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本文(ASTM B907-2009 Standard Specification for Zinc Tin and Cadmium Base Alloys Used as Solders《锌、锡和镉基焊料的标准规范》.pdf)为本站会员(刘芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ASTM B907-2009 Standard Specification for Zinc Tin and Cadmium Base Alloys Used as Solders《锌、锡和镉基焊料的标准规范》.pdf

1、Designation: B907 09Standard Specification forZinc, Tin and Cadmium Base Alloys Used as Solders1This standard is issued under the fixed designation B907; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A

2、number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers solder metal alloys (commonlyknown as soft solders), including zinc-aluminum, zinc-aluminum-copper, zinc-tin

3、, zinc-tin-copper, zinc-cadmium-tin,zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver,and cadmium-silver, used as solders for the purpose of joiningtogether two or more metals at temperatures below theirmelting points.1.1.1 Certain alloys specified in this standard are also usedas Thermal Sp

4、ray Wire in the electronics industry and arecovered for this purpose in Specification B943. SpecificationB833 covers Zinc and Zinc Alloy Wire for Thermal Spraying(Metallizing) used primarily for the corrosion protection ofsteel (as noted in Annex A1 of this specification).1.1.2 Tin base alloys are i

5、ncluded in this specificationbecause their use in the electronics industry is different than themajor use of the tin and lead solder compositions specified inSpecification B32.1.1.3 These solders include alloys having a nominal liqui-dus temperature not exceeding 850F (455C).1.1.4 This specification

6、 includes solder in the form of solidbars, ingots, wire, powder and special forms, and in the form ofsolder paste.1.2 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand

7、 are not considered standard.1.3 ToxicityWarning: Soluble and respirable forms ofcadmium may be harmful to human health and the environmentin certain forms and concentrations. Therefore, ingestion andinhalation of cadmium should be controlled under the appro-priate regulations of the U.S. Occupation

8、al Safety and HealthAdministration (OSHA). Cadmium-containing alloys and coat-ings should not be used on articles that will contact food orbeverages, or for dental and other equipment that is normallyinserted in the mouth. Similarly, if articles using cadmium-containing alloys or coatings are welded

9、, soldered, brazed,ground, flame-cut, or otherwise heated during fabrication,adequate ventilation must be provided to maintain occupationalcadmium exposure below the OSHA Permissible ExposureLevel (PEL).1.4 This standard does not purport to address all of thesafety concerns, if any, associated with

10、its use. It is theresponsibility of the user of this standard to become familiarwith all hazards including those identified in the appropriateMaterial Safety Data Sheet (MSDS) for this product/materialas provided by the manufacturer, to establish appropriatesafety and health practices, and determine

11、 the applicability ofregulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2B32 Specification for Solder MetalB833 Specification for Zinc and Zinc Alloy Wire for Ther-mal Spraying (Metallizing) for the Corrosion Protection ofSteelB899 Terminology Relating to Non-ferrous Metal

12、s andAlloysB943 Specification for Zinc and Tin Alloy Wire Used inThermal Spraying for Electronic ApplicationsE29 Practice for Using Significant Digits in Test Data toDetermine Conformance with SpecificationsE46 Test Methods for Chemical Analysis of Lead- andTin-Base Solder3E51 Method for Spectrograp

13、hic Analysis of Tin Alloys bythe Powder Technique3E55 Practice for Sampling Wrought Nonferrous Metals andAlloys for Determination of Chemical CompositionE87 Methods for Chemical Analysis of Lead, Tin, Anti-mony, and Their Alloys (Photometry Method)3E88 Practice for Sampling Nonferrous Metals and All

14、oys inCast Form for Determination of Chemical CompositionE527 Practice for Numbering Metals and Alloys in the1This specification is under the jurisdiction of ASTM Committee B02 onNonferrous Metals and Alloys and Alloys and is the direct responsibility ofSubcommittee B02.04 on Zinc and Cadmium.Curren

15、t edition approved Oct. 1, 2009. Published November 2009. Originallyapproved in 2000. Last previous edition approved in 2005 as B907 05. DOI:10.1520/B0907-09.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of A

16、STMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Withdrawn.1*A Summary of Changes section appears at the end of this standard.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.Unified Num

17、bering System (UNS)E536 Test Methods for Chemical Analysis of Zinc and ZincAlloys2.2 Federal Standard:4Fed. Std. No. 123 Marking for Shipment (Civil Agencies)2.3 ISO Standards:5ISO 3815-1 Zinc and zinc alloys Part 1:Analysis of solidsamples by optical emission spectrometryISO 3815-2 Zinc and zinc al

18、loys Part 2: Analysis byinductively coupled plasma optical emission spectrometry2.4 Military Standard:4Mil-Std-129 Marking for Shipment and Storage3. Terminology3.1 Terms shall be defined in accordance with TerminologyB899.4. Classification4.1 Type DesignationThe type designation uses the fol-lowing

19、 symbols to properly identify the material:4.1.1 Alloy CompositionThe composition is identified bya two or four-letter symbol and a number. The letters typicallyindicate the chemical symbol for the critical element in thesolder and the number indicates the nominal percentage, byweight, of the critic

20、al element in the solder (see Table 1).4.1.2 FormThe form is indicated by a single letter inaccordance with Table 2.4.1.3 Powder Mesh Size (applicable only to solder paste)The powder mesh size is identified by a single letter inaccordance with Table 3.5. Ordering Information5.1 Orders for material u

21、nder this specification indicate thefollowing information, as required, to adequately describe thedesired material.5.1.1 Type designation (see 4.1),5.1.2 Detailed requirements for special forms,5.1.3 Dimensions of ribbon and wire solder (see 9.2),5.1.4 Unit weight,5.1.5 Packaging (see Section 18),5.

