ASTM B32-2004 Standard Specification for Solder Metal《焊料金属的标准规范》.pdf

1、Designation: B 32 04Standard Specification forSolder Metal1This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revision. A number in parentheses indicates the y

2、ear of last reapproval. A superscriptepsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This specification covers solder metal alloys (commonlyknown as soft solders) used in non-

3、electronic applications,including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the pur-pose of joining together two or more metals at temperaturesbelow their melting points. Ele

4、ctronic grade solder alloys andfluxed and non-fluxed solid solders for electronic solderingapplications are not covered by this specification as they areunder the auspices of IPC Association Connecting ElectronicIndustries.1.1.1 These solders include those alloys having a liquidustemperature not exc

5、eeding 800F (430C).1.1.2 This specification includes solders in the form of solidbars, ingots, powder and special forms, and in the form of solidand flux-core ribbon, wire, and solder paste.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses a

6、re forinformation only.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to become familiarwith all hazards including those identified in the appropriateMaterial Safety Data Sheet for this pr

7、oduct/material as pro-vided by the manufacturer, to establish appropriate safety andhealth practices, and determine the applicability of regulatorylimitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 269 Test Method for Insoluble Matter in Rosin and RosinDerivativesD 464 Test Method

8、s for Saponification Number of NavalStore Products Including Tall Oil and Other RelatedProductsD 465 Test Methods for Acid Number of Naval StoresProducts Including Tall Oil and Other Related ProductsD 509 Test Methods of Sampling and Grading RosinE 28 Test Methods for Softening Point of Resins Deriv

9、edfrom Naval Stores by Ring-and-Ball ApparatusE 29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE 46 Test Methods for Chemical Analysis of Lead- andTin-Base Solder3E 51 Method for Spectrographic Analysis of Tin Alloys bythe Powder Technique3E 55 Pract

10、ice for Sampling Wrought Nonferrous Metals andAlloys for Determination of Chemical CompositionE 87 Methods for Chemical Analysis of Lead, Tin, Anti-mony, and Their Alloys (Photometric Method)3E 88 Practice for Sampling Nonferrous Metals and Alloysin Cast Form for Determination of Chemical Compositio

11、n2.2 Federal Standard:4Fed. Std. No. 123 Marking for Shipment (Civil Agencies)2.3 Military Standard:5MIL-STD-129 Marking for Shipment and Storage3. Terminology3.1 Definition:3.1.1 producer, nthe primary manufacturer of the mate-rial.3.2 Definitions of Terms Specific to This Standard:3.2.1 lot, nThe

12、term “lot” as used in this specification isdefined as follows:3.2.1.1 DiscussionFor solid solder metal, a lot consists ofall solder of the same type designation, produced from thesame batch of raw materials under essentially the sameconditions, and offered for inspection at one time.3.2.1.2 Discussi

13、onFor fluxcore solder, a lot consists ofall solder of the same core mixture, produced from the same1This specification is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and is the direct responsibility of SubcommitteeB02.02 on Refined Lead, Tin, Antimony, and Their Alloy

14、s.Current edition approved Nov. 1, 2004. Published November 2004. Originallyapproved in 1919. Last previous edition approved in 2003 as B 32 - 03.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards

15、 volume information, refer to the standards Document Summary page onthe ASTM website.3Withdrawn.4Available from Global Engineering Documents, 15 Inverness Way East,Englewood, CO 80112.5Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 19111-509

16、4, Attn: NPODS.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.batch of raw materials under essentially the same conditionsand offered for inspection at one time.3.2.2 lot number, nThe term “lot number” as used in thisspecification r

17、efers to an alphanumeric or numerical designa-tion for a lot which is traceable to a date of manufacture.4. Classification4.1 Type DesignationThe type designation uses the fol-lowing symbols to properly identify the material:4.1.1 Alloy CompositionThe composition is identified bya two-letter symbol

18、and a number. The letters typically indicatethe chemical symbol for the critical element in the solder andthe number indicates the nominal percentage, by weight, of thecritical element in the solder. The designation followed by theletters A or B distinguishes between different alloy grades ofsimilar

19、 composition (see Table 1).4.1.2 FormThe form is indicated by a single letter inaccordance with Table 2.4.1.3 Flux TypeThe flux type is indicated by a letter orcombination of letters in accordance with Table 3.4.1.4 Core Condition and Flux Percentage (applicable onlyto flux-cored solder)The core con

20、dition and flux percentageis identified by a single letter and a number in accordance withTable 4.4.1.5 Powder Mesh Size and Flux Percentage (applicableonly to solder paste)The powder mesh size and flux percent-age is identified by a single letter and a number in accordancewith Table 5.5. Ordering I

21、nformation5.1 Orders for material under this specification indicate thefollowing information, as required, to adequately describe thedesired material.5.1.1 Type designation (see 4.1),5.1.2 Detailed requirements for special forms,5.1.3 Dimensions of ribbon and wire solder (see 9.2),5.1.4 Unit weight,

