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本文(ASTM C794-2015 Standard Test Method for Adhesion-in-Peel of Elastomeric Joint Sealants《弹性封缝料的抗撕裂粘附力的标准试验方法》.pdf)为本站会员(arrownail386)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ASTM C794-2015 Standard Test Method for Adhesion-in-Peel of Elastomeric Joint Sealants《弹性封缝料的抗撕裂粘附力的标准试验方法》.pdf

1、Designation: C794 15Standard Test Method forAdhesion-in-Peel of Elastomeric Joint Sealants1This standard is issued under the fixed designation C794; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A numbe

2、r in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S. Department of Defense.1. Scope1.1 This test method covers a laboratory procedure fordete

3、rmining the strength and characteristics of the peel prop-erties of a cured-in-place elastomeric joint sealant, single- ormulticomponent, for use in building construction.1.2 The values stated in metric (SI) units are to be regardedas the standard. The values given in parentheses are providedfor inf

4、ormation only.1.3 The committee with jurisdiction over this standard is notaware of any comparable standards published by other orga-nizations.1.4 This standard does not purport to address all of thesafety problems, if any, associated with its use. It is theresponsibility of the user of this standar

5、d to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2C717 Terminology of Building Seals and SealantsC1375 Guide for Substrates Used in Testing Building Sealsand SealantsE177 Practice

6、 for Use of the Terms Precision and Bias inASTM Test MethodsE691 Practice for Conducting an Interlaboratory Study toDetermine the Precision of a Test Method3. Terminology3.1 The definitions given in Terminology C717 on termsrelating to building seals and sealants are applicable to this testmethod.4.

7、 Summary of Test Method4.1 This test method consists of preparing test specimens byembedding a wire mesh screen between two thin layers of thesealant being tested, on test substrates, curing these specimensunder specified time and conditions, then placing the specimenin a tension-testing machine in

8、such a way that the embeddedwire mesh screen is peeled back from the substrate at 180,while measuring the force exerted as well as the mode offailure of the sealant from the substrate.5. Significance and Use5.1 There are differences in opinion among those concernedwith sealant technology whether or

9、not this adhesion-in-peeltest simulates the type of strain and e-tensile stresses encoun-tered by a sealant in normal use. Nevertheless, this testprovides a valuable measurement of the ability of the curedsealant to maintain a bond to the substrate under severe peelconditions.5.2 Many sealant manufa

10、cturers utilize the adhesion-in-peeltest for determining the adhesive characteristics of sealant/primer combinations with unusual or proprietary substrates.This test is especially useful for quality measurements com-paring batches of the same sealant relative to adhesion or forstudying adhesion of a

11、 given sealant to a variety of substrates.5.3 This test method alone is not appropriate for comparingthe overall performance of different sealants in a given appli-cation. The adhesive force that determines if a given sealant isuseful in a given application also depends on the modulus ofelasticity a

12、nd the degree to which the sealant will be strained.This test, as it exists, does not consider the modulus ofelasticity, nor amount of stress that will be produced by a givenstrain in an actual sealant in a moving joint. No knowncorrelations are given to relate and apply modulus values to thepeel va

13、lues.5.4 This test requires that the results indicate whether thefailure mode is primarily adhesive or cohesive. It is importantto note that a cohesive failure is not necessarily better than anadhesive failure, if the adhesive value is sufficient for theapplication. Having adhesive failure allows on

14、e to study thechange of adhesion with time and with the various stressconditions.1This test method is under the jurisdiction ofASTM Committee C24 on BuildingSeals and Sealants and is the direct responsibility of Subcommittee C24.30 onAdhesion.Current edition approved March 1, 2015. Published April 2

15、015. Originallyapproved in 1975. Last previous edition approved in 2010 as C794 10. DOI:10.1520/C0794-15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standar

16、ds Document Summary page onthe ASTM website.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States16. Apparatus and Materials6.1 Tensile Testing Machine with tension grips capable ofpulling at the rate of separation of approximately 50 mm (2

17、in.)/min, and having a chart indicator calibrated in 0.45-N(0.1-lbf) units.6.2 Standard SubstratesThis test method may be per-formed on a wide variety of substrates. See Guide C1375 for adescription of standard substrates and recommended surfacepreparation. Since adhesive properties of a joint seala

18、nt arerelated to the nature of the substrate, it is strongly recom-mended that whenever possible that adhesion-in-peel testing beperformed on substrate samples that are representative of thebuilding materials. Examples of such substrates include brick,marble, limestone, granite, aluminum, stainless

19、steel, plastic,ceramic tile, and others.6.3 Masking Tape, paper, roll, 25 mm (1 in.) wide.6.4 Wire Mesh Screen3stainless steel or aluminum, 20-mesh,0.4 mm (0.016 in.) wire thickness, cut to a width of 25 + 0, -2mm (1.0 + 0, -0.08 in.) by a minimum length of 250 mm (10in.). The wire mesh screen selec