22、1.6 Marking (see Section 17),5.1.7 ASTM Specification number and issue, marked on (a)purchase order and (b) package or spool, and5.1.8 Special requirements, as agreed upon between sup-plier and purchaser.6. Materials and Manufacture6.1 The producer shall have each lot of solder metal asuniform in qu

23、ality as practicable and of satisfactory appearancein accordance with best industrial practices. Each bar, ingot, orother form in which the solder is sold must be uniform incomposition with the entire lot.7. Chemical Composition7.1 Solder AlloyThe solder alloy composition is as speci-fied in Table 1

24、.NOTE 1By mutual agreement between supplier and purchaser, analy-sis may be required and limits established for elements or compounds notspecified in Table 4.8. Physical Properties and Performance Requirements8.1 Solder PasteSolder paste must exhibit smoothness oftexture (no lumps) and the absence o

25、f caking and drying duringstorage and application. Some applications may require a fastdrying formulation.8.1.1 Powder Mesh SizeThe solder powder mesh sizeshall be as specified (see Section 4.1.3) when the extractedsolder powder is tested as agreed upon between supplier andpurchaser.8.1.2 ViscosityT

26、he viscosity of solder paste and themethod used to determine the viscosity must be agreed uponbetween the supplier and the purchaser.8.2 The following variables must be taken into accountwhen relating one viscosity measurement to another: type ofviscometer used, spindle size and shape, speed (r/min)

27、, tem-perature and the recent mixing history of the sample, and theuse or non-use of a helipath.9. Dimensions and Unit Weight9.1 Bar and Ingot SolderThe dimensions and unit weightof bar and ingot solder will be as agreed upon between supplierand purchaser.9.2 Wire SolderThe dimensions and unit weigh

28、t of wiresolder are specified in 5.13 and 5.14. The tolerance on specifiedoutside diameter shall be 6 5%or6 0.002 in. (0.05 mm),whichever is greater.9.3 Other forms:9.3.1 Dimension for ribbon and special forms will be agreedupon between supplier and purchaser.9.3.2 The unit weight of solder paste is

29、 specified in 5.1.4.10. Workmanship, Finish and Appearance10.1 All forms of solder must be processed in such a manneras to be uniform in quality and free of defects that will affectlife, serviceability, or appearance.11. Sampling11.1 Care must be taken to ensure that the sample selectedfor testing i

30、s representative of the material. The method forsampling consists of one of the following methods:11.1.1 Samples taken from the final solidified cast of fabri-cated product.11.1.2 Representative samples obtained from the lot ofmolten metal during casting. The molten sample is poured intoa cool mold,

31、 forming a bar approximately14 in (6.4 mm) thick.11.2 Frequency of SamplingFrequency of sampling fordetermination of chemical composition shall be in accordancewith Table 4. For spools and coils, the sample is obtained bycutting back 6 ft (1.8 m) of wire from the free end and thentaking the next 6 f

32、t for test. In other forms, an equivalentsample is selected at random from the container.4Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:/www.dodssp.daps.mil.5Available from American National Standards Institute (AN

33、SI), 25 W. 43rd St.,4th Floor, New York, NY 10036, http:/www.ansi.org.B907 09211.3 Other aspects of SamplingOther aspects of samplingconforms in the case of bar and ingots, to Practice E88. Forfabricated solders the appropriate reference is Practice E55.12. Specimen Preparation12.1 Solid Ribbon and

34、Wire SolderEach sample of solidribbon and wire solder is prepared in accordance with 12.1 asapplicable.TABLE 1 Solder CompositionsTable 1a: Zinc Base AlloysComposition %A,B,CTemperatureUNSDCd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFCFCZn 98 Z30402 0.005 REM 0.003 0.005 0.10 0.015 0.005

35、1.52.5 0.02 0.002 0.02 0.005 0.02 720 382 770 410Zn 97 Z30505 0.005 REM 0.003 0.005 0.10 0.015 0.005 2.53.5 0.02 0.002 0.02 0.005 0.02 720 382 743 395Zn 96E0.005 REM 0.003 0.005 0.10 0.015 0.005 3.54.5 0.02 0.002 0.02 0.005 0.02 720 382 720 382Zn 95 Z30502 0.005 REM 0.003 0.005 0.10 0.015 0.005 4.55

