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本文(ARMY MIL-C-14870-1970 CIRCUIT CARD ASSEMBLY 10559245 (INDICATOR DIGITAL DISPLAY)《10559245(数字指标显示器) 电路卡装配》.pdf)为本站会员(deputyduring120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ARMY MIL-C-14870-1970 CIRCUIT CARD ASSEMBLY 10559245 (INDICATOR DIGITAL DISPLAY)《10559245(数字指标显示器) 电路卡装配》.pdf

1、MIL- C - 14870( MU) 2 March 1970 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY: 10559245 (INDICATOR, DIGITAL, DISPLAY) I. SCOPE 1. 1 This specification covers one type of electronic assembly known as Circuit Card Assembly: 10559245, (Indicator, Digital, Dis - play) (see 6.1). 2. APPLICABLE DOCUMENTS

2、2. 1 The following documents, of the issue in effect on date of invitation for bids or request for proposal, form a part of this speci- fication to the extent specified herein. SPECIFICAT IONS Military MIL-F-13926 MIL-P- 14232 MIL- 1-45 607 Fire Control Materiel; General Specification Governing the

3、Manufacture and Inspection of .Parts , Equipment and Tools for Army Materiel: Packaging and Packing of Ins pe c t ion Equipm ent , Supply and Maintenance of STANDARDS Military MIL-STD-105 Sampling Procedures and Tables MIL-STD- 109 MIL-STD-81 O Environmental Test Methods . for Inspection by Attribut

4、es Quality Assurance Terms and Definitions DRAWINGS U. S. Army, Frankford Arsenal F10559245 Circuit Card Assembly - Indica- tor, Digital, Display FSC 1240 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL- C- 14870( MU) PACKAGING DA.TA SHEET 1 05 5

5、9 245 Packaging of Circuit Card Assembly - (Indicator, Digi- tal, Display): 10559245 (Copies of specifications, standards, drawings, and packaging data sheets required by suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the

6、contracting officer. ) 3. REQUIREMENTS 3. 1 Fabrication. - The circuit card assembly shall be manufac- tured in accordance with Drawing F10559245 and drawings pertaining thereto. 3. 2 General specification. - The circuit card assembly shall meet the following requirements, where applicable, of MIL-F

7、-13926: (a) Order of precedence (b) Dimensions and tolerances (c) Part identification and marking 3.2. 1 Electronic workmanship. - The circuit card aseembly shall meet the workmanship requirements of Drawing F10559245 and drawings pertaining thereto. 3. 3 Performance. - Unless otherwise specified, t

8、he circuit card assembly shall meet the performance requirements of this speci- fication at standard ambient temperatures between 60 degrees Fahren- heit (OF) and 900F. 3.3. 1 Power and signals. - The circuit card assembly shall perform as specified herein when the power and signals of Table i are a

9、pplied as specified. TABLE I IT EM CONDITION CHARACTERISTICS CONNECT IONS Maxim urn 1 Power sources; Tolerance p-p ripple Connected between: 1.1 5 Vdc *O. 2 Vdc 25 mV P1-R(t) and P1- 10( -) 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL- C - 1

10、487 O( MU) IT EM 1.2 2. 2. 1 TA.BLE I (continued) CONDITION CHARA CTERLSTICS CONNECT IONS 220 Vdc I10 Vdc 100 mV P1-S(t) and P1-10( -) Signal sources: Digital Type A Logical one: 4 *lV Applied as Logical zero: O. 2 specified in *o. 2v Table II herein. o1 11 1 1 1 1 O O 4.4. 1 General. - One circuit

11、card assembly shall be selected at random by a Government representative as a control sample from each 100 produced. The control sample shall meet the requirements and tests in Table IV. TABLE IV CONTROL TEST REQUIREMENT TEST PROCEDURES 301. Fabrication 3. 1 Applicable drawings - 302. General specif

12、ication 3. 2 MIL-F-13926 - Visual Visual 4.4.2 Environmental. - Three circuit card assemblies shall be selected at random by a Government representative as a control sam- ple from each 50 produced or from each months production, whichever occurs first. tests in Table V. The control samples shall mee

13、t the requirements and TABLE V CONTROL TEST REQUIREMENT TEST PROCEDURES 303. Storage temperature 3. 3. 2. 1 4. 6, 3. 1 304. Operating temperature 3. 3. 2. 2 4.6. 3. 1 305. Vibration 3. 3. 2. 3 4. 6, 3. 2 4.4.3 Failure of sample. - Should any one item of a special sampling fail to meet the specified

14、test requirements, accepance of the product shall be suspended by the Government until necessary cor- rections have been made by the contractor and the resubmitted item has been approved (see 4. 3. 3). 4. 5 Inspection equipment. - Except as otherwise provided for by the contract, the contractor shal

15、l supply and maintain inspection equipment in accordance with the applicable requirements of MIL-1-45607. 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-W :. . -? MIL-C-L870 12 9779706 0297786 7 U MIL- C - 14 87 O( MU) 4.5. 1 Government furnished

16、inspection equipment. - Where the contract provides for Government furnished test equipment, supply and maintenance of test equipment shall be in accordance with the applicable requirements spec if ie d in MIL- 1-4 5 6 07. 4. 5. 2 Contractor furnished inspection equipmnt. - 4. 5. 2. 1 Government des

