ARMY MIL-PRF-49169B-1999 LIGHT-EMITTING DIODE ARRAY.pdf

1、I INCH-POUND I MIL-PRF-49 169B(CR) 6 April 1999 SUPERSEDING 2 February 1982 MIL-L-49 169A (ER) PERFORMANCE SPECIFICATION LIGHT-EMITTING DIODE ARRAY This specification is approved for use within the Communications-Electronics Command, Department of the Army and is available for use by all Departments

2、 and Agencies of the Department of Defense. 1. SCOPE 1.1. Scope. This specification covers three types of common module, Light-Emitting Diode Arrays, as follows: Type 1 Type II Type III SU-96UA (1 80 element array) SU- 122UA (120 element array) SU-127UA (90 element array) 2. APPLICABLE DOCUMENTS 2.1

3、. General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the comp

4、leteness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in impr

5、oving this document should be addressed to: Commander, US Army, Communications-Electronics Command, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, New Jersey 07703-5023 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC NIA FSC

6、 5855 DISTRIBUTION STATEMENT A.- Approved for public release; distribution is unlimited. Licensed by Information Handling ServicesMIL-PRF-49 169B (CR) 2.2 Government Documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this

7、document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS), and supplement thereto, cited in the solicitation (see 6.2). STANDARDS MIL-STD- 8 1 O Environm

8、ental Test Methods and Engineering Guidelines HANDBOOKS MIL-HDBK-454 General Guidelines for Electronic Equipment (Unless otherwise indicated, copies of the above specifications, standards and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phila

9、delphia, PA 19 1 1 1-5094). 2.2.2 Other Government documents, drawings, and publications. The following Government documents, drawings and publications form a part of this specification to the extent specified herein. Unless otherwise specified, the issues are those cited in the solicitation (see 6.

10、2.b). DRAWINGS SM-D-806557 Light Emitting Diode Array 5002478 5002475 Light Emitting Diode Array, SU-122UA Light Emitting Diode Array, SU-127UA (Copies of specifications, standards, drawings and publications required by contractors in connection with specific procurement functions should be obtained

11、 from the procuring activity or as directed by the contracting officer). 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes prece

12、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 2 Licensed by Information Handling ServicesMIL-PRF-49 169B(CR) BIAS (VDC) 2.5 4.0 8.4 3. REQUIREMENTS AVERAGE RADIANT POWER x (WATTS) AT -54“ C AT +23“ C AT +71“ C 2 2.

13、0 2 2.0 2 1.1 2 7.5 = 7.5, + 0.4 2 4.3 2 21.0 2 21.0 2 12.0 3.1. Description. The Light-Emitting Diode Array, herein referred to as the LED module, converts electrical signals into visible light within an infrared system. 3.2 Dimensions. The dimensions and outline characteristics of the Light-Emitti

14、ng Diode shall be in accordance with the following drawings to ensure proper interface and compatibility with the family of diode arrays: TYPE I SM-D-806557 TYPE II 5002478 TYPE III 5002475 3.2.1. Weight. Weight of the LED module shall not be greater than 0.35 pound. 3.3. First article. When specifi

15、ed in the contract (see 6.2) the contractor shall furnish first article units for inspection (see 4.2). 3.4. Parts, materials, and processes. The contractor shall select the parts, materials and processes, but these materials shall be capable of meeting all of the operational and environmental perfo

16、rmance requirements specified herein. 3.5 LED array. Each LED array shall be operated (burned-in) for 150 hours prior to assembly in the LED module. Burn-in shall be performed by biasing the array so that minimum bias current is not less than 1.33 milliamperes. Ambient temperature need not be contro

17、lled during burn-in. 3.6. Performance characteristics. Unless otherwise specified herein, the LED module shall meet specified performance requirements at an ambient temperature of +23“ C +2“ C and all bias tolerances shall be +O. 1 Vdc. 3.6.1. Radiated power output. The average element radiant power

18、, defined as the sum of each elements radiant power divided by the number of elements, shall be as tabulated below: 3.6.2. Input power. The total power applied to the LED module with 4.0 Vdc applied (see 4.5.2) shall not be greater than 3.4 watts for Type I, 2.3 watts for Type II, or 1.7 watts for T

19、ype III. n Licensed by Information Handling ServicesMIL-PFW-49 169B(CR) BIAS (VDC) 2.5 4.0 8.4 3.6.3. Array configuration. The LED module shall consist of 180, 120 or 90 elements arranged in a configuration with pin-to-element connections as specified on the applicable drawing (see 3.1 1.2). % TRACK

