ASTM C881 C881M-2013 Standard Specification for Epoxy-Resin-Base Bonding Systems for Concrete《混凝土用环氧树脂基粘结系统的标准规范》.pdf

1、Designation: C881/C881M 13Standard Specification forEpoxy-Resin-Base Bonding Systems for Concrete1This standard is issued under the fixed designation C881/C881M; the number immediately following the designation indicates the yearof original adoption or, in the case of revision, the year of last revi

2、sion. A number in parentheses indicates the year of last reapproval.A superscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers two-component, epoxy-resinbonding systems for application to portland-cement concrete,which are able

3、 to cure under humid conditions and bond todamp surfaces.1.2 This specification does not cover epoxy-resin-basebonding systems that have been modified by addition ofcomponents such as cement, fine aggregate, or fiber reinforce-ment. Additional testing may be required to meet applicablespecifications

4、 for these applications.1.3 This specification does not address the effects of creepon epoxy-resin-base bonding systems while under load or thepotential for creep rupture. Additional testing is required forapplications where creep and creep rupture are critical.1.4 The values stated in either SI uni

5、ts or inch-pound unitsare to be regarded separately as standard. Some values haveonly SI units because the inch-pound equivalents are not usedin practice. Within the text, the SI units are shown in brackets.The values stated in each system may not be exact equivalents;therefore, each system shall be

6、 used independently of the other.Combining values from the two systems may result in non-conformance with this standard.1.5 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-pr

7、iate safety and health practices and determine the applica-bility of regulatory limitations prior to use. For specific hazardsstatements, see Section 9.2. Referenced Documents2.1 ASTM Standards:2C882 Test Method for Bond Strength of Epoxy-Resin Sys-tems Used With Concrete By Slant ShearC884/C884M Te

8、st Method for Thermal Compatibility Be-tween Concrete and an Epoxy-Resin OverlayD570 Test Method for Water Absorption of PlasticsD638 Test Method for Tensile Properties of PlasticsD648 Test Method for Deflection Temperature of PlasticsUnder Flexural Load in the Edgewise PositionD695 Test Method for

9、Compressive Properties of RigidPlasticsD1084 Test Methods for Viscosity of AdhesivesD2566 Test Method for Linear Shrinkage of Cured Thermo-setting Casting Resins During Cure (Withdrawn 1993)33. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 binder, nthe cementitious part of a gr

10、out, mortar, orconcrete that binds the aggregate or filler into a cohesive mass.3.1.2 bonding system, nthe product resulting from thecombination of all the components supplied for use as abonding material.3.1.3 component, na constituent that is intended to becombined with one or more other constitue

11、nts to form abonding system.3.1.4 contact strength, nbond strength measured by slantshear after a specified contact and cure time.3.1.5 contact time, nspecified time between when theepoxy system is applied and when the two segments arebonded together and still achieve a specified bond strengthafter

12、a specified curing time and temperature.3.1.6 curing agent, na substance that causes the conver-sion of a fluid resin system to a solid cured resin by means ofa chemical reaction.3.1.7 epoxy equivalent, nthe weight of resin containingone molecular weight of epoxy groups.3.1.8 epoxy resin, na resin t

13、hat contains or did containepoxy groups principally responsible for its polymerization.3.1.9 filler, na finely divided solid, predominantly passingthe No. 200 75-m sieve, that is used to improve certainproperties of the bonding system or to reduce cost.1This specification is under the jurisdiction o

14、f ASTM Committee C09 onConcrete and Concrete Aggregates and is the direct responsibility of SubcommitteeC09.25 on Organic Materials for Bonding.Current edition approved Dec. 1, 2013. Published December 2013. Originallyapproved in 1978. Last previous edition approved in 2010 as C88110. DOI:10.1520/C0

15、881_C0881M-13.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3The last approved version of this historical s

16、tandard is referenced onwww.astm.org.*A Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States13.1.10 formulator, nthe agency responsible for preparingthe separate components and

17、for recommending the propor-tions to be used in preparing the final bonding system.3.1.11 lot or batch, nthat quantity of manufactured mate-rial which has been subjected to the same unit chemical orphysical processes intended to make the final product substan-tially uniform.3.1.12 manufacturer, na p

18、roducer of a basic constituentpart of a component.3.1.13 reactive diluent, na relatively free flowing liquidused to reduce the viscosity of the liquid resin or resin mixture,and which contains reactive groups that cause it to become anintegral part of the cured resin.3.1.14 working (pot) life, nthe

19、time after mixing duringwhich a bonding system or mixture containing it retainssufficient workability for proper use.4. Classification4.1 This specification provides for the classification ofepoxy-resin bonding systems by type, grade, class, and color.4.2 TypesSeven types of systems that are disting

