ASHRAE 90577-2015 Thermal Guidelines for Data Processing Environments (Fourth Edition).pdf

1、1ASHRAE Datacom Series, Book 11791 Tullie Circle, NEAtlanta, GA 30329-2305www.ashrae.org/bookstoreASHRAE Datacom Series1Guidance Every Data Center Designer and Operator NeedsIT equipment environmental requirements are often mismatched with adja-cent equipment requirements or with facility operating

2、conditions. How can HVAC equipment manufacturers and installers, data center designers, and facility operators find common solutions and standard practices that facilitate IT equipment interchangeability while preserving industry innovation?Thermal Guidelines for Data Processing Environments provide

3、s a frame-work for improved alignment of efforts among IT equipment hardware manufacturers (including manufacturers of computers, servers, and storage products), HVAC equipment manufacturers, data center designers, and facil-ity operators and managers.This guide covers five primary areas: Equipment

4、operating environment guidelines for air-cooled equipment Environmental guidelines for liquid-cooled equipment Facility temperature and humidity measurement Equipment placement and airflow patterns Equipment manufacturers heat load and airflow requirement reportingThis fourth edition of Thermal Guid

5、elines features updated information as well as new discussions on topics such as increasing energy efficiency by allowing re-duced moisture levels with minimum risk of electrostatic discharge. The guide provides groundbreaking, vendor-neutral information that will empower data center designers, oper

6、ators, and managers to better determine the impact of varying design and operation parameters. The book comes with a removable reference card with helpful information for facility managers and others. The ref-erence card may also be accessed online.This book is the first in the ASHRAE Datacom Series

7、, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Data Centers, Technol-ogy Spaces and Electronic Equipment. The series provides comprehensive treatment of datacom cooling and related subjects.P9 781939 20002 0ISBN 978-1-939200-02-0 (paperback)ISBN 978-1-939200-03-7 (PDF)Pro

8、duct code: 90577 12/15Thermal Guidelines for Data Processing EnvironmentsFourth Edition Thermal Guidelines for Data Processing Environments | Fourth EditionRP-1499ThermalGuidelines, 4th ed.indd 1 12/16/2015 3:02:55 PMThermal Guidelines forData ProcessingEnvironmentsFourth EditionRP-1499Thermal Guide

9、lines for Data Processing Environments is authored by ASHRAE Tech-nical Committee(TC) 9.9,MissionCritical Facilities,Technology SpacesandElectronicEquipment. ASHRAE TC 9.9 is composed of a wide range of industry representatives,including but not limited to equipment manufacturers, consulting enginee

10、rs, data centeroperators,academia,testinglaboratories,andgovernmentofficialswhoareallcommittedto increasing and sharing the body of knowledge related to data centers.This publication was supported by ASHRAE Research Project RP-1499 under theauspices of TC 9.9.Thermal Guidelines for Data Processing E

11、nvironments is not an ASHRAE Guidelineand has not been developed in accordance with ASHRAEs consensus process.UpdatesanderrataforthispublicationwillbepostedontheASHRAE website at www.ashrae.org/publicationupdatesFor more information on the ASHRAE Datacom Series, visitwww.ashrae.org/datacenterefficie

12、ncy.For more information on ASHRAE TC 9.9, visithttps:/tc0909.ashraetcs.org/.Thermal Guidelinesfor Data ProcessingEnvironmentsFourth EditionASHRAE Datacom SeriesBook 1AtlantaRP-1499ISBN 978-1-939200-02-0 (paperback)ISBN 978-1-939200-03-7 (PDF) 2004, 2008, 2012, 2015 ASHRAE. All rights reserved.1791

13、Tullie Circle, NE Atlanta, GA 30329 www.ashrae.orgASHRAE is a registered trademark of the American Society of Heating, Refrigeratingand Air-Conditioning Engineers, Inc.Cover image by Joe Lombardo of DLB Associates_ASHRAE has compiled this publication with care, but ASHRAE has not investigated, andAS

