ASTM D1867-2013 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的标准规格》.pdf

1、Designation: D1867 07D1867 13 An American National StandardStandard Specification forCopper-Clad Thermosetting Laminates for Printed Wiring1This standard is issued under the fixed designation D1867; the number immediately following the designation indicates the year oforiginal adoption or, in the ca

2、se of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded

3、 to one or both surfaces. Thesecombination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for informationonly.1.3 This standard does not

4、 purport to address all of the safety concerns, if any, associated with its use. It is the responsibilityof the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatorylimitations prior to use.2. Referenced Documents2.1 ASTM Standards:2

5、D709 Specification for Laminated Thermosetting MaterialsD1711 Terminology Relating to Electrical InsulationD3636 Practice for Sampling and Judging Quality of Solid Electrical Insulating MaterialsD5109 Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards2.2 Other Standards:M

6、IL-P-13949 Plastic Sheet, Laminated, Metal Clad (for Printed Wiring Boards)3NEMA Publication Number LI-143. Terminology3.1 For definitions of terms used in this standard, refer to Terminology D1711.4. Classification4.1 Base Laminate GradesWhere applicable, the dielectric material forming the base of

7、 the copper-clad laminate of the typeslisted in Table 1 and Table 2 shall conform to the property requirements of that specific grade shown in Specification D709.4.2 Copper Foil SurfacesThe surfaces shall be copper foil, either rolled or electrodeposited, having a minimum purity of99.50 % (silver co

8、nsidered as equal to copper). The thickness tolerances of the copper foil shall conform to the requirements ofTable 3.4.3 Thickness Tolerance ClassesCopper-clad laminates are available in two classes of thickness tolerance. Class I representsthose tolerances of standard manufacturing practice. Class

9、 II represents a closer tolerance product than Class I.Any specified classshall conform to the requirements shown in Table 4.4.3.1 For sheets of laminate equal to or greater than 18 by 18 in. (approximately 2.3 ft2) at least 90 % of all thickness testmeasurements made upon any sheet of laminate shal

10、l be within the limits specified in Table 4. For metric size sheets this 90 %requirement shall apply to sheet sizes of 0.5 by 0.5 m or 0.25 m2 area.1 This specification is under the jurisdiction of theASTM Committee D09 on Electrical and Electronic Insulating Materials and is the direct responsibili

11、ty of SubcommitteeD09.07 on Flexible and Rigid Insulating Materials.Current edition approved May 1, 2007Nov. 1, 2013. Published June 2007November 2013. Originally approved in 1961. Last previous edition approved in 20012007 asD1867 01.D1867 07. DOI: 10.1520/D1867-07.10.1520/D1867-13.2 For referenced

12、ASTM standards, visit theASTM website, www.astm.org, or contactASTM Customer Service at serviceastm.org. For Annual Book of ASTM Standardsvolume information, refer to the standards Document Summary page on the ASTM website.3 Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700

13、 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.4 Available from National Electrical Manufacturers Association, 2101 L St., N.W., Washington, DC 20037.This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been ma

14、de to the previous version. Becauseit may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current versionof the standard as published by ASTM is to be considered the official document.*A

15、Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States14.3.2 The deviation of any single thickness test measurement value (see Practice D3636) from the nominal overall thicknessli

16、sted in Table 4 shall not exceed 125 % of the tolerance listed in Table 4.4.3.3 Any overall laminate thickness not listed in Table 4 shall meet the tolerance requirements of the next highest nominalthickness listed in Table 4.4.3.4 For cut panels (for example, laminate sheets cut to area less than 2

17、.3 ft2 or less than 0.25 m2) at least 98 % of all thicknesstest measurements shall be within the specified overall laminate thickness tolerance values of Table 4.5. Ordering Information5.1 Orders for copper-clad laminates shall specify the grade of laminate base (see 4.1); the type of copper foil (e

