ARMY MIL-PRF-49467 C-2005 CAPACITOR FIXED CERAMIC MULTILAYER HIGH VOLTAGE (GENERAL PURPOSE) GENERAL SPECIFICATION FOR《普通规格高压多层陶瓷固定电容器》.pdf

1、AMSC N/A FSC 5910 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. INCH-POUND MIL-PRF-49467C 12 May 2005 SUPERSEDING MIL-PRF-49467B 2 May 2001 PERFORMANCE SPECIFICATION CAPACITOR, FIXED, CERAMIC, MULTILAYER, HIGH VOLTAGE (GENERAL PURPOSE), GENERAL SPECIFICATION FOR T

2、his specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for general purpose, ceramic multilayer high voltage capacitors for use in applications where appreciable variations in capacitan

3、ce with respect to temperature, voltage, frequency, and life can be tolerated (BR and BZ characteristics) (see 6.1), or in critical frequency determining applications, timing circuits, and other applications where absolute stability is required (BP characteristic). 1.2 Classification. Capacitors cov

4、ered by this specification should be classified by the style, as specified (see 3.1). 1.2.1 Part or Identifying Number (PIN). Capacitors specified herein (see 3.1) should be identified by a PIN which should consist of the basic number of the performance specification and a coded number. The coded nu

5、mber should provide information concerning the characteristic, specification sheet number, capacitance, and capacitance tolerance. The PIN should be in the following form with the coded number derived as indicated: M49467 R 01 101 K Performance Characteristic Performance Capacitance Capacitance spec

6、ification (1.2.1.1) specification (1.2.1.2) tolerance indicating sheet number (1.2.1.3) MIL-PRF-49467 (indicating MIL-PRF-49467/1) 1.2.1.1 Characteristic. The characteristic refers to the voltage-temperature limits of the capacitor. The first letter (B) (not shown) identifies the rated temperature r

7、ange of -55C to +125C. The second letter indicates the voltage temperature limits as shown in table I. TABLE I. Characteristic. Capacitance change with reference to +25C Symbol Step A through step D of table VII Rated voltage Step E through step G of table VIIP 0 ppm/C 30 ppm/C 100 percent 0 ppm/C 3

8、0 ppm/C R 15 percent 100 percent +15, -40 percent Z 15 percent 60 percent +15, -45 percent * Comments, suggestions, or questions on this document should be addressed to: US Army Communications-Electronics Command and Fort Monmouth, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, NJ 07703-5023, or e-mailed t

9、o jeffrey.carvermail1.monmouth.army.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for

10、ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49467C 2 1.2.1.2 Capacitance. The nominal capacitance value, expressed in picofarads (pF) is identified by a three digit number; the first two digits represent significant figures and the last digit specifies the numb

11、er of zeros to follow. 1.2.1.3 Capacitance tolerance. The capacitance tolerance is identified by a single letter in accordance with table II. TABLE II. Capacitance tolerance. Symbol Capacitance tolerance J 5 percent K 10 percent M 20 percent 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed

12、in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document

13、users are cautioned that they must meet all specified requirements of the documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. * 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form

14、 a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS (See supplement 1 for list of associated specification sheets.) DEPARTMENT OF DEFENSE STANDARDS MIL

15、-STD-202 - Electronic and Electrical Component Parts, Test Methods for. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-810 - Environmental Engineering Con

16、siderations and Laboratory Tests. MIL-STD-1276 - Leads for Electronic Component Parts. * (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/www.assist.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelph

17、ia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. * IPC - Association Connecting Electronics Industries J

18、-STD-004 - Requirements for Soldering Fluxes. J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. * (Copies of these documents are available from http:/ or IPC, Incorporated, 3000 Lakeside Drive Suite 309 S, Banno

19、ckburn IL 60015-1249.) Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49467C 3 ELECTRONIC INDUSTRIES ALLIANCE (EIA) EIA-557 - Statistical Process Control Systems. (DoD ad

20、opted). * (Copies of these documents are available from http:/ or Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (e

21、xcept for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item requirements shall be as spe

22、cified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the latter shall govern. 3.2 Qualification. Capacitors furnished under this specification shall be products which are auth

23、orized by the qualifying activity for listing on the applicable qualified products list (QPL) before contract award. In addition, the manufacturer shall obtain certification from the qualifying activity that the QPL system requirements of 3.3 and 4.2 have been met and are being maintained. Authorize

24、d distributors who are approved to MIL-STD-790 distributor requirements by the QPL manufacturer are listed in the QPL. 3.3 Qualified Products List (QPL) system. The manufacturer shall establish and maintain a QPL system for parts covered by this specification. Requirements for this system are specif

25、ied in MIL-STD-790. In addition, the manufacturer shall establish a Statistical Process Control (SPC) system which meets the requirements of 3.3.1. 3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC system which meets the requirements of EIA-557.

