ANSI INCITS ISO IEC 10536-3-1996 Identification cards - Contactless integrated circuit(s) cards Part 3 Electronic signals and reset procedures.pdf

1、INCITS/ISO/IEC 10536-3:19962008(ISO/IEC 10536-3:1996, IDT) Identification cards Contactless integrated circuit(s) cards Part 3: Electronic signalsand reset proceduresINCITS/ISO/IEC 10536-3:19962008(ISO/IEC 10536-3:1996, IDT)INCITS/ISO/IEC 10536-3:19962008 ii ITIC 2008 All rights reserved PDF disclai

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4、file; the PDF-creation parameters were optimized for printing. Every care has been taken to ensure that the file is suitable for use by ISO member bodies. In the unlikely event that a problem relating to it is found, please inform the Central Secretariat at the address given below. Adopted by INCITS

5、 (InterNational Committee for Information Technology Standards) as an American National Standard. Date of ANSI Approval: 7/2/2008 Published by American National Standards Institute, 25 West 43rd Street, New York, New York 10036 Copyright 2008 by Information Technology Industry Council (ITI). All rig

6、hts reserved. These materials are subject to copyright claims of International Standardization Organization (ISO), International Electrotechnical Commission (IEC), American National Standards Institute (ANSI), and Information Technology Industry Council (ITI). Not for resale. No part of this publica

7、tion may be reproduced in any form, including an electronic retrieval system, without the prior written permission of ITI. All requests pertaining to this standard should be submitted to ITI, 1250 Eye Street NW, Washington, DC 20005. Printed in the United States of America Foreword IS0 (the Internat

8、ional Organization for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardization. National bodies that are members of IS0 or IEC participate in the development of International Standards through technical committees established

9、 by the respective organizations to deal with particular fields of technical activity. IS0 and IEC technical committees collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in liaison with IS0 and IEC, also take part in the work. In the fiel

10、d of information technology, IS0 and IEC have established a joint technical committee, ISO/IEC JTC 1. Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Standard requires approval by at least 75% of the

11、 national bodies casting a vote. International Standard ISO/IEC 10536-3 was prepared by Joint Technical Committee ISO/IEC JTC 1, information technology, Subcommittee SC 17, ldentifica tion cards and related devices. ISO/IEC 10536 consists of the following parts, under the general title ldentifica ti

12、on cards - Contactless integrated circuit(s) cards: - Part I: Physical characteristics - Pat? 2: Dimensions and locations of coupling areas - Par? 3: Electronic signals and reset procedures Annexes A to D form an integral part of this part of ISO/IEC 10536. . . . Ill INCITS/ISO/IEC 10536-3:19962008

13、ITIC 2008 All rights reservedIntroduction ISOAEC 10536 is one of a series of International Standards describing the parameters for identification cards as defined in IS0 7810 and the use of such cards for international interchange. This part of ISOAEC 10536 describes the electronic characteristics o

14、f the contactless interface between a contactless integrated circuit(s) card and a card-coupling device. The interfaces include power and bi-directional communications. iv INCITS/ISO/IEC 10536-3:19962008 ITIC 2008 All rights reservedIdentification cards - Contactless integrated circuit(s) cards - Pa

15、rt 3: Electronic signals and reset procedures 1 Scope This part of ISO/IEC 10536 specifies the nature and characteristics of the fields to be provided for power and bi-directional communications between card coupling devices (CCDs) and contactless integrated circuit(s) cards (CICCs) of the ID-l card

16、 type in slot or surface operation. This part of ISO/IEC 10536 does not specify the means of generating coupling fields, nor the means of compliance with electromagnetic radiation regulations. This part of ISO/IEC 10536 is to be used in conjunction with ISO/IEC 10536-I and ISO/IEC 10536-2. NOTE 1 Ot

17、her types of contactless integrated circuit(s) cards, formats or interfaces, which operate at various distances, may be developed in the future, which may call for additions to be made to this part of ISOAEC 10536 or may require other International Standards to be written. 2 Normative references The

18、 following standards contain provisions which, through reference in this text, constitute provisions of this International Standard. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agreements based on this part of ISO/IEC 10536 are

19、 encouraged to investigate the possibility of applying the most recent editions of the standards indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IS0 1177: 1985, Information processing - Character structure for start/stop and synchronous characte

20、r oriented transmission. IS0 7810: 1985, Identification cards - Physical characteristics. ISO/IEC 7811-I : 1995, Identification cards - Recording technique - Part 1: Embossing. ISOAEC 781 l-2: 1995, identification cards - Recording technique - Part 2: Magnetic Stripe. ISOAEC 7811-3: 1995, identifica