14、HRAE expressly disclaims any duty to investigate, any product, service, process, proce-dure, design, or the like that may be described herein. The appearance of any technical dataor editorial material in this publication does not constitute endorsement, warranty, or guar-antyby ASHRAE of any product

15、, service,process, procedure, design,or the like. ASHRAEdoes not warrant that the information in the publication is free of errors, and ASHRAE doesnotnecessarily agree with any statementoropinion in this publication. The entire riskof theuse of any information in this publication is assumed by the u

16、ser.No part of this publication may be reproduced without permission in writing fromASHRAE, except by a reviewer who may quote brief passages or reproduce illustrations ina review with appropriate credit, nor may any part of this publication be reproduced, storedinaretrievalsystem,ortransmittedinany

17、wayorbyanymeanselectronic,photocopying,recording,orotherwithoutpermissioninwritingfromASHRAE.Requestsforpermissionshould be submitted at www.ashrae.org/permissions._Library of Congress Cataloging-in-Publication DataNames: American Society of Heating, Refrigerating and Air-ConditioningEngineers.Title

18、: Thermal guidelines for data processing environments.Description: Fourth edition. | Atlanta : ASHRAE, 2015 | Series: ASHRAEdatacom series;1|Includes bibliographical references.Identifiers: LCCN 2015038236| ISBN 9781939200020 (softcover) | ISBN9781939200037 (PDF)Subjects: LCSH: Data processing servi

19、ce centers-Cooling. | Data processingservice centers-Heating and ventilation. | Buildings-Environmentalengineering. | Data processing service centers-Design and construction. |Electronic data processing departments-Equipment andsupplies-Protection. | Electronic apparatus and appliances-Cooling.Class

20、ification: LCC TH7688.C64 T488 2015 | DDC 697.9/316-dc23 LC record available at http:/lccn.loc.gov/2015038236SPECIAL PUBLICATIONSMark Owen, Editor/Group Manager of Handbook and Special PublicationsCindy Sheffield Michaels, Managing EditorMatt Walker, Managing Editor of StandardsSarah Boyle, Assistan

21、t EditorLauren Ramsdell, Assistant EditorMichshell Phillips, Editorial CoordinatorPUBLISHING SERVICESDavid Soltis, Group Manager of Publishing Services and Electronic CommunicationsJayne Jackson, Publication Traffic AdministratorPUBLISHERW. Stephen ComstockPreface to the Fourth Edition.xiAcknowledgm

22、ents.xiiiChapter 1Introduction.11.1 Book Flow31.2 Primary Users of This Book 51.3 Compliance.51.4 Definitions and Terms.5Chapter 2Environmental Guidelines for Air-Cooled Equipment. . . 92.1 Background.92.2 New Air-Cooled Equipment Environmental Specifications112.2.1 Environmental Class Definitionsfo

23、r Air-Cooled Equipment.122.3 Guide for the Use and Application of theASHRAE Data Center Classes212.4 Server Metrics to Guide Use of New Guidelines .222.4.1 Server Power Trend Versus Ambient Temperature.242.4.2 Acoustical Noise Levels in Data Center VersusAmbient Temperature .262.4.3 Server Reliabili

24、ty Trend Versus Ambient Temperature . . 282.4.4 Server Reliability Versus Moisture, Contamination,and Other Temperature Effects312.4.5 Server Performance Trend VersusAmbient Temperature .342.4.6 Server Cost Trend Versus Ambient Temperature 352.4.7 Summary of New Air-Cooled EquipmentEnvironmental Spe

25、cifications .35Chapter 3Environmental Guidelines forLiquid-Cooled Equipment.373.1 ITE Liquid Cooling 383.1.1 New Construction 38Contentsvi Contents3.1.2 Expansions 393.1.3 High Density and HPC .393.2 Facility Water Supply Characteristics for ITE.413.2.1 Facility Water Supply Temperature Classes for

