ARMY MIL-PRF-39001 E-2009 CAPACITORS FIXED MICA DIELECTRIC ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR《已设和未设可靠度的云母电介质固定电容器总规范》.pdf

1、AMSC N/A FSC 5910 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. INCH-POUND MIL-PRF-39001E 18 February 2009 SUPERSEDING MIL-PRF-39001D 2 March 2004 PERFORMANCE SPECIFICATION CAPACITORS, FIXED, MICA DIELECTRIC, ESTABLISHED RELIABILITY AND NONESTABLISHED RELIABILITY,

2、 GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for established reliability (ER) and non-established reliability (non-ER), mica dielectric, fixed cap

3、acitors (see 6.1). The ER capacitors have a failure rate level (FRL) ranging from 1.0 percent per 1,000 hours to 0.001 percent per 1,000 hours (see 1.2.1.7). The FRL is established at a 90 percent confidence level. The FRL, identified by the applicable symbol specified in table V is referred to oper

4、ational life at full rated voltage (see 1.2.1.6) at 125C or 150C, as applicable. An acceleration factor of 25:1 has been used to relate the life test at 150 percent of rated voltage at rated temperature to rated voltage at rated temperature. 1.2 Classification. 1.2.1 Part or Identifying Number (PIN)

5、. The PIN is in the following form and as specified (see 3.1). 1.2.1.1 Style. The style is identified by the three-letter symbol “CMR“ followed by a two-digit number; the letters identify mica dielectric, fixed capacitors, ER and non-ER, and the number identifies the shape and dimensions of the capa

6、citor. 1.2.1.2 Characteristic. The characteristic is identified by a single letter which indicates the relative stability of the capacitor with temperature change in accordance with table I. CMR04 C 1R0 D O D M Style (1.2.1.1) Characteristic (1.2.1.2) Capacitance (1.2.1.3) Capacitance tolerance (1.2

7、.1.4) Operating temperature range (1.2.1.5) Rated voltage (1.2.1.6) Product level designator (1.2.1.7) Comments, suggestions, or questions on this document should be addressed to: US Army Communications-Electronics RDEC, ATTN: AMSRD-CER-PR-D, Fort Monmouth, NJ 07703-5023, or emailed to robert.franci

8、sus.army.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or n

9、etworking permitted without license from IHS-,-,-MIL-PRF-39001E 2 TABLE I. CharacteristicSymbol . Temperature coefficient Capacitance drift Parts/million/C (ppm/C) C -200 to +200 (0.5 percent + 0.1 picofarad (pF) E -20 to +100 (0.1 percent + 0.1 pF) F -0 to +70 (0.05 percent + 0.1 pF) 1.2.1.3 Capaci

10、tance. The nominal capacitance value expressed in pF is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 pF, the letter R is used to indicate the decimal point and

11、 the succeeding digit(s) of the group represent significant figure(s). For example 1R0 indicates 1.0 pF; R75 indicates 0.75 pF; and 0R5 indicates 0.5 pF. 1.2.1.4 Capacitance tolerance. The capacitance tolerance in percent or pF, as applicable, is identified by a single letter in accordance with tabl

12、e II. TABLE II. Capacitance toleranceSymbol . Capacitance tolerance D 0.5 pF F 1 percent G 2 percent J 5 percent 1.2.1.5 Operating temperature range. The operating temperature range is identified by a single letter in accordance with table III. TABLE III. Operating temperature rangeSymbol . Operatin

13、g temperature range, C O -55 to +125 P -55 to +150 1.2.1.6 Rated voltage. The rated voltage is identified by a single letter in accordance with table IV. TABLE IV. Rated voltageSymbol . DC rated voltage, volts A 100 C 300 D 500 Y 50 1.2.1.7 Product level designator. The FRL in percent per 1,000 hour

14、s is identified by a single letter in accordance with table V and is based on rated voltage at 125C or 150C, as applicable. TABLE V. Product level designatorSymbol . Product level designator C - M 1.0 percent per 1,000 hours P 0.1 percent per 1,000 hours R 0.01 percent per 1,000 hours S 0.001 percen

15、t per 1,000 hours Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-39001E 3 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in secti

16、ons 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must mee

17、t all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications. standards. and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specifie

18、d herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-C-5 - Capacitors, Fixed, Mica Dielectric, General Specification For. MIL-PRF-39001/5 - Capacitors, Fixed, Mica Dielectric, Establish

19、ed Reliability, Styles CMR03, CMR04, CMR05, CMR06, CMR07, and CMR08. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Components Parts. MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Established Reliability and High Reliability Qualified Products List

20、(QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-810 - Environmental Engineering Considerations and Laboratory Tests. MIL-STD-1276 - Leads for Electronic Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are

21、available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent

22、specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) EIA-554-1 - Assessment of Outgoing Nonconforming Levels in Parts Per Million (PPM). EIA-557 - Statistical Process Control Systems. (DoD ad

23、opted) (Copies of these documents are available from http:/ or Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (exce

24、pt for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheet. The individual item requirements shall be as specifi

25、ed herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the later shall govern (see 6.2). Copyright Communications - Electronics Command Provided by IHS under license with CRAINot fo

26、r ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-39001E 4 3.2 Qualification. Capacitors furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable Qualified Products List (QPL) before contract

27、award (see 4.4 and 6.4). Authorized distributors which are approved to MIL-STD-790 distributor requirements by the QPL manufacturers are listed in the QPL. 3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this specification. Requirements for this system

