 1 1.1 Scope . 1 1.2 Purpose 1 2. Normative references 2 3

25、. Definitions and acronyms. 2 3.1 Definitions . 2 3.2 Acronyms 2 4. Requirements for WRAP cable hardware. 3 4.1 General requirements. 3 4.2 Material requirements 6 5. Design and installation considerations for the hardware 7 5.1 Surface leakage currents 7 5.2 Radio interference voltage (RIV) and cor

26、ona 7 6. Qualification testing . 7 6.1 Optical measurements 7 6.2 Retesting 9 6.3 Sample selection for hardware characteristics tests. 9 6.4 Qualification tests 9 Annex A (informative) System overview. 15 Annex B (informative) Glossary 18 Copyright 2011 IEEE. All rights reserved. 1IEEE Standard for

27、Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable) IMPORTANT NOTICE: This standard is not intended to ensure safety, security, health, or environmental protection. Implementers of the standard are responsible for determining appropriate safety, security, environmental,

28、and health practices or regulatory requirements. This IEEE document is made available for use subject to important notices and legal disclaimers. These notices and disclaimers appear in all publications containing this document and may be found under the heading “Important Notice” or “Important Noti

29、ces and Disclaimers Concerning IEEE Documents.” They can also be obtained on request from IEEE or viewed at http:/standards.ieee.org/IPR/disclaimers.html. 1. Overview 1.1 Scope This standard covers hardware for use with all-dielectric fiber optic (WRAP) cable designed to be helically wrapped around

30、a conductor or other messenger on overhead power facilities. This covers mechanical and electrical performance, test requirements, environmental considerations, and acceptance criteria for qualification of the hardware. 1.2 Purpose The purpose of this standard is to establish performance and testing

31、 specifications for hardware used on WRAP cable systems in order to standardize testing, simplify procurement specifications, and assure product quality. IEEE Std 1591.3-2011 IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable) Copyright 2011 IEEE. All r

32、ights reserved. 22. Normative references The following referenced documents are indispensable for the application of this document (i.e., they must be understood and used, so each referenced document is cited in text and its relationship to this document is explained). For dated references, only the

33、 edition cited applies. For undated references, the latest edition of the referenced document (including any amendments or corrigenda) applies. IEEE Std 1594, IEEE Standard for Helically Applied Fiber Optic Cable Systems (Wrap Cable) for Use on Overhead Utility Lines.1,2IEEE Std 1138, IEEE Standard

34、for Testing and Performance for Optical Ground Wire (OPGW) for Use on Electric Utility Power Lines. BS 5049-2:1994, Radio Interference Characteristics of Overhead Power Lines and High-Voltage Equipment Part 2: Methods of Measurement and Procedure for Determining Limits.3BS-EN 60060-1: High-voltage T

35、est TechniquesPart 1: General Definitions and Test Requirements. IEC 61109: Insulators for Overhead LinesComposite Suspension and Tension Insulators for AC Systems with a Nominal Voltage Greater Than 1 000 VDefinitions, Test Methods and Acceptance Criteria.43. Definitions and acronyms 3.1 Definition

36、s For the purposes of this document, the following terms and definitions apply. The IEEE Standards Dictionary: Glossary of Terms either immediately or over the lifetime of the installation (see Figure 2). IEEE Std 1591.3-2011 IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Ca

37、ble Systems (WRAP Cable) Copyright 2011 IEEE. All rights reserved. 4Figure 2 Illustration of span end clamp 4.1.3 Conductor mounted splice enclosure Conductor mounted splice enclosures may be used and are typically mounted close to the tower. Splicing may be carried out from a bucket or at ground le

38、vel. In the case of the splicing having been carried out at ground level, the enclosure provides storage for the cable needed to bring the enclosure to the ground (see Figure 3). Figure 3 Conductor mounted splice enclosures 4.1.4 Tower-mounted splice enclosure These enclosures may be used throughout

39、 an installation but are always needed at the ends of the installation where the WRAP cable is spliced to an underground cable. For security, the enclosure is typically mounted some way up the tower (e.g., above the anti-climbing guard). The enclosure shall be able to house the cable needed to acces

40、s the enclosure for splicing (see Figure 4). IEEE Std 1591.3-2011 IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable) Copyright 2011 IEEE. All rights reserved. 5Figure 4 Illustration of tower-mounted splice ensclosure 4.1.5 Ground wire down leg transiti

41、on In the case of a ground wire, the WRAP cable is enclosed in a pipe from the ground wire to the tower mounted splice enclosure. The pipe is attached to the tower using clamps or other securing means that do not damage the structure. The pipe material shall be able to withstand the mechanical and e

42、nvironmental stresses placed upon it (see Figure 5). Figure 5 Ground wire down leg transition 4.1.6 Phase conductor phase-to-ground transition In the case of a phase conductor, between phase and ground potential, the WRAP cable is housed in an insulator. After installation of the cable in the insula

43、tor, the insulator has no internal air surfaces or voids. In this way any leakage currents are confined to the outer surface of the insulator. The insulator is designed to limit these surface leakage currents to a safe level throughout the life of the installation. The lower end of the insulator sha

44、ll always be grounded in accordance with the utilities practice. A pipe, as described in 4.1.5, encloses the WRAP cable between the bottom of the insulator and the tower mounted splice enclosure. It should be noted that the insulator extends from the conductor to the tower structure. The entire insu

45、lator shall be treated as at phase potential, see note in Figure 6 “Caution High Voltage Zone”. IEEE Std 1591.3-2011 IEEE Standard for Qualifying Hardware for Helically-Applied Fiber Optic Cable Systems (WRAP Cable) Copyright 2011 IEEE. All rights reserved. 6Figure 6 Phase conductor phase-to-ground

46、transition 4.2 Material requirements 4.2.1 Design selection The material used in the fabrication of the hardware shall be selected to provide required durability, ductility, and compatibility with WRAP cable material. 4.2.2 Finish/workmanship Castings, forgings, or extrusions shall be uniform, witho

47、ut sharp edges or corners, free of cracks and shall not contain defects to the extent that the strength or suitability is affected. Holes shall be cylindrical and clean-cut. Holes in plates or terminal pads may be sub-punched and reamed, drilled, or cast in place. The periphery of the hole shall be

48、free from burrs. The finish of all bearing surfaces shall be smooth and contoured and the outer edges and corners shall be rounded as required. The hardware shall be free of metal particles, dirt, and oils. 4.2.3 Thermal design requirements The material used in the fabrication of the wrap hardware s

49、hall be capable of withstanding steady state temperatures from 40 C (40 F) to 70 C (158 F). Materials shall be capable of withstanding transient temperatures up to fault current temperatures typically 220 C (428 F) degrees max. If customers require materials to operate outside the established range those requirements shall be reviewed and agreed to with the manufacturer. Products that incorporate elastomers or non-metallic materials may be used outside the specified range as long as the design allows for adequate thermal transfer without any