20、ING AT -54“ C AT 23“ C AT 71“ C + 15 + 10 + 15 + 10 +5 + 10 + 15 + 10 + 15 3.6.4. LED module tracking. The radiated power output of each element shall track the average element radiated power in accordance with the requirements as follows: 3.6.5. LED wavelength. The wavelength of light from each ele

21、ment shall be 6 with the LED module biased at 4.0 Vdc. O +lo nanometers 3.6.6. Emitting area. The emitting area dimensions shall be as specified on the applicable drawings. There shall be no more than 4 shape defects (see 3.11.3) in an LED array. The channels of the LED array as defined below shall

22、be defect-free of shape defects. Type I - Type II Type III - channels 31 through 150 channels 51 through 130 channels 71 through 110 and 141, 142, 143 3.7. Environmental conditions. 3.7.1. Temperature shock. The LED module shall not be damaged (see 3.1 1.4) by sudden changes in temperature between -

23、54“ C and +95“ C. 3.7.2. High temperature. The LED module shall not be damaged (see 3.11.4) under storage to +95“ C, or continuous operation to +71“ C, and shall operate for 30 minutes at +95“ C. 3.7.3. Low temperature. The LED module shall not be damaged (see 3.11.4) by operation to -54“ C or stora

24、ge to -62“ C. 3.7.4. Shock. The LED module shall not be damaged (see 3.11.4) by high intensity shocks of 100 gs peak amplitude with 11 milliseconds duration and by bench handling tests. 3.7.5. Vibration. The LED module shall not be damaged (see 3.11.4) by vibration over the frequency spectrum at the

25、 specified g levels and amplitudes shown in Figure 1. 4 Licensed by Information Handling ServicesMIL-PRF-49 169B(CR) 3.8. Operational life (reliability). Over an accelerated operational life test of 500 hours when operated at a bias level of 4.0 Vdc and in a +50 C temperature environment, the averag

26、e radiant power output of the diodes of the LED module shall not decrease by more than 20%. In addition, the LED module shall meet the tracking requirements of 3.6.4 after 500 hours of accelerated operational life testing. The 500-hour accelerated operational life demonstrates a MTBF of at least 6,8

27、04 hours. 3.9 Nameplates and product marking. The LED module shall be marked for identification and reference designation by the contractor with the following: CAGE CODE; DRAWING #; Contract #; Serial Number; and Manufacturers CAGE CODE. 3.10 Workmanship, Standards of. Workmanship shall be such that

28、 components will meet all requirements of this specification and any referenced drawings when inspected in accordance with Section 4. The equipment shall be fabricated in such a manner as to be uniform in quality and shall be free from defects that will affect their life, serviceability, interchange

29、ability, or appearance. MIL-HDBK-454 may be used as guidance. 3.11 Definitions. 3.11.1. Element. An element is defined as any one of the 180, 120, or 90 light-emitting diodes of the LED module. 3.1 1.2. Array. An array is defined as a single line of 180, 120, or 90 elements arranged in the configura

30、tion shown on its respective drawing. 3.11.3. Shape defect. A shape defect of an individual element, measured when energized, is defined as an emitting area which varies by more than +15% of the specified area or a length which varies by more than +5% of the specified length as defined by the drawin

31、gs (see 3.2). 3.1 1.4. Damage. Breakage, loosening, shifting, evidence of corrosion, or failure of any finish, hardware, connection, or component; and any degradation of LED module performance to values less than specified herein. 4. VERIFICATION 4.1. Classification of inspections. Inspections shall

32、 be classified as follows: a. b. Conformance inspection (see 4.4). First article inspection (see 4.2). 4.2. First article inspection. When specified in the contract, the first article inspection shall be performed by the contractor on a minimum of 6 sample units. 5 Licensed by Information Handling S

33、ervicesMIL-PRF-49 169B(CR) INSPECTION REQUIREMENT 4.2.1 Inspections. All materials, parts, processes and assemblies shall be examined for conformance to Table I Inspections and the sampling plan of Table 1-1. REQT INSPECTION PARA CRITERIA Array burn-in* Emitting area* Weight not as specified Workman

34、ship not as specified Dimensions not as specified* - Diameter, interface (2.001” ref) - Holes (4) thru cover, location - Mark, alignment, location - Pins, connector, location - Field flattener lens Marking not as specified 3.5 3.6.6 3.2.1 3.9 3.10 3.2 4.2.1 4.5.6 4.9 4.8 4.8 Drawings 5002475 5002478

35、 SM-D-806557 *Inspect every array 100 percent. TABLE 1-1 Sampling Plan for Inspection. Lot Size 2 to 8 9 to 15 16 to 25 26 to 50 51 to 90 91 to 150 Sample Size I 4.2.2. Tests. Upon successful completion of the inspections specified in 4.2.1, perform the tests of Table II in any order. Prior to start