22、5.1.5 Packaging (see Section 18),5.1.6 Marking (see Section 17),5.1.7 ASTM specification number and issue, marked on (a)purchase order and (b) package or spool, and5.1.8 Special requirements, as agreed upon between sup-plier and purchaser.6. Materials and Manufacture6.1 The producer must have each l

23、ot of solder metal asuniform in quality as practicable and of satisfactory appearancein accordance with best industrial practices. Each bar, ingot, orother form in which the solder is sold must be uniform incomposition with the entire lot.7. Chemical Composition7.1 Solder AlloyThe solder alloy compo

24、sition is as speci-fied in Table 1.NOTE 1By mutual agreement between supplier and purchaser, analy-sis may be required and limits established for elements or compounds notspecified in Table 1.7.2 Flux (applicable to flux-core ribbon, wire, and solderpaste):7.2.1 Type RThe flux is composed of Grade W

25、W or WGgum rosin of Test Methods D 509. The rosin shall have atolueneinsoluble matter content of not more than 0.05weight % in accordance with Test Method D 269, a minimumacid number of 160 mg KOH/1 g sample in accordance withTest Methods D 465, a minimum softening point of 70C inaccordance with Tes

26、t Methods E 28, and a minimum saponi-fication number of 166 in accordance with Test MethodsD 464. When solvents or plasticizers are added, they must benonchlorinated.7.2.2 Type RMAThe flux is composed of rosin conform-ing to 7.2.1. Incorporated additives provide a material meetingthe requirements of

27、 8.1.2 for type RMA. When solvents orplasticizers are added, they must be nonchlorinated.7.2.3 Type RAThe flux is composed of rosin conformingto 7.2.1. Incorporated additives provide a material meeting therequirements of 8.1.2 for Type RA. When solvents or plasti-cizers are added, they must be nonch

28、lorinated.7.2.4 Type OAThe flux is composed of one or morewater-soluble organic materials.7.2.5 Type OSThe flux is composed of one or morewater-insoluble organic materials, other than Types R, RMA,and RA, which are soluble in organic solvents.7.2.6 Type ISThe flux is composed of one or moreinorganic

29、 salts or acids with or without an organic binder andsolvents.8. Physical Properties and Performance Requirements8.1 Solder PasteSolder paste must exhibit smoothness oftexture (no lumps) and the absence of caking and drying.8.1.1 Powder Mesh SizeThe solder powder mesh sizeshall be as specified (see

30、5.1.1 and 4.1.5) when the extractedsolder powder is tested as specified in 13.4.8.1.2 ViscosityThe viscosity of solder paste and themethod used to determine the viscosity must be agreed uponbetween the supplier and purchaser. The following variablesmust be taken into account when relating one viscos

31、itymeasurement to another type of viscometer used, spindle sizeand shape, speed (r/min), temperature of sample, and the use ornon-use of a helipath.8.2 Requirements for FluxThe flux must meet the physi-cal and performance requirements specified in Table 6 asapplicable.8.2.1 Solder PoolWhen solder is

32、 tested as specified in13.3.2, there must be no spattering, as indicated by thepresence of flux particles outside the main pool of residue. Theflux must promote spreading of the molten solder over thecoupon to form integrally thereon a coat of solder that shallfeather out to a thin edge. The complet

33、e edge of the solder poolmust be clearly visible through the flux residue.8.2.2 DrynessWhen solder is tested as specified in 13.3.2,the surface of the residue must be free of tackiness, permittingeasy and complete removal of applied powdered chalk.8.2.3 Chlorides and Bromides TestWhen the extractedf

34、lux is tested as specified in 13.3.6, the test paper will show nochlorides or bromides by a color change of the paper tooff-white or yellow white.8.2.4 Copper Mirror TestWhen tested as specified in13.3.7, the extracted flux will have failed the test if, whenB32042TABLE1SolderCompositions-wt%(rangeor

35、maximum)Composition,%AMeltingRangeBAlloy GradeSn1Pb2Sb3Ag4Cu5Cd6Al7Bi8As9Fe 10Zn 11Ni 12Ce 13Se 14SolidusLiquidusUNSNumberFCFCSection1:SolderAlloysContainingLessthan0.2%LeadCSn96Rem0.100.123.43.80.080.0050.0050.150.05max0.020.005.430221430221L13965Sn95Rem0.100.124.44.80.080.0050.0050.150.050.020.005

36、.430221473245L13967Sn94Rem0.100.125.45.80.080.0050.0050.150.050.020.005.430221536280L13969Sb594.0min0.204.5-5.50.0150.080.0050.0050.150.050.040.005.450233464240L13950EDRem0.100.050.250.753.05.00.0050.0050.020.050.020.005.440225660349L13935HADRem0.100.54.00.13.00.12.00.0050.0050.150.050.020.54.0.4202

37、16440227L13955HBDRem0.104.06.00.050.52.05.00.0050.0050.150.050.020.010.052.0.460238660349L13952HNDRem0.100.050.050.153.54.50.0050.0050.150.050.020.0050.15-0.25.440225660350L13933PTDRem0.20.254.00.050.500.254.00.0050.0050.150.010.020.0050.0050.01 0.25.430221435224ACDRem0.100.050.20.30.10.30.0050.0052

38、.753.750.050.020.0050.001.403206453234L13964OADRem0.20.050.050.32.04.00.0050.0050.51.50.050.040.05.420216460238L13937AMRem0.100.81.20.40.62.83.20.0050.0050.150.050.020.005.430220446230L13938TCRem0.200.050.0154.05.00.0050.0050.050.050.040.0050.005.0.04 0.20419215660350L13931WSRem0.101.01.50.20.63.54.