26、ITE.423.2.2 Condensation Considerations433.2.3 Operational Characteristics .443.2.4 Water Flow Rates/Pressures 463.2.5 Velocity Limits463.2.6 Water Quality 463.3 Liquid-Cooling Deployments in NEBS-Compliant Spaces.463.3.1 NEBS Space Similarities and Differences 473.3.2 Use of CDU in NEBS Spaces483.3

27、.3 Refrigerant Distribution Infrastructure493.3.4 Connections .493.3.5 Condensation Consideration 493.3.6 Close-Coupled Cooling Units 49Chapter 4Facility Temperature and Humidity Measurement .514.1 Facility Health and Audit Tests .514.1.1 Aisle Measurement Locations524.1.2 HVAC Operational Status.54

28、4.1.3 Evaluation.544.2 Equipment Installation Verification Tests544.3 Equipment Troubleshooting Tests.55Chapter 5Equipment Placement and Airflow Patterns 595.1 Equipment Airflow .595.1.1 Airflow Protocol Syntax.595.1.2 Airflow Protocol for Equipment .595.1.3 Cabinet Design .615.2 Equipment Room Airf

29、low 615.2.1 Placement of Cabinets and Rows of Cabinets .615.2.2 Cabinets with Dissimilar Airflow Patterns .625.2.3 Aisle Pitch.63Chapter 6Equipment Manufacturers Heat andAirflow Reporting 656.1 Providing Heat Release and Airflow Values .656.2 Equipment Thermal Report 666.3 EPA ENERGY STARReporting69

30、6.3.1 Server Thermal Data Reporting Capabilities 70Thermal Guidelines for Data Processing Environments, Fourth Edition viiAppendix A2015 ASHRAE Environmental Guidelines forDatacom EquipmentExpanding theRecommended Environmental Envelope 71A.1 Dry-Bulb Temperature Limits 73A.1.1 Low End .73A.1.2 High

31、 End .74A.2 Moisture Limits.76A.2.1 High End .76A.2.2 Low End .77A.3 Acoustical Noise Levels 77A.4 Data Center Operation Scenarios for the2008 Recommended Environmental Limits .78Appendix B2015 Air-Cooled EquipmentThermal Guidelines (I-P)81Appendix CDetailed Flowchart for theUse and Application of t

32、he ASHRAE Data Center Classes85C.1 Notes for Figure C.2, Figure C.3, and Figure C.4 85C.2 Nomenclature for Figure C.2, Figure C.3, and Figure C.485Appendix DESD Research and Static Control Measures91D.1 ESD Background .96D.2 Personnel and Operational Issues98D.3 Flooring Issues.98D.3.1 Measuring Flo

33、or Resistance 99D.4 Further Reading99Appendix EOSHA and Personnel Working inHigh Air Temperatures 101Appendix FPsychrometric Charts .103Appendix GAltitude Derating Curves 107Appendix HPractical Example of the Impact ofCompressorless Cooling on Hardware Failure Rates .109Appendix IITE Reliability Dat

34、a forSelected Major U.S. and Global Cities113I.1 Notes on Figures and Tables114viii ContentsAppendix JMost Common Problems inWater-Cooled Systems 129J.1 Corrosion .129J.2 FoulingInsoluble Particulate Matter in Water 130J.3 ScalePrecipitation of Salts Directly on Metal Surfaces.130J.4 Microbiological

35、ly Induced CorrosionCorrosion Due to Bacteria, Fungi, and Algae130Appendix KAllowable Server Inlet Temperature Rate of Change. . .133Appendix LAllowable Server Inlet RH Limits VersusMaximum Inlet Dry-Bulb Temperature .137References and Bibliography .141ThermalGuidelinesforDataProcessingEnvironments,