36、 of tests specified in Table II, LED modules shall be identified as to their applicable subgroups. Unless otherwise specified in the contract (see 6.2), three units shall be tested in subgroup 1 and three units in subgroup 2. Failure of any tests on any unit shall constitute first article failure. 4

37、.2.3 Disposition of first article samples. First article samples shall not be considered as part of the procurement quantities. 6 Licensed by Information Handling ServicesMIL-PRF-49 169B(CR) Input power Array configuration LED module tracking TABLE II - FIRST ARTICLE INSPECTION. 3.6.2 3.6.3 3.6.4 I

38、INSPECTION High temperature Low temDerature REQT I PARA. 3.7.2 3.7.3 I Radiated Dower outDut I 3.6.1 INSPECTION Radiated Dower outDut REQT TEST PARA. PARA. 3.6.1 4.5.1 I LED wavelength I 3.6.5 I Temperature shock I 3.7.1 I Shock I 3.7.4 I Vibration I 3.7.5 I Operational life (reliability) I 3.8 I SI

39、BGRouP 2 I TEST PARA. 4.5.1 I X I X I 4.5.4 I x I x I 4.5.5 I x I x I 4.6.4 I X I I 4.6.5 *I 4.3. Inspection procedures for provisions. Unless otherwise specified herein, the LED modules shall be operated at an ambient temperature of +23“ C +2“ C. External bias for performance tests shall be applied

40、 using a 205-ohm +1.0% resistor in series with each element. 4.4. Conformance inspection. 4.4.1. Inspection. Inspection shall be as specified in 4.2.1. 4.4.2. Tests. 4.4.2.1. Group A inspection. Group A inspection shall be conducted at ambient temperature only on all LED modules following successful

41、 inspection of 4.2.1. Group A tests listed in Table III may be performed in any order. Failure of any test shall be cause for rejection of that LED module. TABLE III GROUP A INSPECTION I InDut DO wer I 3.6.2 I 4.5.2 I LED module tracking I 3.6.4 I 4.5.4 4.4.2.2 Group B inspection. Group B inspection

42、 shall be conducted on LED modules selected from LED modules which have passed the tests in 4.4.2.1. The sample(s) shall be tested in accordance with the inspections listed in Table IV. Samples shall be selected in accordance with 4.4.2.2.3. Group B tests listed in Table IV may be performed in any o

43、rder. 7 Licensed by Information Handling ServicesMIL-PRF-49 169B(CR) 4.4.2.2.1. Sampling for Group B inspection. Group B inspection samples shall be selected as follows: MONTHLY LOT SIZE TABLE IV GROUP B INSPECTION # OF SAMPLE UNITS MONTHLY LED module tracking 3.6.4 4.5.4 I LED wavelength I 3.6.5 I

44、4.5.5 TABLE IV-1 Group B Inspection Sampling. I 1-99 I 1 I I 100-299 I 3 I 4.4.2.2.2. Group B failures. Actions required relative to Group B failures shall be as specified in the contract (see 6.2). 4.4.2.2.3. Disposition of Group B samples. Group B samples shall be accepted on contract subsequent t

45、o the tests of Table III. 4.4.2.4. Group D inspection. Not required. 4.5. Test methods. Unless otherwise specified, all bias voltage tolerances shall be +O. 1 Vdc. 4.5.1. Radiated power output. The total radiated power output from each emitting element shall be measured at ambient, -54“ C and +71“ C

46、 with the LED module in its final assembled configuration. This test may be performed in conjunction with temperature tests 4.6.2 and 4.6.3. The emitted power is defined as the power radiated through the field flattener lens without applying any correction for the transmission losses due to the lens

47、. The radiated power output shall be measured using a suitable detector of area (A) calibrated at 660 nanometers and positioned a distance (D) from the radiation source. The optical arrangement for this test is not critical, except that the solid angle of the cone of radiation subtended at the detec

48、tor from the center element of the diode array shall not be greater than 0.2 steradian. The center of the detector shall be on the optical axis of the field flattener. The total radiated power output shall be calculated using the following equation: 8 Licensed by Information Handling ServicesMIL-PRF

49、-49 169B(CR) PT = Total radiated power (27c steradians) PA = Power measured at detector aperture A = Sensitive area of detector D = Distance of detector from radiation source Failure to meet requirements of 3.6.1 shall constitute failure of this test. 4.5.2. Input power. The LED module forward bias voltage shall be adjusted to 4.0 +O. 1 Vdc and the current for each element shall be measured. The total power (PT) shall be calculated using N r 180 (type I) pT = c (V - IR) for N = 1 i20 (type II) j=l I 90 (type III) where Ij is the current for the jth element, V is the bias voltage (