ARMY MIL-E-63511-1982 ELECTRONICS-MCD ASSEMBLY FOR MINE ANTI-TANK BLU 91 B《91 B基本链路反坦克地雷电子MCD组件》.pdf

1、MIL-E-63511 (AR) i5 JUNE i982 MILITARY SPECIFICATION ELECTRONICS - MCD ASSEMBLY FOR MINE, ANTI-TANK: BLU 91/B This specification is approved for use by the US Army Armament Research and Development Command and is available for use by all Departments and Agencies of the Department of Defense. 1. SCOP

2、E 1.1 This specification contains quality assurance provisions for the fabrication and inspection of parts, assembly and packing of an electronic assembly for Mine, Anti-Tank: BLU 91/B. J 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. Unless otherwise specified

3、, the following specifications and standards of the issue listed in that issue of the Department of Defense Index of Specifications and Standards (DoDISS) specified in the solicitation form part of this specification to the extent specified herein. SPEC IF I CAT IONS FEDERAL PPP-B-621 - Boxes, Wood,

4、 Nailed and Lock-Corner. MILITARY MIL-B-117 - Bags, Sleeves and Tubing - Interior Packaging MIL-P-14232 - Parts Equipment and Tools for Army Materiel, Packaging of - FSC: 1345 7 THIS DOCUMENT CONTAINS PAGES. - Beneficial comments (recommendations, additions, deletions) and any pertinent data which m

5、ay be of use in improvin this document should be addressed to: Commander, US Army Armament Iesearch and Develo ment Command Standardization Document Improvement Pfoposal (DD Form 1426) appearing at the end of this document or by letter. Attn. DRDAR-QA, Dover, New Jersey 07801 by using t rl e self-ad

6、dressed I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63533 33 7777706 O353382 5 = MIL-E-63511 (AR) ,MIL-E-l7 5 55 - MIL-S-19500/127 - MIL-S-19500/240 - MIL-S-19500/ 255 - MIL-S-19500/291 - MIL-S- 19 500/ 406 - MIL-R- 3 9 O 08/ 4 - MIL-C-39

7、014/5 - MIL-S-45743 - MIL-S-46844 - Electronic and Electrical Equipment Accessories, and Repair Parts, Pack- aging and Packing of , Semi-conductor Device, Diode Silicon, Voltage-Regulator Types IN4370A through IN4372A, IN746A through IN759A, IN4307A-1 through IN4372A-1, IN746A-1 through IN759A-1, JA

8、N, JANTX, JANTXV, JANS Semiconductor Device, Diode, Silicon, Rectifier, Types IN645, IN649-1, TX and Non-TX Types IN647 , IN649 , IN645-1, IN647-1 , Semiconductor Device, Transistor, NPN, Silicon, Switching Types 2N2221, 2N2221A, 2N2222, and 2N2222A JAN, JANTX, JANTXV, and JANS Semiconductor Device,

9、 Transistor, PNP, Silicon Switching Types 2N2906, 2N2906A, 2N2907 and 2N2907A JAN, JANTX, JANTXV, and JANS Serniconductor Device, Diode Silicon, Voltage Regulator Types JAN and JANTX IN4460 thru IN4496 Resistor, Fixed, Composition (Insulated) Established Reliability Style RCR05 Capacitor, Fixed, Cer

10、amic Dielectric (General Purpose), Established Reliability, Style CKR11 Soldering , Manual Type, High Reliabiity, Electrical and Electronic Equipment I Solder Bath Soldering of Printed Wiring Assemblies Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

11、-MIL-E-6351L 13 m 7977706 0351183 7 W MIL-A- 4 8078 STANDARDS MILITARY MIL-STD- 105 MIL-STD-129 MIL-STD-202 MIL-STD- 275 MIL-STD-331 MIL-STD-750 MIL-E-63511 (AR) Ammunition, Standard Quality Assurance Provisions, General Specification for Sampling Procedures and Tables for Inspection by Attributes M

12、arking for Shipment and Storage Test Methods For Electronic and Electrical Component Parts Printed Wiring for Electronic Equipment Fuze and Fuze Components, Environmental and Performance Tests for Test Methods for Semi-conductor Devices 2.1.2 Other Government documents, drawings, and publications. T

13、he following other Government documents, drawings, and publications form a part of this specification to the ex tent spec if i ed her e in . DRAWINGS (See 6.11) US ARMY ARMAMENT RESEARCH AND DEVELOPMENT COMMAND (ARRADCOM) PRODUCT AND PACKAGING DRAWINGS 9330379 - Electronics - MCD Assembly 9349483 -

14、Mine Assembly, BLU 91/B, Test, AT40 INSPECTION EQUIPMENT DRAWINGS 1183AS616 - Standard Wave Forms CODE OF FEDERAL REGULATIONS TITLE 49 - Transportation, Parts 100-199 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-flIL-E-b35LL 13 W 797770b 035LL84 7