36、FourthEdition,isaccompaniedby online content, which can be found at https:/www.ashrae.org/datacom1_4th. Thesefilesprovidehelpfulspreadsheets.Ifthefilesorinformationatthelinkarenotaccessible,please contact the publisher.Prior to the 2004 publication of the first edition of Thermal Guidelines for Data

37、Processing Environments, there was no single source in the data center industry forinformation technology equipment (ITE) temperature and humidity requirements.Thisbookestablishedgroundbreakingcommondesignpointsendorsedbythemajorinformation technology original equipment manufacturers (IT OEMs). The

38、secondedition,publishedin2008,createdanewprecedentbyexpandingtherecommendedtemperature and humidity ranges.The third edition (2012) broke new ground through the addition of new datacenter environmental classes that enable near-full-time use of free-cooling tech-niques in most of the worlds climates.

39、 This exciting development also broughtincreased complexity and tradeoffs that required more careful evaluation in theirapplication due to the potential impact on the ITE to be supported.This fourth edition takes further steps to increase the energy efficiency of datacentersbyreducingtherequirements

40、forhumidification.ASHRAEfundedtheElec-tromagneticCompatibility(EMC)LaboratoryattheMissouriUniversityofScienceand Technology from 2011 to 2014 to investigate the risk of upsets or damage toelectronics related to electrostatic discharge (ESD). Emphasis was placed on theincreaseinriskwithreducedhumidit

41、y.Theresultsfromthisstudy(PommerenkeandSwenson 2014) show that a data center with a low incident rate of ESD-induceddamage operating at 25% rh will maintain a low incident rate if the humidity isreducedto8%.TheconcernsraisedpriortothestudyregardingtheincreaseinESD-induced risk with reduced humidity

42、are not justified. As a result of this study,changes have been made in the fourth edition of this book to two environmentalenvelopes as well as the recommended envelope.A cornerstone idea carried over from previous editions is that inlet tempera-ture is the only temperature that matters to ITE. Alth

43、ough there are reasons towant to consider the impact of equipment outlet temperature on the hot aisle, itdoes not impact the reliability or performance of the ITE. Also, each manufac-turer balances design and performance requirements when determining theirequipment design temperature rise. Data cent

44、er operators should expect tounderstand the equipment inlet temperature distribution throughout their datacenters and take steps to monitor these conditions. A facility designed to maxi-mize efficiency by aggressively applying new operating ranges and techniqueswillrequireacomplex,multivariableoptim

45、izationperformedbyanexperienceddata center architect.Preface to the Fourth Editionxii Preface to the Fourth EditionAlthough the vast majority of data centers are air cooled at the IT load, liquidcooling is becoming more commonplace and likely will be adopted to a greaterextent due to the enhanced op

46、erational efficiency, potential for increased density,and opportunity for heat recovery. Consequently, the fourth edition of ThermalGuidelines for Data Processing Environments includes definitions of liquid-cooledenvironmental classes and descriptions of their applications. Even a primarilyliquid-co

47、oled data center may have air-cooled IT within. As a result, a combinationof air-cooled and liquid-cooled classes will typically be specified.ASHRAETC9.9wouldliketothankthefollowingmembersoftheITsubcom-mittee for their groundbreaking work and willingness to share in order to further theunderstanding

48、 of the entire data center industry and for their active participation,including conference calls, writing/editing, and reviews: Mike Ellsworth, DustinDemetriou, and Roger Schmidt (IBM); Robin Steinbrecher (Intel); Jason Matteson(Lenovo); Jon Fitch and Dave Moss (Dell); David Moore (HP); Jean-Christ

49、opheBonin (Bull); Jei Wei (Fujitsu); and David Wang (Teradata). Thanks also to RogerSchmidt for leading the effort on updating this fourth edition.A special thanks to the Electromagnetic Compatibility (EMC) Laboratory atMissouri University of Science and Technology and the leadership of ProfessorPommerenkeandhisteamforcarryingouttheresearchtoinvestigatetheriskofelec-trostatic discharge (ESD) to electronics in data centers. The result of this work w