20、ted must be flexible yet strongenough to not tear during adhesion-in-peel testing. The wiremesh screen must be flat and free of kinks. To ensure adhesionof the joint sealant to the wire mesh, thoroughly clean thescreen prior to use. Sealant primer on the wire mesh screen isgenerally recommended by t

21、he sealant manufacturer to en-hance adhesion of the joint sealant to the screen. Sealant mayalso be pre-applied to the screen to enhance adhesion.6.4.1 DiscussionAdhesion of the joint sealant to the meshscreen is essential to evaluate adhesion-in-peel properties ofthe sealant to the substrate. Due t

22、o the unique characteristics ofeach sealant, the sealant manufacturer must determine for eachsealant the appropriate screen composition, mesh dimension,wire diameter and screen cleaning and priming procedure.Polyester mesh, fiberglass mesh, airplane cloth, fabric, plasticfilm or similar material can

23、 be used in lieu of a wire meshprovided that the material is pliable, of a thickness no greaterthan 0.5 mm (0.02 in.), does not adversely affect sealant cureand does not rupture during adhesion-in-peel testing.6.5 Tooling Devicealuminum or similar rigid material,created to producea2mm(0.08 in.) by 2

24、5 mm (1 in.) sealantbead and 4 mm (0.16 in.) by 25 mm (1 in.) sealant bead aftertooling (Fig. 1). The width of the tooling device may be up to27 mm (1.06 in.) to allow easy tooling of the sealant withoutsnagging the edges of the screen.6.6 Putty Knife, rigid, approximately 40 mm (1.6 in.) wide.6.7 K

25、nife, with sharp razor-type blade.7. Test Specimens and Cure Procedures7.1 Four test specimens (adhesion-in-peel samples) shall beprepared on each of the substrates using the following proce-dures:7.1.1 Condition a minimum of 250 g of sealant for 24 h at23 6 2C (73 6 4F) and 50 6 5 % relative humidi

26、ty.Multi-component sealants will require mixing for 5 min or asrecommended by the sealant manufacturer. Specific mixingequipment and mixing procedures may be recommended by thesealant manufacturer.7.1.2 Unless specified otherwise, standard conditions oftemperature and relative humidity used througho

27、ut this testmethod are defined as 23 6 2C (73 6 4F) and 50 % relativehumidity.7.1.3 Clean and prepare the substrate samples as describedin Guide C1375. Substrate materials not described in C1375should be prepared in accordance with the sealant manufactur-ers recommendations.7.1.4 Apply primer(s) to

28、the substrate(s) if recommended bythe sealant manufacturer.7.1.5 Masking tape can be applied to the substrate surfacesadjacent to the test area to allow easy removal of excess jointsealant.7.1.6 Wire mesh screens must be thoroughly cleaned andprimed, if required, as recommended by the sealant manufa

29、c-turer.7.1.7 For each substrate preparation/cleaning condition tobe tested, apply a bead of sealant at least 100 mm (4 in.) inlength to the substrate surface (Fig. 2).7.1.8 Immediately place the wire mesh screen on the sealantbead and lightly tap it into the joint sealant (Fig. 3).7.1.9 Holding the

30、 screen with a finger to prevent slippage,gently draw down the sealant imbedding the wire mesh into thewet sealant, using the special tooling device side A (Fig. 1)at an 90 angle to the substrate (Fig. 4). The wire mesh screenshould be imbedded to a uniform depth of 2 mm (0.08 in.) fromthe substrate

31、 surface (Fig. 5).3Available from Tetko Inc., 333 South Highland Ave., Briarcliff Manor, NY10510. Also available from McMaster Carr Supply Co., P.O. Box 4355, Chicago, IL60680.NOTE 1A 25 by 2 mm (1 by 0.08 in.) indentationB 25 by 4 mm (1 by 0.16 in.) indentationFIG. 1 Special Tooling DeviceC794 1527

32、.1.10 Immediately apply a second bead of joint sealantover the first bead of sealant and wire mesh screen (Fig. 6).7.1.11 Again holding down the screen with a finger toprevent slippage, use the special tooling device side B (Fig.1) and draw down the sealant at a 90 angle to the substrate.The total d

33、epth of the sealant should be 4 mm (0.16 in.) (Fig.7) and the wire mesh screen should be imbedded uniformly atthe approximate midpoint of the total sealant depth.7.1.12 Excess sealant beyond the edge of the wire meshscreen may be removed while the sealant is wet using a puttyknife or spatula. Avoid

34、moving the screen imbedded in thesealant. Masking tape, if used, should be removed at this time.7.1.13 After the sealant is cured, excess sealant may becarefully removed along the length of the test sample using arazor knife. Fig. 8 shows a final prepared adhesion-in-peel testsample.7.1.14 Allow the