28、 are specified in MIL-STD-790 and MIL-STD-690. In addition, the manufacturer shall also establish a Statistical Process Control (SPC) and Part Per Million (ppm) system that meets the requirements as detailed in 3.3.1 and 3.3.2 respectively. 3.3.1 SPC system. As part of the overall MIL-STD-790 QPL sy

29、stem the manufacturer shall establish a SPC system that meets the requirements of EIA-557. 3.3.2 PPM. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a ppm system of assessing the average outgoing quality of lots in accordance with EIA-554-1. Data exclusion, in accord

30、ance with EIA-554-1, may be used with approval of the qualifying activity. The ppm system shall identify the ppm rate at the end of each month and shall be based on a 6-month moving average. Style reporting may include both ER and non-ER style combinations. 3.4 Material. The material shall be as spe

31、cified herein. However, when a definite material is not specified, a material shall be used which will enable the capacitors to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the fi

32、nished product. 3.4.1 Terminal leads. Leads shall be solderable and meet the solderability requirements of 3.12. 3.4.2.1 Solder dip (retinning) leads. Only the manufacturer (or his authorized category B or category C distributor) may solder dip/retin the leads of products supplied to this specificat

33、ion provided the solder dip process has been approved by the qualifying activity (see 3.4.2.3). 3.4.2.2 Qualifying activity approval. Approval of the solder dip process shall be based on one of the following options: a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL

34、-STD-1276, the manufacturer shall use the same solder dip process for retinning as is used in the original manufacture of the product. (NOTE: The 200 microinch maximum thickness is not applicable.) b. When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescri

35、bed in 3.4.2.2a., approval for the process to be used for solder dip shall be based on the following test procedure: (1) Thirty samples of any capacitance value for each style and lead finish are subjected to the manufacturers solder dip process. Following the solder dip process, the capacitors are

36、subject to the high voltage stabilization, dielectric withstanding voltage (DWV), insulation resistance (IR), capacitance, and dissipation factor (DF) measurements. No defects are allowed. (2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed. (3) The remaini

37、ng 20 samples are subject to the resistance to solder heat test. No defects are allowed. (NOTE: Solder dip of gold plated leads is not allowed.) Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license

38、 from IHS-,-,-MIL-PRF-39001E 5 3.4.2.3 Solder dip/retinning options. The manufacturer (or authorized category B or category C distributor) may solder dip/retin as follows (see 3.4.2.1): a. As a corrective action if the lot fails the group A solderability test. b. After the group A inspection has bee

39、n completed, following the solder dip/retinning process, the high voltage stabilization, DWV, IR, capacitance, and DF measurements shall be performed on 100 percent of the lot. The percent defective allowable (PDA) for the electrical measurements shall be as for the subgroup 1 tests. Following these

40、 tests, the manufacturer shall submit the lot to the group A solderability test as specified in 4.7.8. 3.5 Interface and physical dimensions. Capacitors shall meet the interface and physical dimensions specified (see 3.1). * 3.5.1 Pure tin. The use of pure tin, as an undercoat or final finish, is pr

41、ohibited both internally and externally. Tin content of capacitor and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.9). 3.6 DWV. Capacitors shall withstand the direct-current (dc) potential specified in 4.7.2 without damage, arcing

42、, or breakdown. 3.7 High voltage stabilization. When capacitors are tested as specified in 4.7.3, there shall be no evidence of damage, arcing, or breakdown; and the IR shall be not less than the applicable value specified on figure 1 or in table VI. 3.8 Barometric pressure (for qualification only).

43、 Capacitors shall withstand the dc potential specified in 4.7.4 without damage, arcing, or breakdown. 3.9 IR (see 4.7.5). 3.9.1 At room ambient temperature. When measured as specified in 4.7.5.1, the IR shall be not less than the applicable value specified on figure 1 or in table VI. 3.9.2 At high a

44、mbient temperature. When measured as specified in 4.7.5.2, the IR shall be not less than the applicable value specified on figure 1 or in table VI. TABLE VI. IR. Capacitance rating Minimum IR At 25C 0 pF to 10,000 pF 100,000 megohms 10,000 pF and greater 1,000 megohms-microfarads 1/ At 125C 0 pF to

45、3,300 pF 10,000 megohms 3,300 pF and greater 33 megohm-microfarads At 150C 0 pF to 1,500 pF 5,000 megohms 1,500 pF and greater 7.5 megohm-microfarads 1/ Product obtained by multiplying the capacitance in microfarads by the IR in megohms. 3.10 Capacitance. When measured as specified in 4.7.6, the cap

46、acitor shall be within the tolerance shown in the type designation (see 3.1). 3.11 DF. When measured as specified in 4.7.7, the DF shall not exceed the applicable value shown on figure 2. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduct

47、ion or networking permitted without license from IHS-,-,-MIL-PRF-39001E 6 3.12 Solderability. When capacitors are tested as specified in 4.7.8, the dipped surface of the lead shall be at least 95 percent covered with continuous new solder coating. The remaining 5 percent of the lead surface shall sh

48、ow only pinholes or voids. These shall not be concentrated in one area. No individual view of the dipped surface shall show less than 95 percent coverage. Bare base metal and areas where the solder dip failed to cover the original coating are indications of poor solderability and shall be cause for

49、failure. In case of dispute, the percent of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total area. 3.13 Vibration. When capacitors are tested as specified in 4.7.9, there shall be no intermittent contacts of 0.5 milliseconds (ms) or greater duration, or momentary arcing, or other indication of breakdown, nor shall there be any open-circuitin