21、tion cards - Recording technique - Part 3: Location of embossed characters on ID-I cards. ISOAEC 781 I-4: 1995, identification cards - Recording technique - Part 4: Location of read-only magnetic tracks - Tracks 1 and 2. ISOAEC 781 l-5: 1995, identification cards - Recording technique - Part 5: Loca

22、tion of read-write magnetic track - Track 3. ISOAEC 7812-l : 1993, Identification cards - Identification of issuers - Part I: Numbering system. ISOAEC 7812-2: 1993, identification cards - ldentifica tion of issuers - Part 2: Application and registration procedures. IS0 7813: 1985, Identification car

23、ds - Financial transaction cards. IS0 7816-I : 1987, Identification cards - Integrated circuit(s) cards with contacts - Part 1: Physical characteristics. IS0 7816-2: 1988, Identification cards - Integrated circuit(s) cards with contacts - Part 2: Dimensions and location of contacts. IS0 7816-3: 1989

24、, Identification cards - Integrated circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols. ISOAEC 105364: 1992, Identification cards - Contactless integrated circuit(s) cards - Part I: Physical characteristics. ISOAEC 10536-2: 1995, identification cards - Contactless

25、 integrated circuit(s) cards - Part 2: Dimensions and locations of coupling areas. 1 INCITS/ISO/IEC 10536-3:19962008AMERICAN NATIONAL STANDARD ITIC 2008 All rights reserved3 Definitions, abbreviations and symbols 3.1 Definitions For the purposes of this International Standard, the following definiti

26、ons apply. 3.1.1 answer to reset: the period after the CICC is first energised (or reset by any other means) until the CICC completes sending its initial response to the reset or its powering from the CCD. This initial response is also called the answer to reset. 3.1.2 data transition period: the ti

27、me period between the start of a data transition to the start of the next data transition. (See figure 1.) 3.1.3 differential non-return to zero: a bit coding method where a negative differential voltage is used to signal a logic level 0 and a positive differential voltage to signal a logic level of

28、 1. 3.1.4 logic level 1: Mark (as defined in IS0 1177). 3.1.5 logic level 0: Space (as defined in IS0 1177). 3.1.6 non-return to zero: a bit coding method where a negative voltage is used to signal a logic level 0 and a positive voltage to signal a logic level of 1. 3.1.7 phase shift keying: a metho

29、d of modulation achieved by varying the phase of the defined frequency received by the CICC, in a prescribed manner, from its energizing inductive field(s) in the CCD. 3.1.8 phase transition period: the time period between the middle of a phase transition from phase $I to to the middle of the next p

30、hase transition. (See figure 1.) k- I I 1 Data transition 1 period(Td 0 I I Phase transition period (TQ ) Figure 1 - Data transition period and phase transition period 3.2 Abbreviations The following abbreviations are used in this part of ISO/IEC 10536: ATR Answer To Reset CICC Contactless Integrate

31、d Circuit(s) Card CCD Card Coupling Device ID-l Identification card of the type specified in ISO/IEC 7810: 1995 NRZ Non-Return to Zero PSK Phase Shift Keying 3.3 Symbols The following symbols apply to this part of ISO/IEC 10536: El -E4 Fl -F4 HI-H4 0 tR tF T D T 0 “th V V hYS . drff As defined in IS

32、O/IEC 10536-2 The fields passing through HI-H4, respectively. As defined in ISO/IEC 10536-2 Phase Rise time between 10% and 90% of signal amplitude Fall time between 90% and 10% of signal amplitude Data transition period Phase transition period Differential threshold input voltage Differential input

33、 hysteresis Differential voltage 4 Operating sequence for contactless integrated circuit(s) cards This operating sequence applies to contactless integrated circuit(s) cards covered by this part ISO/IEC 10536. The dialogue between the CCD and the CICC conducted through the following consecutive opera

34、tions: of is activation of the CICC by the CCD powering field, internal reset of the CICC, transmission of a response from the CICC, subsequent information exchange between the CICC and CCD, and removal of the CICC from the CCD, or de- activation by the CCD. These operations use the electronic signa

35、ls and reset procedures specified in the following clauses. INCITS/ISO/IEC 10536-3:19962008 ITIC 2008 All rights reserved5 Power Transfer The four inductive coupling areas HI-H4 shall be excited by concentrated alternating fields Fl -F4, each capable of supplying power to a CICC. 5.1 Frequency The f

36、requency of the alternating fields shall be 4,9152 MHz at least during ATR. The frequency of the energizing fields shall remain within + O,l%. 5.2 Waveform The waveform of the alternating field shall be sinusoidal with total harmonic distortion less than 10%. 5.3 Relationship between fields The fiel