15、 MIL-E-63511 (AR) (The Code of Federal Regulations is available from the Superintendent of Documents, US Government Printing Office, Washington, 20402. Orders should specify, “49 CFR 100-199 (latest revision) I). (Copies of specifications, standards, drawings, and publications required by manufactur

16、ers in connection with specific acquisition functions should be obtained for the contracting activity or as directed by the contracting officer). 2.2 Order of_precedence. - In the event of a conflict between the text of this specification and the references cited herein, the text of this specificati

17、on shall take precedence. 3. REQUIREMENTS 3.1 Materials. - Materials shall be in accordance with the I appplicable drawings, specification and standards. 3.2 Components - -_-_-_- and assemblies. The components and assemblies shall comply with all requirements specified on (Dwg) 9330379, all associat

18、ed drawings, and with all requirements specified in applicable specifications and standards. 3.3 Physical characteristics. 3.3.1 Envelope - and dimensions. l_l_ The envelope and dimensions -_- of the Electronics - MCD Assembly shall conform to the requirements on Dwg. 9330379, as applicable. the req

19、uirements of drawings (Dwgs.) 9287115 and 9287148, and shall be manufactured and dispensed in accordance with the processes, procedures, and controls delineated therein . The potting material shall be tested as specified in 4.4.3.1. . 3.3.2 - Potting material. Potting material shall comply with 3.3.

20、3 Potted - electronic assembly. The potted Electronics Assembly shall comply with Dwg. 9330378 and as specified in 4.5.2. 3.4 Enviromental - conditions. 34.1 - TrancEortation -_-_- vibration. The Electronics - MCD Assembly shall .be safe to handle and transport and shall show no evidence of internal

21、 or external damage that will effect the functions following transportation vibration Test No. 119, Procedure 2 of MIL-STD-331. 3.4.2 Temperature -I_ conditioning. The Electronics-MDC Assem-blies shall function as specified in 3.5 after condition at any of the following temperatures: Provided by IHS

22、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 13 7797706 0353385 O E MIL-E-63511 (AR) a. Cold, minus 400 - 59 for four (4) hours minimum (min.) b. Ambient, for four (4) hours min. c. Hot, 1450 4- 5OF for four (4) hours min. 3.5 Functioninq. After bein

23、g conditioned as specified in 3.4, the Electronics-MCD Assemblies, assembled in a test mine, shall be capable of arming and functioning high order after being subjected to high velocity impact, by sensor or self-destruct (SD) modes. 3.6 Electronic Assemblies performance characteristics. 3.6.1 Quiesc

24、ent current. The Electronics-MCD Assembly quiescent current shall be less than 288 microamperes when the supply voltage is 6.05 t 0.15 volts at ambient temperature and the input/output terminals loaded as specified in 4.5.5.1. 3.6.2 Primary Time Base (PTB) oscillator period. The PTB oscillator perio

25、d shall be verified when tested as specified in 4.5.5.2. 3.6.3 T,est Time Base (TTB) oscillator period. The TTB oscillator period shall be verified when tested as specified in 4.5.5.3. 3.6.4 S&A assembly arm signal. The PTB clock count at which the S&A arm signal functions the piston actuator firing

26、 circuit shall be verified when tested as specified in 4.5.5.4. 3.6.4.1 CGA arm signal inhibit, The S&A arm signal shall not occur when the TTB oscillator is inhibited. This function shall be verified when tested as specified in 4.5.5.4.1. 3.6.5 Electronic arm. The electronic assembly shall not proc

27、ess destruct signals from the low voltage detect, or prime target sensor circuits until after electronic arm. The PTB clock count that initiates electronic arm and the ability of the electronic assembly to inhibit destruct signals prior to electronic arm shall be tested for as specified in 4,505.5.

28、3.6.6 Low voltage detect. The supply voltage level at which the low voltage detect circuit functions the detonator firing circuit shall-be verified when tested as specified in 4.505.6. * . C. I 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 1 MIL

29、-E-63511 L3 W 777730b 03CLLb 2 MIL-E-63511 (AR) 3.6.7 SD1 self-destruct signal The PTB clock count at which the SD self-destruct signal functions the detonator firing circuit shall be verified when tested as specified in 4.5.5.9. 3.6.8 SD2 self-destruct signal. The PTB clock count at which the SD2 s

30、elf-destruct signal functions the detonator firing circuit shall be verified when tested as specified in 4.5.5.8. 3.6.9 SD3 self-destruct siqnal. The PTB clock count at which the SD3 self-destruct signal functions the detonator firing circuit shall be verified when tested as specified in 4.5.5.7. 3.