18、ither rolled orelectrodeposited); the nominal weight of the copper foil (see 4.2); one- or two-side cladding; nominal overall laminate thickness;and the thickness tolerance class (see 4.3).6. Detailed Requirements6.1 The laminate shall meet the requirements shown in Table 5.7. Warp or Twist7.1 The w

19、arp or twist of copper-clad laminate shall meet the requirements of Table 6. The maximum values shown in Table 6are percentage values applicable only to sheet sizes as manufactured and to sheets cut such that neither length nor width is lessthan 18 in. (457 mm). The values shown are percentages base

20、d upon 36-in. (914-mm) dimension sheets.TABLE 1 Base Laminate GradesNOTE 1 A cross reference table of grade designations (see Table 2)appears here for reference purposes only. The ASTM grades shown aremost closely associated with the NEMA and the military grades listed inthis table. There is no requ

21、irement, stated or implied, in this ASTMspecification that the ASTM grade must meet the specification require-ments of the NEMA or the military standards listed.ASTM Grade TypeXXXP Paper base, phenolic resinXXXPC Paper base, phenolic resinFR-2 Paper base, phenolic resin, flammability ratedFR-3 Paper

22、 base, epoxy resin, flammability ratedFR-4 Glass woven fabric base, epoxy resin, general purpose, flam-mability ratedFR-5 Glass woven fabric base, epoxy resin, temperature resistant,flammability ratedFR-6 Random glass fiber base, polyester resin, flammability ratedG-10 Glass woven fabric base, epoxy

23、 resin, general purposeG-11 Glass woven fabric base, epoxy resin, temperature resistantCEM-1 Glass woven cloth surfaces, cellulose paper core, epoxyresin, flammability ratedCEM-3 Glass woven cloth surfaces, non-woven glass core, flamma-bility ratedTABLE 1 Base Laminate GradesNOTE 1 A cross reference

24、 table of grade designations (see Table 2)appears here for reference purposes only. The ASTM grades shown aremost closely associated with the NEMA and the military grades listed inthis table. There is no requirement, stated or implied, in this ASTMspecification that the ASTM grade must meet the spec

25、ification require-ments of the NEMA or the military standards listed.ASTM Grade TypeXXXP Paper base, phenolic resinXXXPC Paper base, phenolic resinFR-2 Paper base, phenolic resin, flammability ratedFR-3 Paper base, epoxy resin, flammability ratedFR-4 Glass woven fabric base, epoxy resin, general pur

26、pose, flam-mability ratedFR-5 Glass woven fabric base, epoxy resin, temperature resistant,flammability ratedFR-6 Random glass fiber base, polyester resin, flammability ratedG-10 Glass woven fabric base, epoxy resin, general purposeG-11 Glass woven fabric base, epoxy resin, temperature resistantCEM-1

27、 Glass woven cloth surfaces, cellulose paper core, epoxyresin, flammability ratedCEM-3 Glass woven cloth surfaces, non-woven glass core, flamma-bility ratedD1867 1328. Blistering8.1 No blistering shall occur due to exposure of specimens of the material to air at the temperatures and times shown in T

28、able7. This requirement applies to copper-clad specimens and to laminate from which all of the copper has been etched.9. Workmanship and Surface Requirements9.1 Grades XXXP, XXXPC, FR-2 and FR-6 Only:9.1.1 Copper surfaces shall be free from defects which may have the potential to affect serviceabili

29、ty of the laminate. Suchdefects in copper surfaces include blisters, wrinkles, cracks, dents, and scratches.9.1.2 The copper shall not contain any pin holes having average diameter greater than 0.015 in. (0.381 mm).9.1.3 Pin holes in the copper exceeding average diameter 0.005 in. (0.127 mm) shall n

30、ot be present in concentration exceedingone per ft2.9.1.4 The number of inclusions in copper which are larger than 0.020 in. (0.508 mm) in length shall be limited in a single ft2of laminate and in any single sheet of approximately 0.5 m2 size. The limits are:9.1.4.1 5 in any one ft2, and9.1.4.2 10 i