26、 Typical manufacturing processes for application of SPC include raw material mixing and blending, stacking and electrode printing, laminating and dicing, and chip firing. 3.4 Materials. Materials shall be as specified herein. However, when a definite material is not specified, a material shall be us

27、ed which will enable the capacitors to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guarantee of the acceptance of the finished product. 3.4.1 Insulating and impregnating compounds. Insulating and impregnating

28、 compounds, including resins, varnishes, waxes, and the like, shall be suitable for each particular application. Compounds shall preserve the electrical characteristics of the insulation to which they are applied. * 3.4.2 Solder and soldering flux. Solder and soldering flux shall be in accordance wi

29、th J-STD-006 and J-STD-004, respectively. 3.5 Interface and physical dimension requirements. Capacitors shall meet the interface and physical dimensions specified (see 3.1). 3.5.1 Terminals. 3.5.1.1 Solder dip (retinning). The manufacturer (or his authorized category C distributor) may solder dip/re

30、tin the leads of capacitors supplied to this specification, provided the solder dip process (see appendix A) has been approved by the qualifying activity. 3.5.1.2 Tin plated finishes. Tin plating is prohibited as a final finish or as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided th

31、at the minimum lead content is 3 percent (see 6.5). Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49467C 4 3.6 Thermal shock and voltage conditioning. When tested as spe

32、cified in 4.8.2, capacitors shall withstand the extremes of high and low temperature without visible damage and meet the following requirements: a. Dielectric withstanding voltage (at +25C): As specified in 3.9, shall be performed after the thermal shock test only. * b. Insulation resistance (at +25

33、C): Shall be as specified in 3.12. * c. Insulation resistance (at elevated ambient temperature): Shall be as specified in 3.12. d. Dissipation factor (at +25C): Shall not exceed the value as specified. e. Capacitance (at +25C): Shall be within the tolerance as specified. 3.7 Capacitance. When measur

34、ed as specified in 4.8.3, the capacitance shall be within the specified tolerance. 3.8 Dissipation factor. When determined as specified in 4.8.4, the dissipation factor shall not exceed the percent as specified. 3.9 Dielectric withstanding voltage. Capacitors shall withstand direct current (dc) pote

35、ntial as specified in 4.8.5 without damage or breakdown. 3.10 Partial discharge (corona). When measured as specified in 4.8.6, the corona inception voltage (CIV) at the 100 picocoulombs (pC) level shall not be less than 0.42 times (dc rated V) rms volts. 3.11 Resistance to soldering heat. When teste

36、d as specified in 4.8.7, capacitors shall meet the following requirements: a. Insulation resistance at +25C: Not less than the initial +25C requirement. b. Capacitance: Shall not change more than -1.0 percent to +6.0 percent of initial measured value (BR and BZ characteristics) or -1.0 percent to +2

37、.0 percent or 0.5 pF, whichever is greater, of initial measured value (BP characteristic). c. Dissipation factor: Shall not exceed the initial limits. * 3.12 Insulation resistance. When measured as specified in 4.8.8, the insulation resistance shall be not less than the following: * a. At 25C: 100,0

38、00 megohms or 1,000 Megohm-microfarad, whichever is less. * b. At 125C: 10,000 megohms or 100 Megohm-microfarad, whichever is less. 3.13 Solderability. When capacitors are tested as specified in 4.8.9, the dipped surface of the leads shall be at least 95 percent covered with a new, smooth, solder co

39、ating. The remaining 5 percent may contain only small pinholes or rough spots; these shall not be concentrated in one area. Bare base metal where the solder dip failed to cover the original coating is an indication of poor solderability, and pinholes or rough spots shall be determined by actual meas

40、urement of these areas, as compared to the total area. 3.14 Voltage-temperature limits. The capacitance change over the range of temperatures as specified in 4.8.10 shall not exceed the limits as specified in table I. The capacitance value obtained in step C of table VII shall be considered as the r

41、eference point. 3.15 Vibration, high frequency. When capacitors are tested as specified in 4.8.11, there shall be no intermittent contact of 0.5 millisecond (ms) or greater duration, open-circuiting or short-circuiting, or evidence of mechanical damage. Copyright Communications - Electronics Command

42、 Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49467C 5 3.16 Immersion. When tested as specified in 4.8.12, capacitors shall meet the following requirements: a. Visual examination: No mechanical damage. Marking shall

43、 remain legible. b. Dielectric withstanding voltage: As specified in 3.9. c. Insulation resistance: Not less than the value specified. d. Capacitance: Change not to exceed 10 percent of initial measured value (BR and BZ characteristics) or 0.5 percent or 5 pF, whichever is greater, of initial measur

44、ed value (BP characteristic). e. Dissipation factor: Shall not exceed initial limits. 3.17 Shock, specified pulse. When tested as specified in 4.8.13, there shall be no momentary or intermittent contact of 0.5 ms or greater duration, open-circuiting or short-circuiting, or other evidence of breakdow

45、n, arcing, and mechanical damage. 3.18 Terminal strength. When capacitors are tested as specified in 4.8.14, there shall be no loosening or rupturing of the terminals. 3.19 Moisture resistance. When tested as specified in 4.8.15, capacitors shall meet the following requirements: a. Visual examinatio

46、n: No mechanical damage. Marking shall remain legible. b. Dielectric withstanding voltage: As specified in 3.9. c. Insulation resistance: Not less than 10 percent of the initial +25C requirement. d. Capacitance: Change not to exceed 10 percent of initial measured value (BR and BZ characteristics) or

47、 0.5 percent or 5 pF, whichever is greater, of initial measured value (BP characteristic). 3.20 Fungus. The manufacturer shall certify that all materials are fungus resistant or shall perform the test as specified in 4.8.16. When capacitors are tested as specified in 4.8.16, there shall be no eviden

48、ce of fungus growth on the external surface. 3.21 Resistance to solvents. When capacitors are tested as specified in 4.8.17, there shall be no evidence of mechanical damage and the marking shall remain legible. a. INK: Capacitors marked with ink (INK) or laser etched and back filled with ink shall b

49、e examined in the qualification and group B inspections. b. OLM: Capacitors over-coated and then laser marked (OLM) shall be examined in the qualification and group B inspections. c. NLM: Capacitors not over-coated prior to laser marking (NLM) and etched directly into the bodies shall be examined in the qualification and group B inspections. 3.22 Life (at elevated ambient temperature). When tested as specified in 4.8.18, capacitors shall meet t