ARMY MIL-P-62341 A-1986 PRINTED CIRCUIT CARD M1 AND M1A1 TANK GENERAL SPECIFICATION FOR《M1和M1A1坦克用印刷电路卡的通用规范》.pdf

1、MIL-P-62341A 12 W 777770b 0342852 I W MIL-P-62341A(AT) 16 December 1986 SUPERSEDING MIL-P-62341(AT) 5 July 1985 MILITARY SPECIFICATION PRINTED CIRCUIT CARD, M1 AND M1AL TANK, GENERAL SPECIFICATION FOR This spe ification is approved for use by US Army Tank-Automotive Command, Department of the Army,

2、and is available for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the general performance for printed circuit cards (PCC) used in the driver instrument panel, and the turret network box of the M1 and M1A1 Tank. The requirements

3、of this Specification together with those of the applicable detail specification constitute the complete requirements for each printed circuit card listed in 1.2. 1.2 Classification. Printed circuit cards shall be classified as f ollows : - Printed Circuit Card, Drivers Instrument Panel, DIP-A3. Cla

4、ss 1 12282631 (for M1) Class 2 12316386 (for MlA1) Type II - Printed Circuit Ca.rd, Driverls Instrument Panel, DIP-Al Class 1 12282607 (for M1) Class 2 12337028 (for MlAl) Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this documen

5、t should be addressed to: US Army Tank-Automotive Command, ATTN: AMCTA-GDS, Warren, MI 48397-5000, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document, or by letter. AMSC NIA FSC 1240 DISTRIBUTION STATEMENT A. Approved for pu

6、blic release; distribution is unlimited. -. - THIS DOCUMENT CONTAINS 13 PAGES. I -. i % . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - MIL-P-623YLA 12 = 7777906 0392853 3 MIL-P-62341A(AT) Type III - Printed Circuit Card, Turret Network BOX, (TN

7、B-Ah) Drawing No. 12282891 (for M1 and MlA1) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this specification to the extent specified herein. Unless otherwise specified, the issu

8、es of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation. SPECIFICATIONS MILITARY MIL-P-62341/1A MIL-P-62341/2A MIL-P-62341/3A MIL-R-5757/23 MIL-R-6106/19 STANDARDS MILITARY

9、MIL-STD-105 MIL-STD-130 MIL-STD-202 MIL-STD-454 MIL-STD-750 MIL-STD-810 MIL-STD-45662 MS24171 MS24 187 * L - Printed Circuit Card Drivers Instrument - Printed Circuit Card Drivers Instrument - Printed Circuit Card Turret Network Box, - Relays, Electrical, Hermetically Sealed, - Relays, Electromagnet

10、ic, Permanent Magnetic Panel, DIP-A3. Panel, DIP-Al. TNB-A4. DPDT, 10 Amperes. Drive, 25 Amperes, SPDT, Hermetically Sealed. - Sampling Procedures and Tables for - Marking for Shipment and Storage. - Electronic and Electrical Component Parts, Test Methods for Electronic and Electrical Component Part

11、s. Electronic Equipment. Inspection by Attributes. - Standard General Requirements for - Test Methods for Semiconductor Devices. - Environmental Test Methods and Engineering - Calibration Systems Requirements. - Relay, 200 Amp, 1 PST, N.O. Type II - Relay, 50/25 Amp, 1 PDT, N.O./N.C. Type II, Guidel

12、ines. Non-Hermetically Sealed. Non-Hermetically Sealed. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-P-6234LA 12 W 7777706 0342854 5 W 2.1.2 Other Government documents, drawings, and publications. The following other Government documents, dr

13、awings, and publications form a part of this specification to the extent specified herein. Unless otherwise specified, the issues shall be those in effect on the date of the solicitation. DRAWINGS ARMY 11655194 12282631 12316386 12282607 12337028 12282891 - Process Specification for Soldering, Elect

14、rical Connections for Electrical and Electronics Equipment, General Requirements for. - Printed Circuit Card DIP-A3 for M1. - Printed Circuit Card DIP-A3 for MlA1. - Printed Circuit Card DIP-Al for M1. - Printed Circuit Card DIP-Al for MlAl. - Printed Circuit Card Turret Network Box (TNB-A4) for M1

15、and Mlbl. (Copies of specifications, standards, handbooks, drawings, publications, and other Government documents required by the contractors in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Other publ

16、ications. The following document(s) form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted shall be those listed in specified, the issues of documents not listed in the DODISS shall be the issue of the nongovern

