ANSI INCITS368-2003 Information technology - Passive Interconnect Perfomance (PIP)《信息技术.无源互连性能(PIP)》.pdf

1、ANSI INCITS 368-2003for Information Technology Parallel Interconnect Performance (PIP)ANSIINCITS 368-2003Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ANSIINCITS 368-2003Americ

2、an National Standardfor Information Technology Parallel Interconnect Performance (PIP)SecretariatInformation Technology Industry Council (ITI)Approved June 5, 2003American National Standards Institute, Inc.AbstractThis standard defines the electrical measurement techniques and acceptable performance

3、 limits for vari-ous test parameters on the collection of wires, connectors, and circuits that form the electrical path be-tween SCSI devices. This document specifies the details of the measurement methodology to minimizethe error in results from different electrical testing laboratories. Details ar

4、e given at each stage of testingincluding calibration, fixturing and sample preparation.Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Approval of an American National Standard

5、requires review by ANSI that therequirements for due process, consensus, and other criteria for approval havebeen met by the standards developer.Consensus is established when, in the judgement of the ANSI Board ofStandards Review, substantial agreement has been reached by directly andmaterially affe

6、cted interests. Substantial agreement means much more thana simple majority, but not necessarily unanimity. Consensus requires that allviews and objections be considered, and that a concerted effort be madetowards their resolution.The use of American National Standards is completely voluntary; their

7、existence does not in any respect preclude anyone, whether he has approvedthe standards or not, from manufacturing, marketing, purchasing, or usingproducts, processes, or procedures not conforming to the standards.The American National Standards Institute does not develop standards andwill in no cir

8、cumstances give an interpretation of any American NationalStandard. Moreover, no person shall have the right or authority to issue aninterpretation of an American National Standard in the name of the AmericanNational Standards Institute. Requests for interpretations should beaddressed to the secreta

9、riat or sponsor whose name appears on the titlepage of this standard.CAUTION NOTICE: This American National Standard may be revised orwithdrawn at any time. The procedures of the American National StandardsInstitute require that action be taken periodically to reaffirm, revise, orwithdraw this stand

10、ard. Purchasers of American National Standards mayreceive current information on all standards by calling or writing the AmericanNational Standards Institute.American National StandardPublished byAmerican National Standards Institute, Inc.25 West 43rd Street, New York, NY 10036Copyright 2003 by Info

11、rmation Technology Industry Council (ITI)All rights reserved.No part of this publication may be reproduced in anyform, in an electronic retrieval system or otherwise,without prior written permission of ITI, 1250 Eye Street NW, Washington, DC 20005. Printed in the United States of AmericaCAUTION: The

12、 developers of this standard have requested that holders of patents that may berequired for the implementation of the standard disclose such patents to the publisher. However,neither the developers nor the publisher have undertaken a patent search in order to identifywhich, if any, patents may apply

13、 to this standard. As of the date of publication of this standardand following calls for the identification of patents that may be required for the implementation ofthe standard, no such claims have been made. No further patent search is conducted by the de-veloper or publisher in respect to any sta

14、ndard it processes. No representation is made or impliedthat licenses are not required to avoid infringement in the use of this standard.Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from I

15、HS-,-,-iContentsPageForeword viiiIntroduction xii1 Scope .12 References .22.1 Overview .22.2 Approved references .22.3 References under development 22.4 Informative references 23 Definitions .33.1 Terms 33.2 Acronyms 93.3 Symbols and abbreviations .93.4 Keywords 103.5 Conventions 113.6 Specification

16、 of measurement equipment .114 Overview .134.1 General .134.2 Open vs. closed systems related to this standard .134.3 Structural considerations .134.3.1 SCSI interconnects 134.3.2 SCSI passive interconnect topology 144.3.3 Interconnect sub-assemblies, transition regions, and bulk cable .144.3.4 Inte

17、rconnect assemblies 144.3.5 Relationship between SE and DF in this document .154.4 Relationship between requirements on bulk cable and requirements on interconnect assemblies 154.5 Physical measurement points .154.6 Concatenated configurations 154.7 Interoperability points 164.8 Constructions consid

18、ered 164.9 Identification, constraints and loading requirements .174.9.1 Connector function identification 174.9.2 Constraints .174.9.3 Standard loads .184.9.3.1 Targets and initiators with no enabled terminator .184.9.3.2 Targets and initiators with enabled terminator 184.10 Nature of requirements

19、184.10.1 Measurements and tests 184.10.2 Performance levels and applications .184.10.3 Basic performance requirements for interconnect assemblies 194.10.3.1 Overview .194.10.3.2 Measurement conditions for non-precomp received signal quality requirements .204.10.3.3 Measurement conditions for precom