35、 sealant to cure as recommended by thesealant manufacturer. Standard curing time is 21 days atstandard conditions. Curing time and conditions may varydepending on the sealant type and application.FIG. 2 First Sealant Bead Applied to Substrate (with maskingtape)FIG. 3 Wire Mesh Screen being Imbedded

36、in Wet Sealant BeadFIG. 4 Tooling Sealant after Imbedding Wire Screen Mesh withSpecial Tooling Device Side AFIG. 5 Adhesion-in-Peel Test Specimen after Imbedding WireMesh ScreenC794 1538. Test Procedure8.1 Once the sealant is fully cured, gently wrap the looseend of the wire mesh screen and bend bac

37、k. Using a razorknife, provide a fresh cut along the sealant to the substrateinterface (Fig. 9).8.1.1 Place the test specimen in the tensile testing machinewith the substrate secured to the fixed member and the looseend of the wire mesh screen secured to the movable member atan angle of 180 (Fig. 10

38、).8.1.2 Pull the screen at a rate of 50 mm (2 in.)/min for a totalof 1 min (Fig. 11).8.1.2.1 If the screen breaks during the testing, disregard thevalue. If possible, undercut the sealant with a razor knife andrepeat the test. If the screen continues to break, prepare newtest samples using a higher

39、strength wire mesh screen.8.1.2.2 If the sealant peels away cleanly from the screen,disregard the value. Undercut the sealant with the razor knifeand repeat the test. If adhesive failure to the screen continues,prepare new test samples using a more thoroughly cleaned orprimed, or both, wire mesh scr

40、een. If necessary, use a materialother than a wire mesh screen.8.1.2.3 If the adhesion-in-peel test sample shows adhesivefailure to the screen in two repeated attempts but peel forcevalues are above the specified requirements, further sampletesting may not be required. In such cases, report failure

41、modeas screen delamination, since adhesive or cohesive failure ofthe sealant to the substrate is not fully established. The screenshould be pulled for a total of 1 min as described in 8.1.2.NOTE 1DiscussionSome sealants may have a non-homogeneousmode of failure during the initial adhesion-in-peel te

42、sting. During the first30 to 60 s of testing, the sealant may achieve a steady state and longer testduration may be needed to accurately assess the failure mode of thesealant.FIG. 6 Applying Second Bead of SealantFIG. 7 Tooling Second Bead of Sealant with Special Tooling De-viceSideBFIG. 8 Finished

43、Adhesion-in-Peel Test SamplesFIG. 9 Cut Along Sealant/Substrate Interface with Razor KnifeC794 1548.1.3 Record the average peel force in Newton (pound-force) over the duration of the test.8.1.4 Record the peak force in Newton (pound force).8.1.5 Observe and record the approximate percentages ofseala

44、nt failure modes over the total test area. Sealant failure isdescribed as either adhesive or cohesive failure. See Fig. 12 foran example of each failure mode. Failure observed within thesubstrate (that is, paint removal, etc.) should be reported assubstrate failure.8.2 Water Immersion TestUsing eith

45、er four separate testspecimens or the same test specimen used for dry adhesiontesting and following completion of standard cure as describedin 7.1.13, immerse the test samples for 7 days in distilled waterconditioned to 23 6 2C (73 6 4F). Mortar and concretespecimen should be placed in a separate co

46、ntainer from glassand aluminum specimen because the high alkali conditiongenerated could have an adverse effect on the glass andaluminum.8.2.1 Following water immersion, remove the test samples,lightly dry with a cloth or paper towel and test within 10 minas described in 8.1 through 8.1.5.8.3 Additi

47、onal conditions may be used including differentcure conditions, different water temperature or duration ofimmersion, exposure of sealant to chemicals or other materialsor exposure to ultraviolet radiation, heat or weathering.9. Report9.1 Report the following information for each sampletested:9.1.1 D

48、escription of substrate test sample, that is, bronzeanodized aluminum, clear float glass, polished granite, etc.9.1.2 Description of substrate surface preparation andcleaning,9.1.3 Description of screen cleaning, and priming, ifperformed,9.1.4 Identification of the type of sealant, such as single- o

49、rmulti-component, color, product name, etc.,9.1.5 Identification of primer type if used or record “noprimer”,FIG. 10 Adhesion-in-Peel Test Specimen Secured in Tensile Test-ing MachineFIG. 11 Wire Mesh Screen Pulled at 180 on Tensile Testing Ma-chineNOTE 1Left: Cohesive FailureRight: Adhesive FailureFIG. 12 Examples of Cohesive Failure and Adhesive FailureC794 1559.1.6 Average and peak peel strength in Newton (pound-force) for each adhesion-in-peel test,9.1.7 Percent sealant failure type for each adhesion-in-peeltest.9.1.8 Variation, if any, from

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