17、ment documents which is current on the date of the solicitation. General Dynamics Land Systems Division DEOS 2060 - Nuclear Hardening Criteria (U) (Copies of General Dynamics DEOS 2060 should be obtained from the U.S. Tank-Automotive Command, ATTN: AMSTA-GDS, Warren, MI 48397-5000.) Vendors requesti

18、ng the nuclear hardening criteria, which is classified confidential, shall possess the proper security clearance and shall demonstrate a need to know. 2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein (except for associated det

19、ail specifications, specification sheets or MS standards), the text of this specification shall take precedence. Nothing in this specification, however, shall supersede applicable laws and regulations unless a specific exemption has been obtained. 3 Provided by IHSNot for ResaleNo reproduction or ne

20、tworking permitted without license from IHS-,-,-_- MIL-P-62341A 12 W 77977Oh 0342855 7 R 3.2 Detail specification. The individual item requirements shall be as specified herein and in accordance with the applicable detail specification. In the event of conflict between requirements of this specifica

21、tion and the detail specification, the latter shall govern. I l 3.3 Materials. Materials shall be as specified herein and in referenced specifications, standards, and drawings. Materials shall be free from defects which adversely affect performance or serviceability of the finished product (see 4.8.

22、1). MIL-P-62341A(AT) 3. REQUIREMENTS 3.1 First article. Unless otherwise specified (see 6.2), the contractor shall furnish printed circuit cards which shall be subjected to first article inspection (see 4.4 and 6.2). First article inspection samples, properly marked with identifying information shal

23、l be representative of the unit to be furnished to the Government. All subsequent assemblies delivered to the Government shall conform to these samples in all of their pertinent physical and performance attributes. 3.4 Design and construction. The printed circuit card shall be constructed to the for

24、m and dimensions depicted on the applicable drawings and fabricated so that all component assemblies and parts are functionally and dimensionally interchangeable with like components furnished under the same part number. printed circuit card shall conform to the applicable detail specifications list

25、ed in 2.1. In addition to the provisions of this specification, the 3.4.1 Configuration. See applicable specification sheet. 3.4.2 Weight. See applicable specification sheet. 3.4.3 Soldering. Electrical connections shall be soldered in accordance with Drawing 11655194 (see 4.8.1). 3.4.4 Nuclear hard

26、ens. See applicable specification sheet. 3.5 Performance. - 3.5.1 Circuit continuity. Except as otherwise specified in the applicable specification sheet, the resistance of continuous circuits shall not exceed 1.0 ohm. Continuous circuits are those which do not contain power utilizing elements (see

27、4.8.4.2). 3.5.2 Circuit isolation. Except as specified in the applicable specification sheet, the resistance between any two isolated circuits shall be 100 megohms at 100 volts (V) direct current (dc) (see 4.8.4.3). 3.5.3 Diode circuits. See applicable specification sheet. 3.5.4 - Blocking diodes. S

28、ee applicable specification sheet. 3.5.5 Resistors. See applicable specification sheet. 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-P-62341A 12 7977906 0342856 7 Axis Frequency (Hz) 5 to 25 Vertical 25 to 57 57 to 500 3.5.6 Relay operation.

29、 See applicable specification sheet. 1 - Amp1 it ude - + 1.0 gravity (g) 0.030 inch Double Amplitude + 5.0 g - -I 3.5.7 Transient voltage characteristics. See applicable specification sheet. Longitudinal Latitudinal and 3.5.8 Time delay and latching circuit. See applicable specification sheet. 5 to

30、25 25 to 44 44 to 500 3.5.9 Fire warning circuit. See applicable specification sheet. + 1.0 g - + 3.0 g - 0.030 inch Double Amplitude i 3.5.10 Environmental conditions. 3.5.10.1 Temperature. 3.5.10.1.1 Low temperature. The printed circuit card shall withstand storage in an ambient temperature of min

31、us 70 degrees Fahrenheit (OF), and shall operate at temperatures down to minus 25F (see 4.8.4.11.1). 3.5.10.1.2 High temperature. The printed circuit card shall withstand storage in an ambient temperature of 160F and shall operate at temperatures up to 140F (see 4.8.4.11.1). 3.5.10.2 Basic shock. Th

32、e printed circuit card shall meet the performance requirements of 3.5.1 thru 3.5.9, during and after exposure to three shock impulses of 30 5 3 gravity (g) intensity, 11 + 0.2 milliseconds (ms) duration, half sine wave applied in each direction of three mutually perpendicular axes for a total of 18