20、p received signal quality requirements 204.10.4 Deriving the launch signal requirements for this standard from the signal requirements in SPI-x .204.11 Local neighborhood concepts .214.12 Length specifications .214.13 S21 relationship among point to point and multidrop configurations .214.14 Accommo

21、dation of receiver compensation in interconnect requirements .22Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ii4.15 Instrumentation and text fixture considerations .234.16 Sig

22、nals covered by this standard 244.17 Error rate considerations .265 Summary bulk cable .276 Bulk cable samples, test fixtures and setups 296.1 Bulk cable samples and sample preparation 296.1.1 Overview 296.1.2 Summary 296.1.3 Point to point bulk cable .306.1.3.1 Point to point bulk cable sample prep

23、aration (SP_Bulk_PP3) 306.1.3.2 Point to point bulk cable sample preparation (SP_Bulk_PP10) 306.1.3.3 Point to point bulk cable sample preparation (SP_Bulk_PP25) 306.1.4 Sample preparation for multi-drop bulk cable or printed circuit boards 306.1.4.1 Multi-drop bulk cable sample preparation (SP_Bulk

24、MD3) 306.1.4.2 Printed circuit boards sample preparation .316.2 Bulk cable and printed circuit board test fixture specifications 316.2.1 Overview 316.2.2 Summary 316.2.3 Test fixture (FIX_Bulk_1) .326.2.4 Test fixture (FIX_Bulk_2) .336.2.5 Test fixture (FIX_Bulk_3) .346.2.6 Test fixture (FIX_Bulk_4

25、) .346.2.7 Printed circuit boards test fixture (FIX_PCB_1) .346.3 Bulk cable measurement equipment and setups 356.3.1 Summary 356.3.2 Set up (SET_Bulk_1) .366.3.3 Set up (SET_Bulk_2) .366.3.4 Set up (SET_Bulk_3) .376.3.5 Set up (SET_Bulk_4) .376.3.6 Set up (SET_Bulk_5) .386.4 STD calibration 387 Lev

26、el 1 bulk cable tests 407.1 SE tests .407.2 Differential local impedance 407.2.1 Overview 407.2.2 Point-to-point bulk cable .407.2.2.1 Sample preparation for point to point bulk cable .407.2.2.2 Test fixtures for point to point bulk cable .407.2.2.3 Measurement equipment and setup for point to point

27、 bulk cable 407.2.2.4 Calibration and verification procedure for point to point bulk cable .407.2.2.5 Test procedure and data output format .417.2.2.6 Acceptable values for point to point bulk cable .427.2.3 Multi-drop bulk cable 427.2.3.1 Sample preparation for multi-drop bulk cable .427.2.3.2 Test

28、 fixtures for multi-drop bulk cable .437.2.3.3 Measurement equipment and setup for multi-drop bulk cable 437.2.3.4 Calibration and verification procedure for multi-drop bulk cable .437.2.3.5 Test procedure and data output format for multi-drop bulk cable .437.2.3.6 Acceptable values for multi-drop b

29、ulk cable 447.2.4 Unpopulated printed circuit board (PCB) .447.3 Differential propagation time and propagation time skew .447.3.1 Overview 44Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license fr

30、om IHS-,-,-iii7.3.2 Point-to-point bulk cable .447.3.2.1 Sample preparation for point to point bulk cable .447.3.2.2 Test fixtures for point to point bulk cable .447.3.2.3 Measurement equipment and setup for point to point bulk cable 457.3.2.4 Calibration and verification procedure for point to poin

31、t bulk cable .457.3.2.5 Test procedure and data output format for point to point bulk cable .457.3.2.6 Acceptable values for point to point bulk cable .467.3.3 Multi-drop bulk cable 467.3.3.1 Sample preparation for multi-drop bulk cable .467.3.3.2 Test fixtures for multi-drop bulk cable .467.3.3.3 M

32、easurement equipment and setup for multi-drop bulk cable 477.3.3.4 Calibration and verification procedure for multi-drop bulk cable .477.3.3.5 Test procedure and data output format for multi-drop bulk cable .477.3.3.6 Acceptable values for multi-drop bulk cable 477.3.4 Unpopulated PCB 477.4 Differen

33、tial capacitance by calculation 477.4.1 Overview 477.4.2 Differential capacitance by calculation for all constructions of bulk cable 477.4.3 Acceptable differential capacitance values for all constructions of bulk cable .487.5 Differential capacitance by frequency domain measurement .497.5.1 Point-t

34、o-point bulk cable .497.5.1.1 Sample preparation for point to point bulk cable .497.5.1.2 Test fixtures for point to point bulk cable .497.5.1.3 Measurement equipment and setup for point to point bulk cable 497.5.1.4 Calibration and verification procedure for point to point bulk cable .497.5.1.5 Tes