31、n any one 0.5 m2 size sheet.TABLE 2 Grade Cross ReferencesASTM Grade NEMA LI-1 Grade MIL-P-13949 GradeXXXP XXXP PPXXXPC XXXPC PPFR-2 FR-2 .FR-3 FR-3 PXFR-4 FR-4 GFFR-5 FR-5 GHFR-6 FR-6 .G-10 G-10 GEG-11 G-11 GBCEM-1 CEM-1 .CEM-3 CEM-3 .TABLE 2 Grade Cross ReferencesASTM Grade NEMA LI-1 Grade MIL-P-1

32、3949 GradeXXXP XXXP PPXXXPC XXXPC PPFR-2 FR-2 .FR-3 FR-3 PXFR-4 FR-4 GFFR-5 FR-5 GHFR-6 FR-6 .G-10 G-10 GEG-11 G-11 GBCEM-1 CEM-1 .CEM-3 CEM-3 .TABLE 3 Copper Foil ThicknessANominal Weight,oz/ft2NominalThickness,in.Thickness Tolerance, in.Plus Minus12 0.0007 0.00007 0.000071 0.0014 0.0004 0.00022 0.

33、0028 0.0007 0.00033 0.0042 0.0004 0.00044 0.0056 0.0006 0.00065 0.0070 0.0007 0.0007TABLE 3 Copper Foil ThicknessANominal Weight,oz/ft 2NominalThickness,in.Thickness Tolerance, in.Plus Minus12 0.0007 0.00007 0.000071 0.0014 0.0004 0.00022 0.0028 0.0007 0.00033 0.0042 0.0004 0.00044 0.0056 0.0006 0.0

34、0065 0.0070 0.0007 0.0007A Conversion factor: 0.001 in. = 0.0254 mm; 1 oz/ft2 = 0.305 kg/m2.D1867 1339.1.5 The unclad laminate surface shall have a semi-gloss or dull finish.9.2 Grades FR-3, FR-4, FR-5, CEM-1, CEM-3, G-10, and G-11:9.2.1 Copper surfaces shall be free from defects which may have the

35、potential to affect serviceability. Such defects includeblisters, wrinkles, and cracks. The copper surfaces shall be free from other defects as required in 9.2.2.9.2.2 Pits are small holes occurring as imperfections that do not penetrate entirely through the copper foil. Dents are depressionsin the

36、copper foil that do not significantly decrease the thickness of the copper foil. Pits and dents are limited by a point countsystem in which the maximum total allowable point count for pits and dents is 35 per ft2 (377/m2). Pits and dents carry variouspoint counts depending upon the longest dimension

37、 of the pit or dent. Table 8 provides point count values for various dimensions.9.2.3 Pinholes are small holes occurring as imperfections that penetrate entirely through the copper foil. A pinhole having anarea equivalent to a 0.005-in. (0.127-mm) diameter circle is a defect. A maximum of one such p

38、inhole is allowable in a 5-ft2(0.46-m 2) area of laminate. Pinholes of smaller area are also defects and the aggregate sum of the areas of all smaller pinholesin a 5-ft 2 piece of laminate is limited to the equivalent area of a 0.005-in. diameter circle.9.2.4 Inclusions are foreign particles which m

39、ay or may not be potentially enclosed in the mass of copper foil. Inclusions,having longest dimension 0.005 in. (0.127 mm) or more, are defects which are not allowed. Inclusions having longest dimensionbetween 0.001 and 0.005 in. (0.0254 and 0.127 mm) are permitted providing the concentration of suc

40、h minor defects does notexceed 5 per ft2 of copper-clad laminate area.9.2.5 Scratches are imperfections in the copper surface that do not extend through the entire thickness of the copper foil. Ascratch is considered to be an imperfection in a copper surface if either the length or width dimension i

41、s between 0.2 and 4 in. (5and 100 mm) and its depth dimension is between 5 and 20 % of the copper foil thickness. Imperfections with any depth greaterthan 20 % of the copper foil thickness are considered to be cracks.9.2.5.1 An imperfection of any length or width that has a depth dimension smaller t