37、ds passing through areas HI and H2 may be driven from the same source but must be 180 out of phase with each other. Likewise, the fields passing through areas H3 and H4 may be driven from the same source but be 180 out of phase with each other. The phase difference shall remain within a test reader

38、to verify the operation of a CICC; test coil inserts to measure the magnetic flux of the powering field between the CCD and the ClCC. Test setups are given for testing a CICC and a CCD. A calibration setup is also provided. Many of the tests call for the testing of cards in four different orientatio

39、ns. Subclause D.5 defines the four orientations for testing. D.2 Test Card, Reader, and Coil Inserts D.2.1 Test Card The purpose of the test card is to test the ability of a CCD to power a CICC, to transmit data to the CICC, and to receive data from the CICC. The card test emulates a CICC. Both indu

40、ctive and capacitive data transfer are tested with the same test card with different testing elements and setups being used. The test card is shown in figure D.I. The test card contains two test coils as drawn and four capacitive plates. The dimensions of the plates and placement of the coils are as

41、 given in figure D.l and the subclauses below. 12 INCITS/ISO/IEC 10536-3:19962008 ITIC 2008 All rights reservedi / *E E =? 2 ! ! plate plate 1 plate plate El E2 , E3 E4 TOP 50,O mm /I 42,8 mm I BOTTOM I / - /I A 50,O mm 42,8 mm * Tolerance of + 2% Figure D.1 - Test Card The parameters of the test ca

42、rd are given in the following subclauses. D.2.1.1 Size of the Test Card The size of the test card shall be 92,8 mm x 54,0 mm. D.2.1.2 Thickness of the Test Card The thickness of the test card shall be 0,76 mm. - D.2.1.3 Copper thickness The traces shall be 35 pm + 7 pm copper plate. D.2.1.4 Track wi

43、dth Track width shall be 254 pm + 20%. 13 INCITS/ISO/IEC 10536-3:19962008 ITIC 2008 All rights reservedD.2.1.5 Coil characteristics The small coils shall have 20 turns. The inner size of the coils shall be 3,l mm & 2% x 9,l mm & 2% and the outer size IO,9 mm + 2% x 16,9 mm + 2%. Track width and spac

44、ing shall be 100 pm + 20%. The copper thickness in the coil shall be 35 pm Ifr 7 pm. D.2.1.6 Capacitive plates The capacitive plates shall be 9,0 mm & 0,l mm x 9,0 mm + 0,l mm. D.2.2 Large Test Coil Insert The large test coil insert in figure D.2 measures the stray flux surrounding all four inductiv

45、e CoupIhg areas, two at a time. The large sense coil is called sense coil #I. / _, - - - - - - - - - - _ _ _ _ - f I I , 42,8 mm I /I 92,8 mm Figure D.2 - Large test coil insert with sense coil #l The parameters of the insert are given in the following subclauses. D.2.2.1 Size of the Large Test Coil

46、 Insert The size of the large test coil insert shall be 92,8 mm x 54,0 mm. D.2.2.2 Thickness of the Large Test Coil Insert The thickness of the large test coil insert shall be 0,27 mm + 0,08 mm, D.2.2.3 Copper thickness The traces shall be 35 pm + 7 pm thick. 14 INCITS/ISO/IEC 10536-3:19962008 ITIC

47、2008 All rights reservedD.2.2.4 Coil characteristics The large coil shall have 2 full turns. The inner size shall be 24,7 mm + 2% x 78,6 mm + 2% and the outer size 26,5 mm + 2% x 80,4 mm IL 2%. Track width shall be 300 pm + 100 pm. The spacing shall be 300 pm + 100 pm. D.2.3 Small Test Coil Insert T

48、he small test coil insert measures the magnetic field in the inductive coupling areas. The insert in figure D.3 measures the effective flux around each of the individual inductive coupling areas. The insert contains two pairs of coils. The larger coil is sense coil #2, while the smaller coil is sens

49、e coil #3. I K 250 mm* 2 I I I I I k 23,(I mm* y I / 50,O mm / * Tolerance of f 2% Figure D.3 - Small Test Coil Insert with Sense Coils #2 and #3 The parameters of the insert are given in the following subclauses. D.2.3.1 Size of the Small Test Coil Insert The size of the small test coil insert shall be 92,8 mm x 54,0 mm. D.2.3.2 Thickness of the Small Test Coil Insert The thickness of the small test coil insert shall be 0,27 & 0,08 mm. D.2.3.3 Copper thickness The traces shall be 35 pm + 7 pm thick. D.2.3.4 Coil characteristics T