35、t procedure and data output format for point to point bulk cable .497.5.2 Multi-drop bulk cable 497.5.3 Unpopulated PCB 497.5.4 Acceptable differential capacitance values for all constructions of bulk cable .507.6 Differential insertion loss .507.6.1 Overview 507.6.2 Point-to-point bulk cable .507.6

36、2.1 Sample preparation for point to point bulk cable .507.6.2.2 Test fixtures for point to point bulk cable .507.6.2.3 Measurement equipment and setup for point to point bulk cable 507.6.2.4 Calibration, verification and measurement procedure for point to point bulk cable .507.6.2.5 Acceptable valu

37、es for point to point bulk cable .517.6.3 Multi-drop bulk cable 517.6.3.1 Overview .517.6.3.2 Sample preparation for multi-drop bulk cable .527.6.3.3 Test fixtures for multi-drop bulk cable .527.6.3.4 Measurement equipment and setup for multi-drop bulk cable 527.6.3.5 Calibration, verification and m

38、easurement procedure for multi-drop bulk cable .527.6.3.6 Acceptable values for multi-drop bulk cable 527.6.4 Unpopulated PCB 527.7 Near end cross talk (NEXT) 527.7.1 Overview 527.7.2 Point-to-point bulk cable .547.7.2.1 Sample preparation for point to point bulk cable .547.7.2.2 Test fixtures for p

39、oint to point bulk cable .547.7.2.3 Measurement equipment and setup for point to point bulk cable 547.7.2.4 Calibration and verification procedure for point to point bulk cable .547.7.2.5 Test procedure and data output format for point to point bulk cable .567.7.2.6 Acceptable values for point to po

40、int bulk cable .567.7.3 Multi-drop bulk cable 56Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-iv7.7.3.1 Sample preparation for multi-drop bulk cable .577.7.3.2 Test fixtures fo

41、r multi-drop bulk cable .577.7.3.3 Measurement equipment and setup for multi-drop bulk cable 577.7.3.4 Calibration and verification procedure for multi-drop bulk cable .577.7.3.5 Test procedure and data output format for multi-drop bulk cable .587.7.3.6 Acceptable values for multi-drop bulk cable 59

42、7.7.4 Unpopulated PCB 598 Summary - interconnect assemblies 609 Interconnect assemblies samples, test fixtures, and setups 619.1 Interconnect assembly samples and sample preparation .619.2 Test fixtures for interconnect assemblies 619.2.1 Overview 619.2.2 Summary 619.2.3 Test fixture (FIX_ASY_1) .62

43、9.2.4 Test fixture (FIX_ASY_2) .639.2.5 Test fixture (FIX_ASY_3) .649.2.6 Test fixture (FIX_ASY_4) .649.3 Interconnect assembly measurement equipment and setups .659.3.1 Summary 659.3.2 Set up (SET_ASY_1) .669.3.3 Set up (SET_ASY_2) .669.3.4 Set up (SET_ASY_3) .679.3.5 Set up (SET_ASY_4) .679.4 STD

44、Calibration .6810 Level 1 interconnect assembly tests .6910.1 Differential impedance 6910.1.1 Overview 6910.1.2 Point-to-point interconnect assemblies 6910.1.2.1 Test fixtures for point to point interconnect assemblies 6910.1.2.2 Measurement equipment and setup for point to point interconnect assemb

45、lies .6910.1.2.3 Calibration and verification procedure for point to point interconnect assemblies 6910.1.2.4 Test procedure and data output format for point to point interconnect assemblies 6910.1.3 Multi-drop interconnect assemblies 6910.1.3.1 Test fixtures for multi-drop interconnect assemblies .

46、6910.1.3.2 Measurement equipment and setup for multi-drop interconnect assemblies 6910.1.3.3 Calibration and verification procedure for multi-drop interconnect assemblies .7010.1.3.4 Test procedure and data output format for multi-drop interconnect assemblies .7010.1.4 Connectorized backplanes .7010

47、1.5 Acceptable values for all constructions of interconnect assemblies 7010.2 Differential propagation time and propagation time skew .7010.2.1 Overview 7010.2.2 Point-to-point interconnect assemblies 7010.2.2.1 Test fixtures for point to point interconnect assemblies 7010.2.2.2 Measurement equipme

48、nt and setup for point to point interconnect assemblies .7010.2.2.3 Calibration and verification procedure for point to point interconnect assemblies 7010.2.2.4 Test procedure and data output format for point to point interconnect assemblies 7010.2.3 Multi-drop interconnect assemblies 7110.2.4 Conne

49、ctorized backplanes .7110.2.5 Acceptable values for all constructions of interconnect assemblies 7110.3 Signal integrity diagrams .7110.3.1 Overview 7110.3.2 Requirements for all constructions of interconnect assemblies .73Copyright American National Standards Institute Provided by IHS under license with ANSINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-v10.3.2.1 Test fixtures for all constructions of interconnect assemblies .73