20、uished bythe requirements of Table 1 are recognized:4.2.1 Type IFor use in non-load bearing application forbonding hardened concrete to hardened concrete and othermaterials, and as a binder in epoxy mortars or epoxy concretes.4.2.2 Type IIFor use in non-load bearing applications forbonding freshly m

21、ixed concrete to hardened concrete.4.2.3 Type IIIFor use in bonding skid-resistant materialsto hardened concrete and as a binder in epoxy mortars or epoxyconcretes used on traffic bearing surfaces (or surfaces subjectto thermal or mechanical movements).4.2.4 Type IVFor use in load bearing applicatio

22、ns forbonding hardened concrete to hardened concrete and othermaterials and as a binder for epoxy mortars and concretes.4.2.5 Type VFor use in load bearing applications forbonding freshly mixed concrete to hardened concrete.4.2.6 Type VIFor bonding and sealing segmental precastelements, as in segmen

23、t-by-segment erection, and for span-by-span erection when temporary post tensioning is applied.4.2.7 Type VIIFor use as a nonstress carrying sealer forsegmental precast elements when temporary post tensioning isnot applied as in span-by-span erection.NOTE 1 Epoxy resin systems will adhere to a wide

24、variety ofmaterials, including wood, metals, masonry, and most plastics.Polyethylene, TFE-fluorocarbon, cellophane, and greased or waxed sur-faces are among the few materials to which these systems will not adhere.4.3 GradesThree grades of systems are defined accordingto their flow characteristics a

25、nd are distinguished by theviscosity and consistency requirements of Table 1.4.3.1 Grade 1Low viscosity.4.3.2 Grade 2Medium viscosity.4.3.3 Grade 3Non-sagging consistency.4.4 ClassesClasses A, B, and C are defined for Types Ithrough V, and Classes D, E, and F are defined for Types VIand VII, in acco

26、rdance with the range of temperatures forwhich they are suitable (Note 2).4.4.1 Class AFor use below 40 F 4 C the lowestallowable temperature to be defined by the manufacturer of theproduct.4.4.2 Class BFor use between 40 and 60 F 4 and 15 C.4.4.3 Class CFor use above 60 F 15 C the highestallowable

27、temperature to be defined by the manufacturer of theproduct.4.4.4 Class DFor use between 40 and 65 F 4 and 18 Cfor Type VI and VII applications.4.4.5 Class EFor use between 60 and 80 F 15 and 30C for Type VI and VII applications.4.4.6 Class FFor use above 75 F 25 C for Type VI andVII applications, t

28、he highest allowable temperature to bedefined by the manufacturer of the product.NOTE 2The temperature in question is usually that of the surface ofthe hardened concrete to which the bonding system is to be applied. Thistemperature may be considerably different from that of the air. Whereunusual cur

29、ing rates are desired it is possible to use a class of bondingagent at a temperature other than that for which it is normally intended.For example, a Class A system will cure rapidly at room temperature.4.5 ColorEpoxy resin systems are normally unpigmented,but they can be colored or darkened. If a s

30、pecific color isdesired, it should be so stated by the purchaser.5. Ordering Information5.1 The purchaser shall specify the type, grade, class, andcolor of bonding system desired and the size of units in whichthe components shall be furnished. Special requirements re-garding filling of either the co

31、mponents or the final bondingsystem should be stated. The product furnished under thisspecification is intended to be resistant to moisture andtherefore should be suitable for either indoor or outdoorexposure.5.2 The purchaser may specify a minimum gel time of 5 minfor Types I and IV when automatic

32、proportioning, mixing, anddispensing equipment are used.6. Materials and Manufacture6.1 The systems covered by this specification shall befurnished in two components for combining immediately priorto use in accordance with written instructions of the formulator.Component A shall contain an epoxy res

33、in with or without areactive diluent. Component B shall contain one or morecuring agents, which on mixing with Component A shall causethe mixture to harden. A suitable inert filler may be uniformlyincorporated in one or both components. The filler shall beeither nonsettling or readily dispersible in

34、 any component inwhich it is incorporated. All systems shall cure under humidconditions, and bond to damp surfaces.7. Chemical Composition7.1 The epoxy resin constituent of Component A shall havean epoxy equivalent of 155 to 275.8. Physical Properties8.1 A mixture of Components A and B in the propor

35、tionsrecommended by the formulator shall conform to the propertiesprescribed in Table 1.C881/C881M 1329. Safety Hazards9.1 Caution: Epoxy resins contain irritants, especially tothe skin, eyes, and respiratory system. Persons handling thesematerials shall use appropriate protective clothing, includin