17、ign. - Unless otherwise specified in the contract, all inspection equipment specified by drawing number in speci- fications or SQAP forming a part of the contract shall be supplied by the contractor in accordance with applicable technical data listed in the technical data package (TDP). 4. 5, 2. 2 C

18、ontractor design. - The contractor shall design and supply inspection equipment compatible with the “Test Methods and Procedures“ specified in 4. 6 of this specification and with the compo- nent inspection procedures specified in “Examination“ and “Test Facil- ities“ requirements of MIL-F-13926. Sin

19、ce tolerance of test equipment is normally considered to be within 10% of the product tolerance for which it is intended, this inherent error in the test equipment design must be considered as part of the prescribed product tolerance limit. Thus, concept, construction, materials, dimensions, and tol

20、erances used in the design of test equipment shall be so selected and controlled as to insure that the test equipment will reliably indicate acceptability of a product which does not exceed 90% of the prescribed tolerance limit and permit positive rejection when nonconforming. Construction shall be

21、such as to facilitate routine calibration of test equipment, 4. 5. 3 Test equipment. - In conjunction with 4, 5. 2, the standard test:equipment listed in lable VI shall be utilized in performing the applicable test of 4. 6. TABLE VI Nomenclature Description 1. D-C power supply Plus 5 *o. 2v, 2. D-C

22、power supply Plus 220 IlOV, Ripple: 25 mV p-p max Ripple: 100 mV p-p max 3. Signal source Capable of providing a d-c level of amplitude specified in item 2. 1, Table I. 4.6 Test methods and procedures. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

23、,-MIL-C-; 14870(MU) 4.6. 1 Test conditions, - Unless otherwise specified, the test conditions slian-nce with the “Test Facilities“ require- ments of MIL-F-13926. 4.6. 1. 1 Initial conditions. - Connect the power to the circuit card assembly as specified in Table I. 4. 6. 2 Readout selection logic. (

24、a) Apply the initial conditions of 4.6. 1. 1. (b) Apply the digital Type-A signal of Table I of the logic level indicated, in turn, to the group of terminals associated with each nixie tube specified in Table II and observe the readout number on the nixie tube, The nixie tube readout numbers shall b

25、e as specified in 3. 3. 1. 1. 4.6. 3 Environmental tests. - The test equipment shall be in accordance with the IlTest Facilitiestt requirements of MIL-F- 13926 except that the circuit card assembly may be mounted on the inside surface of the test chamber for the temperature test and the tolerance re

26、quirements for vibration frequency measuring initruments shall not apply 4.6. 3. 1 Temperature test. NOTE: The rate of temperature change shall be less than 70F per minute during temperature cycling. Place the circuit card assembly in the test chamber and reduce the chamber temperature to -80F. Soak

27、 the circuit card assembly at this temperature for at least 5 hours with the unit not operating, Raise the chamber temperature to -400F. Following thermal stabilization at -40F, place the Raise the chamber temperature to t1600F. Soak the circuit card assembly at t1600F for at least 5 hours with the

28、assembly not operating. Reduce the chamber temperature to t125OF. Following thermal stabilization at t 125OF, place the circuit card assembly in operation and perform the test specified in 4. 6.2, Reduce the chamber temperature to ambient, Following stabilization at ambient temperature, place circui

29、t card assembly in operation and perform the test specified in 4. 6. 2. the circuit card assembly in operation and perform the test specified in 4. 6. 2. 9 MIL-C-LY87O 12 W 7779906 0277787 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-flIL-C-LLt8

30、70 12 W 7779706 0277788 O m MIL- C - 14 870 (MU) The circuit card assembly shall meet the requirements 3. 3.2. 2. of 3. 3. 2. 1 and 4. 6. 3. 2 Vibration. - With the circuit card assembly firmly mounted to the vhration table perform the following: (a) Test in accordance with Method 514-1 of MIL-STD-8

31、10 for category (f) equipment, except that the acceleration shall not exceed f4g and the maximum excursion (double amplitude) shall be O. 5 inch. 5 Hz in a period of 15 minutes. Perform two sweeps in each of the three mutually perpendicular axes. (c) Following vibration cycling, examine the circuit

32、card assembly for structural failures, loose hardware, wire breakage and abrasion. (d) Place the circuit card assembly in operation and per- form the test specified in 4. 6. 2, (b) Sweep the frequency from 5 Hz to 500 Hz and back to The circuit card assembly shall meet the requirements of 3. 3. 2. 3

33、. 5. PREPARATION FOR DELIVERY 5.1 Packaging, packing and marking. - Packaging, packing and marking shall be in accordance with Packaging Data Sheet 10559245. The level of protection shall be as specified in the procurement docu- ment. 6. NOTES 6. I Intended use. - The circuit card assembly is a func

34、tional module of the Digital Display Indicator, intended for use in the Laser Range Finder AN/VVS- 1. (nixie tubes) which display range returns, selected target range, and malfunctions. The assembly contains readout devices 6. 2 Ordering data. - Procurement documents should specify the following: (a

35、) Title, number and date of this specification. (b) Applicable packaging data sheet number (see 5. 1). (c) Selection of applicable levels of preservation, packaging and packing. 10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-Lq870 12 7777906 0277789 2 m (a) Applicable stock number. (e) Requirement for First Article Submission. Custodian: Army - MU 11 Preparing activity Army - MU * Project No. 1240-Al39 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

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