36、.5 0.02 0.002 0.02 0.005 0.02 720 382 720 382Zn 94E0.005 REM 0.003 0.005 0.10 0.015 1.31.5 3.54.5 0.02 0.002 0.02 0.005 0.02 730 388 734 390Zn 90 Z34550 0.004 88.092.0 0.003 0.005 0.10 0.015 3.06.0 3.06.0 0.02 0.002 0.100 0.005 0.05 720 382 797 425Zn 87 Z30705 0.005 REM 0.003 0.005 0.10 0.015 0.005

37、12.513.5 0.02 0.002 0.05 0.005 0.02 720 382 815 435Zn 85 Z30702 0.005 REM 0.003 0.005 0.10 0.015 0.005 14.016.0 0.02 0.002 0.06 0.005 0.02 720 382 842 450Zn 80 Z30800 0.005 REM 0.003 0.005 0.10 0.015 0.005 19.520.5 0.02 0.002 0.08 0.005 0.02 720 382 896 480Zn/Sn 50 Z56900 0.005 REM 49.051.0 0.05 0.1

38、0 0.015 0.005 0.100 0.02 0.002 0.02 0.005 0.02 388 198 680 360Zn/Sn 49 Z56930 0.005 REM 47.550.5 0.05 0.10 0.015 0.81.3 0.100 0.02 0.002 0.02 0.005 0.05 392 200 592 311Zn/Sn 27FE33.0 26.028.0 REM 0.05 0.10 0.015 0.05 0.050 0.02 0.020 0.02 0.005 0.05 351 177 500 260Zn/Cd 90FZ50940 REM 89.091.0 0.003

39、0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 738 392Zn/Cd 60FZ50980 REM 59.061.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 648 342Table 1b: Tin Base AlloysComposition %A,B,CTemperatureUNSECd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFCFCSn/Zn 60 0

40、.005 REM 59.061.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 666 352Sn/Zn 70 0.005 REM 69.071.0 0.005 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 601 316Sn/Zn 75 0.004 REM 74.076.0 0.20 0.10 0.015 0.05 0.050 0.020 0.020 0.02 0.005 0.05 390 199 572 300Sn/Zn 80 0.005

41、REM 79.081.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 536 280Sn/Zn 91 0.005 REM 90.092.0 0.05 0.10 0.015 0.01 0.100 0.005 0.002 0.02 0.005 0.05 390 199 390 199Table 1c: Cadmium Base AlloysComposition %A,B,CTemperatureUNSECd Zn Sn Pb Sb Ag Cu Al Bi As Fe Ni Mg Solidus LiquidusFC

42、FCCd 60 REM 39.041.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 601 316Cd 70 REM 29.031.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 572 300Cd 78 REM 11.013.0 0.003 0.05 0.10 4.55.5 0.05 0.100 0.02 0.002 0.02 0.005 0.05 480 249 601 316Cd 83 REM 16.01

43、8.0 0.003 0.05 0.10 0.015 0.05 0.100 0.02 0.002 0.02 0.005 0.05 509 265 509 265Cd 95 REM 0.007 0.003 0.05 0.10 4.55.5 0.05 0.100 0.02 0.002 0.02 0.005 0.05 640 338 739 393AFor purposes of acceptance and rejection, the observed value or calculated value obtained from analysis should be rounded to the

44、 nearest unit in the last right-handplace of figures, used in expressing the specified limit, in accordance with the rounding procedure prescribed in Practice E29.BAll values not given as a range are maximum values unless stated otherwise.CRemainder (REM) determined arithmetically by difference.DThe

45、 USN designations were established in accordance with Practice E527. The last digit of a UNS number differentiates between alloys of similar composition.EUNS numbers to be added when assigned.FThese alloys are listed with the zinc base alloys even though they contain significant amounts of cadmium b

46、ecause their use is similar to those of the other alloys inTable 1A.TABLE 2 FormSymbol FormB BarI IngotP PowderR RibbonS SpecialAW WireAIncludes pellets, preforms, etc.TABLE 3 Powder Mesh SizeSize Symbol Powder Mesh SizeA 325B 200C 100D 60B907 09312.2 Bar and Ingot SolderEach sample piece is cut in

47、halfand one half marked and held in reserve. The remaining half ismelted in a clean container, mixed thoroughly and poured intoa cool mold, forming a bar approximately14 in (6.4 mm) thick.Sampling is performed by one of the following methods:12.3 SawingSaw cuts are made across the bar at equalinterv

48、als of not more than 1 in (2.5 cm) throughout its length.If it is impractical to melt the bar or ingot as specified above,saw cuts are made across each piece at equal intervals of notmore than 1 in (2.5 cm) throughout its length. No lubricants areused during sawing. The specimen consists of not less

49、 than 5 oz(143 g).12.4 DrillingThe bar is drilled at least halfway throughfrom the opposite sides. A drill of about12 in (12.7 mm) indiameter is preferred. In drilling, the holes are placed along adiagonal line from one corner of the ingot to the other. Thedrillings are clipped into pieces not over12 in (12.7 mm) inlength and mixed thoroughly. The specimen consists of not lessthan 5 oz (143g).13. Test Methods13.1 Visual and Dimensional Examination13.1.1 Ribbon and Wire SolderRibbon and wire soldermust be examined to verif

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