39、50.0050.0050.020.050.020.005.440225660350L13939Section2:SolderAlloysContainingLeadSn7069.571.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183377193L13700Sn6362.563.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183361183L13630Sn6261.562.5Rem0.501.752.250.080.0010.0050.250.030.020.005.35417937218

40、9L13620Sn6059.561.5Rem0.500.0150.080.0010.0050.250.030.020.005.361183374190L13600Sn5049.551.5Rem0.500.0150.080.0010.0050.250.0250.020.005.361183421216L55031Sn4544.546.5Rem0.500.0150.080.0010.0050.250.0250.020.005.361183441227L54951Sn40A39.541.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183460238

41、L54916Sn40B39.541.5Rem1.82.40.0150.080.0010.0050.250.020.020.005.365185448231L54918Sn35A34.536.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183447247L54851Sn35B34.536.5Rem1.62.00.0150.080.0010.0050.250.020.020.005.365185470243L54852Sn30A29.531.5Rem0.500.0150.080.0010.0050.250.020.020.005.36118349

42、1255L54821Sn30B29.531.5Rem1.41.80.0150.080.0010.0050.250.020.020.005.365185482250L54822Sn25A24.526.5Rem0.500.0150.080.0010.0050.250.020.020.005.361183511266L54721Sn25B24.526.5Rem1.11.50.0150.080.0010.0050.250.020.020.005.365185504263L54722Sn20A19.521.5Rem0.500.0150.080.0010.0050.250.020.020.005.3611

43、83531277L54711Sn20B19.521.5Rem0.81.20.0150.080.0010.0050.250.020.020.005.363184517270L54712Sn1514.516.5Rem0.500.0150.080.0010.0050.250.020.020.005.437225554290L54560Sn10A9.011.0Rem0.500.0150.080.0010.0050.250.020.020.005.514268576302L54520Sn10B9.011.0Rem0.201.72.40.080.0010.0050.030.020.020.005.5142

44、68570299L54525Sn54.55.5Rem0.500.0150.080.0010.0050.250.020.020.005.586308594312L54322Sn21.52.5Rem0.500.0150.080.0010.0050.250.020.020.005.601316611322L54210Ag1.50.751.25Rem0.401.31.70.300.0010.0050.250.020.020.005.588309588309L50132Ag2.50.25Rem0.402.32.70.300.0010.0050.250.020.020.005.580304580304L5

45、0151Ag5.50.25Rem0.405.06.00.300.0010.0050.250.020.020.005.580304716380L50180AForpurposesofdeterminingconformancetotheselimits,anobservedvalueorcalculatedvalueobtainedfromanalysisshallberoundedtothenearestunitinthelastright-handplaceoffiguresusedinexpressingthespecifiedlimit,inaccordancewiththeroundi

46、ngmethodofPracticeE29.BTemperaturesgivenareapproximationsandforinformationonly.CForalloysnotidentified,namedelementsshallconformtothefollowingtolerances(wt%):5%60.5%,=5%60.25%;Impurityelements(maximum):Sn-0.2,Pb-0.2,Sb-0.5,Ag-0.015,Cu-0.08,Cd-0.005,Al-0.05,Bi-0.15,As-0.02,Fe-0.02,Zn-0.005.DGradesEan

47、dOAarecoveredbyU.S.patentsheldbyEngelhardCorp,Mansfield,MA,andOateyCo.Cleveland,OHrespectively.FederatedFryMetals,Altoona,PAandTaracorpInc.,Atlanta,GAhaveappliedforpatentsongradesACandTCrespectively.GradesHA,HB,andHNarecoveredbypatentsassignedtoJ.W.HarrisCo.,Cincinnati,OH.GradePTiscoveredbyapatentis

48、suedtoPreciseAlloysCorporation,Bronx,NY.InterestedpartiesareinvitedtosubmitinformationregardingidentificationofacceptablealternativestothesepatenteditemstotheCommitteeonStandards,ASTMInternationalHeadquarters,100BarrHarborDrive,WestConshohocken,PA19428.Yourcommentswillreceivecarefulconsiderationatam

49、eetingoftheresponsibletechnicalcommittee1,whichyoumayattend.OAvalueforFe10wascorrectededitorially.B32043examined against a white background, complete removal of thecopper film is noted, as evidenced by the white backgroundshowing through, and must be rejected. Discoloration of thecopper due to a superficial reaction or to only a partialreduction of the thickness of the copper film is not cause forrejection.9. Dime