33、impulses (see 4.8.4.11.2). 3.5.10.3 Gun firing shock. The printed circuit card shall meet the performance requirements of 3.5.1 thru 3.5.9, during and after exposure to three shock impulses of 100 2 10 g intensity, 1.5 + 0.2 ms duration, half sine wave form applied in each direction of three mutuall

34、y perpendicular axes for a total of 18 shocks (see 4.8.4.11.3). 3.5.10.4 Vibration. The printed circuit card shall meet the performance requirements of 3.5.1 thru 3.5.9, during and after exposure to sinusoidal vibration in accordance with table I for a period of 60 minutes in each of the three mutua

35、lly perpendicular axes. The vibration shall be imposed at a logarithmic sweep rate of 15 minutes per sweep cycle from 5 to 500 to 5 Hertz (Hz) (see 4.8.4.11.4). TABLE I. Vibration levels. 1 I i - I 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I

36、MIL-P-623LlLA 12 9999706 0342857 O MIL-P-62341A(AT) . 3.5.10.5 Ballistic shock. The printed circuit card shall meet the performance requirements during and after subjection to shock impulses of 70 - + 7.0 g intensity, 0.5 + 0.1 ms duration, half sine wave form applied in each direction of three mutu

37、ally perpendicular axes (see 4.8.4.11.5). 3.6 Cross-reference to engineering and logistical support part number. Refer to table II for engineering and logistical support part number cross-reference interchangeability. TABLE II. Cross-reference for part number interchangeability. Engineering part num

38、ber Specification sheet part number . 12282631 12316386 12282607 12337028 12282891 M6 234 1 / 1 A M6 2 34 1 / 2A M6 2 3 4 1 / 3A 3.7 Marking. Marking shall be in accordance with MIL-STD-130 and as shown on the applicable printed circuit card drawing (see 4.8.2). 3.8 Workmanship. Workmanship shall be

39、 in accordance with the workmanship requirements of MIL-STD-454, requirement 9 (see 4.8.2). 4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for inspection. Unless otherwise specified in the contract or purchase order (see 6.2), the contractor is responsible for the performance of all inspection r

40、equirements as specified herein. Except as otherwise specified in the contract or purchase order, the contractor may use his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the rig

41、ht to perform or witness any of the inspections set forth in the specification where such inspections are deemed necessary to assure supplies and services conform to prescribed requirements. 4.1.1 Responsibility for compliance. All items must meet all requirements of sections 3 and 5. The inspection

42、 set forth in this specification shall become a part of the contractors overall inspection system or quality program. The absence of any inspection requirements in the specification shall not relieve the contractor of the responsibility of assuring that all products or supplies submitted to the Gove

43、rnment for acceptance comply wih all requirements of the contract. conformance does not authorize submisson of known defective material, either indicated or actual, nor does it commit the Government to acceptance of defective material. Sampling in quality . -3s &. -* . - .L. -_ _. 6 Provided by IHSN

44、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I MIL-P-6239LA 12 E 7777906 0392858 2 E 4.1.2 Inspection equipment. Unless otherwise specified in the contract (see 6.2), the contractor is responsible for the provision and maintenance of all inspection equipment nece

45、ssary to assure that supplies and services conform to contract requirements. Inspection equipment must be capable of repetitive measurements to an accuracy of 10 percent of the measurenent tolerance. Calibration of inspection equipment shall be in accordance with MIL-STD-45662. 4.2 Classification of

46、 inspection: a. b. First article inspection (see 4.4). Quality conformance inspections (see 4.5). 1. Examination (see 4.5.2). 2. Tests (see 4.5.3), C. Control tests (see 4.6). 4.3 Inspection conditions. Unless otherwise specified (see 6.2), all inspections shall be conducted under the following cond

47、itions: a. Air temperature 73 + 18F b. C. Barometric pressure-28.5 + 2.0 inches of mercury (Hg) Relative humidity 50 - + 30 percent - 3.0 4.4 First article inspection. Unless Otherwise specified (see 6.2), the Government shall select printed circuit card produced under the production contract (see 6

48、.2) for first article inspection. First article samples shall be numbered and inspected as specified in table III. Approval of the first article sample by the Government shall not relieve the contractor of his obligation to supply printed circuit card that are fully representative of those inspected

49、 as a first article sample. Any changes or deviation of the production units from the first article sample shall be subject to the approval of the contracting officer. 4.4.1 First article inspection failure. Test item deficiencies during, or as a result of, the first article test, shall be cause for rejection of the items until evidence has been provided by the contractor that corrective action has been taken to eliminate the deficiency. Any deficienc