36、grubber or plastic gloves. If an epoxy resin should contact theskin, it shall be removed immediately with a dry cloth or papertowel, and the area of contact washed thoroughly with soap andwater. Solvents shall not be used, because they carry the irritantinto the skin. Cured epoxy resins are innocuou

37、s.10. Sampling10.1 Take a representative sample of each of the twocomponents from a well-blended lot prior to packaging or bywithdrawing samples from no fewer than 5 % of the containerscomprising the lot or shipment. Unless the samples of the samecomponent taken from containers show visual evidence

38、ofvariability, they may be combined into a single compositesample. In place of the foregoing, packaged materials may beTABLE 1 Physical Requirements of Bonding SystemsPropertyTypeI II III IV V VI VIIViscosity, P Pas:Grade 1, max 202.0 202.0 202.0 202.0 202.0 . .Grade 2, min 202.0 202.0 202.0 202.0 2

39、02.0 . .max 10010 10010 10010 10010 10010 . .Consistency, inmm:Grade 3, Types I,II, III, IV, V, VI,VII,max14 6.014 6.014 6.014 6.014 6.014 6.014 6.0Gel time, minutes,min30 30 30 30 30 30 30Bond strength, min,psi MPa:2 days(moistcure)10007.0 . . 10007.0 . 10007.0 .14 days (moistcure)150010.0 150010.0

40、 150010.0 150010.0 150010.0 . 10007.0Absorption, 24 hmax, %1 1 1 1 1 . .Heat DeflectionTemperature, min,F C:7 days . . . 12050 12050 . .14 days . . . . . 12050 12050Thermalcompatibility. . passes test . . . .Linear coefficient ofshrinkage oncure,max0.005 0.005 . 0.005 0.005 . .Compressive YieldStren

41、gth, min,psiMPa:24 h . . . . . 200014.0 .36 h . . . . . . 10007.048 h . . . . . 600040.0 .72 h . . . . . . 200014.07 days 800055.0 500035.0 . 10 00070.0 800055.0 . .CompressiveModulus, psiMPaMin 150 0001000 90 000600 . 200 0001400 150 0001000 . .Max . . 130 000896 . . . .Tensile Strength, 7days min,

42、 psiMPaA500035.0 200014.0 . 700050.0 600040.0 . .Elongation atBreak, %, minA1 1 30 1 1 . .Contact strength,psiMPa min2 days . . . . . 10007.0 .14 days . . . . . . 10007.0ANot required for Viscosity Grade 3 Systems.C881/C881M 133sampled by a random selection of containers of each compo-nent from each

43、 lot, provided such a procedure is acceptable tothe purchaser.11. Test Methods11.1 ConsistencyTest Method to Determine The Consis-tency of an Epoxy Resin System.11.1.1 ScopeThis test provides a method for determiningthe consistency of Grade 3 epoxy resin systems.11.1.2 Significance and UseThis test

44、method is used todetermine compliance with the requirements of the specifica-tion.11.1.3 Apparatus:11.1.3.1 Paper cupApproximately 3 oz. approximately0.100L unwaxed paper cup.11.1.3.2 Mixing bladeOrdinary wooden tongue depressoror stick of similar size.11.1.3.3 Glass panel.11.1.4 ConditioningConditi

45、on the individual componentsand any equipment with which they will come in contact to thefollowing temperatures: Class A, 32 6 2F06 1 C; ClassB, 50 6 2F106 1 C; Class C, 73 6 2F236 1 C,Class D, 65 6 2F186 1 C; Class E, 80 6 2F276 1C; Class F, 90 6 2F326 1 C or to the temperature atwhich the material

46、 will be used (Note 2).11.1.5 ProcedurePrepare approximately 30 cm3of thebonding system. Weigh the necessary amounts of the compo-nents to an accuracy of 1 % into a single 3-oz approximately100-cm3 unwaxed paper cup. Mix immediately with a woodentongue depressor or stick of similar size. Note the ti

47、me atwhich mixing begins. Mix for 3 min, taking care to scrape theside and bottom of the cup periodically. Immediately applyabout 2 cm3of the mixture to a glass panel. Form a semicy-lindrical bead of the bonding system by drawing the applicatorblade through the sample in a straight line with the pan

48、elhorizontal. Immediately raise the panel to a position inclined atno greater than 10 from vertical and with the bead horizontal.Maintain the panel and sample at their original temperatureuntil the bonding system has cured, as determined by aninability to indent it appreciably with a pencil point or

49、fingernail. Determine the consistency by measuring the flow ofthe lower edge of the bead from its original position at threepoints along its length.11.1.6 ReportReport the average value to the nearest18in. 1 mm.11.1.7 Precision and Bias:11.1.7.1 PrecisionThe precision of the procedure in thistest method for consistency is being determined.11.1.7.2