42、han 5 % of the copper foil thickness isconsidered not to be a nonconformity.9.2.5.2 The concentration of scratches shall not exceed 5/ft2 (54/m2) of the copper-clad laminate surface.TABLE 4 Thickness Tolerance of Copper-Clad Sheet, in.ANominalOverallLaminateThickness,in.Class I Class IIGrades Grades

43、XXXP, XXXPCFR-2, FR-3FR-4, FR-5CEM-1, CEM-3FR-6, G-10,G-11XXXPXXXPCFR-2FR-3FR-4FR-5G-10G-111 oz,1 Side1 oz, 2 Sides 2,3, 4, 5 oz 1 or 2SidesAll Weights1 or 2SidesAllWeights 1or 2 SidesAllWeights 1or 2 Sides132 0.004 0.0045 0.0065 0.003 0.004364 0.005 0.0055 0.0075 0.0035 0.005116 0.0055 0.006 0.0075

44、 0.004 0.005332 0.007 0.0075 0.009 0.005 0.00718 0.0085 0.009 0.012 0.006 0.009532 0.0095 0.010 0.015 0.007 0.010316 0.010 0.011 0.019 0.008 0.012732 0.011 0.012 0.021 0.009 0.01214 0.012 0.012 0.022 0.009 0.012TABLE 4 Thickness Tolerance of Copper-Clad Sheet, in.ANominalOverallLaminateThickness,in.

45、Class I Class IIGrades GradesXXXP, XXXPCFR-2, FR-3FR-4, FR-5CEM-1, CEM-3FR-6, G-10,G-11XXXPXXXPCFR-2FR-3FR-4FR-5G-10G-111 oz,1 Side1 oz, 2 Sides 2,3, 4, 5 oz 1 or 2SidesAll Weights1 or 2SidesAllWeights 1or 2 SidesAllWeights 1or 2 Sides132 0.004 0.0045 0.0065 0.003 0.004364 0.005 0.0055 0.0075 0.0035

46、 0.005116 0.0055 0.006 0.0075 0.004 0.005332 0.007 0.0075 0.009 0.005 0.00718 0.0085 0.009 0.012 0.006 0.009532 0.0095 0.010 0.015 0.007 0.010316 0.010 0.011 0.019 0.008 0.012732 0.011 0.012 0.021 0.009 0.01214 0.012 0.012 0.022 0.009 0.012A Conversion factor: 0.001 in. = 0.0254 mm; 1 oz = 28.349 g.

47、B Not applicable.D1867 134TABLE 5 Detailed Requirements: Copper-Clad Laminates for Printed WiringAXXXP XXXPC FR-2 FR-3 FR-4 FR-5 G-10 G-11 CEM-1 CEM-3 FR-6Peel strength, min, lb/in. width:12 oz copperafter solder float condition A . . . . 6 6 6 6 . 6 .at elevated temperature condition E-1/125 . . .

48、. 4 2 4 2 . 4 .1 oz copperafter solder float condition AB 6 6 6 8 8 8 8 8 7 8 7at elevated temperature condition E-1/125 . . . 5 5 3 5 3 5 5 .2-oz copperafter solder float condition A 7 7 7 9 10 10 10 10 9 10 8at elevated temperature condition E-1/125 . . . 6 6 4 6 4 6 6 .3, 4, 5 oz copperafter sold

49、er float condition A . . . 10 11 11 11 11 10 11 .at elevated temperature condition E-1/125 . . . 7 7 5 7 5 7 7 .Flexural strength, avg, minpsi 132 to 332 in. onlylengthwise condition A 12000 12000 12000 20000 60000 60000 60000 60000 . . 15000crosswise condition A 10500 10500 10500 16000 50000 50000 50000 50000 40000 40000 15000psi 18 and 14 in. onlylengthwise condition A 12000 12000 12000 20000 55000 55000 55000 55000 . . .crosswise condition A 10500 10500 10500 16000 45000 45000 45000 45000 . . .Flexural strength test at 150Clengthwise, al