31、6.10 Tarqet sensor functioning. The Electronics Assembly shall provide a fire signal (3.6.10.2) when subjected to valid target signatures. The specific conditions and signal limit under which this function shall occur are specified in Drawing 9332388 I and the following paragraphs. 3.6.10.1 Spurious

32、 output signal. There shall be no output occurring at the Target Sensor output (Test Point 1) for a minimum of 10 seconds prior to electronic arming after initial application of VB when tested as specified in 4.5.5.10. minimum of 4 volts when the assembly is subjected to a valid target signature as

33、specified in 4.5.5.10. 3.6.10.2 Sensor output voltaqe. The output shall be a 3.6.11 Primary Time Base oscillator (PTB) check. The oscillator check circuit shall initiate the function of the detonator firing circuit when the primary time base oscillator period becomes greater than the test time base

34、oscillator period. This requirement shall be tested for as specified in 4 . 5 . 5 . 11. 3.6.12 Firing circuits. The piston actuator, and detonator firing circuits shall each provide a minimum of 1500 ergs to a 10 ohm load within a 20 millisecond interval when tested as specified in 4.5.5.12. 3.6.12.

35、1 Piston actuator firinq circuit. When functioned, the piston actuator firing circuit shall remain on for only one PTB clock count. The piston actuator firing circuit shall function again after the detonator circuit of 3.6.12.2 has turned off, and remain on as long as the electronics is functionally

36、 operable or is intentionally reset. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 13 777770b 0351387 Lt MIL-E-63511 (AR) 3.6.12.2 Detonator firing circuit. When functioned, the detonator firing circuit shall remain on for 64 minimum an

37、d 128 maximum PTB clock counts. Thereafter, it shall remain off as lons as the electronics is functionally operable or is . intentionally reset. c 3.7 Low temperature operation. The electronic assembly shall meet the performance characteristics specified in 3.6 at minus 400 - 5OF when tested as spec

38、ified in 4.5.5.13. 3.8 High temperature operation. The electronic assembly shall meet the performance characteristics specified in 3.6 at 1450 + 5OF when tested as specified in 4.5.5.14. for. the sdonnections shall comply with MIL-S-45743, MIL-S-46844, Appendix A, and as specified herein. be soldere

39、d shall comply with the solderability requirements of MIL-S-45743, MIL-S-46844, MIL-STD-202 A herein. 3.9 Solderin . Soldering procedures and acceptance criteria . 3.9.1 Solderability. Electronic assembly parts that are to. (Method 208), and Appendix 3.10 Verification of safe condition of S&A assemb

40、lies prior to assembly to Test Mine Assemblies. Test Mine Assembly, positive verification of the following safety features shall be made for each S A Assembly (See 4.5.7.1): Prior to assembly in the a. b. Presence of the borerider ball lock. c. Minimum dimension of borerider: distance from end Safe

41、position of spring loaded slider assembly: Safe position of slider release pin and shear pin. Presence and safe position of the interlock assembly. of sleeve to borerider. d. distance from end of S&A to slider assembly, max. e. 3.11 Verification of safe condition of Electronic MCD Circuit resistance

42、 checks of each completed Assemblies. Electronic-MCD Assemblies shall be verified, as specified in 4.5.7.2. 3.12 Process control. The contractor shall submit to the government for approval with the first article sample, process 7 Provided by IHSNot for ResaleNo reproduction or networking permitted w

43、ithout license from IHS-,-,-_ - MIL-E-b3511 13 777770b 0351188 b W MIL-E-63511 (AR) control documents for the processes listed in the following subparagraphs. These processes shall be those used in the fabrication of the first article sample and shall not be changed after approval of the first artic

44、le sample without prior approval of the government. At unscheduled intervals during the operation of the approved processes, the Government inspector shall observe the processes to ascertain that production to the approved process control documents is being maintained. No deviation without approval

45、from the procuring activity shall be allowed. In the event that the contractor desires a change in an approved process control document, a new first article sample may, at the discretion of the Government be required. 3.12.1 Process control of molded plastic parts. A process control document shall b

46、e prepared for each of the molded plastic parts. These documents shall-briefly describe the entire process and shall fully document the controls to be utilized for maintaining the process. They shall specify the time, temperature, pressure ranges and cure process which shall be maintained during pro

47、duction of the molded parts. 3.12.2 Process control of potting. A process control document shall be prepared for potting the electronic assembly. It shall fully describe the entire process and the controls for maintaining the process. it shall specify the preparation of all materials, pot life, and

48、curing temperature and time. 3.12.3 Process control of solderinq. Process control documents/procedures shall be prepared for all soldering operations: process and controls for maintaining the process/procedures in compliance with the soldering requirements of 3.9. These documents shall fully describ

49、e the entire 3.13 Material control. The contractor shall prepare and submit to the Government a material control document. This document shall detail the procedures used to identify and control the components/subassemblies to assure that only qualified components/subassemblies from qualified suppliers are used in the manufacture or assembly of the BLU-9