ASTM D4498-2007 Standard Test Method for Heat-Fail Temperature in Shear of Hot Melt Adhesives《热熔胶粘剂的剪切中热断裂温度用标准试验方法》.pdf

1、Designation: D 4498 07Standard Test Method forHeat-Fail Temperature in Shear of Hot Melt Adhesives1This standard is issued under the fixed designation D 4498; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revisio

2、n. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method is intended to determine the tempera-ture at which specimens bonded with hot melt adhesivedelaminate under stati

3、c load in shear.1.2 The values stated in SI units are to be regarded as thestandard. The values given in parentheses are for informationonly.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard

4、to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 907 Terminology of AdhesivesE28 Test Methods for Softening Point of Resins Derivedfrom Naval Stores by Ring-and-Ball ApparatusE 1

5、45 Specification for Gravity-Convection and Forced-Ventilation OvensE 171 Specification for Atmospheres for Conditioning andTesting Flexible Barrier MaterialsE 691 Practice for Conducting an Interlaboratory Study toDetermine the Precision of a Test Method3. Terminology3.1 DefinitionsMany of the term

6、s found in this testmethod are defined in Terminology D 907.3.2 Definitions of Terms Specific to This Standard:3.2.1 heat-fail temperature, nthe temperature at whichdelamination occurs under static loading in shear.4. Significance and Use4.1 Heat-fail temperature establishes a limiting temperatureab

7、ove which the adhesive is not to be exposed in service undershear load.5. Apparatus5.1 A device capable of producing adhesive films of uni-form thickness with 625.4 m (61 mil) tolerances.5.2 Standard SubstrateNIST Standard Reference Material1810 (Liner-Board)35.3 Heat Sealing DeviceSentinel heat sea

8、ler or equivalentcapable of maintaining selected sealing temperature within62.5C (65F).5.4 Forced-Ventilation Oven, manual or programmed. Ovenshall be capable of maintaining selected temperatures within61 % of the differential between oven and ambient tempera-tures in accordance with Specification E

9、 145, with the pro-grammable oven capable of attaining smooth temperatureincreases of 30C/h over a range of 25 to 150C.5.5 Thermometric Device, for monitoring oven tempera-tures.5.6 TFE-fluorocarbon Cloth, silicone release paper, 500 gweights and clamping devices for suspending weights andspecimens

10、in the oven.6. Sampling, Test Specimens, and Test Units6.1 The test sample is to be representative of the adhesivebeing tested.6.2 Prepare test specimen films of representative adhesive ata thickness of 76 6 25 m (3 6 1 mil). Inspect the cooled filmsand reject any containing voids or other imperfect

11、ions. Cut thefilms into pieces measuring 25.4 by 25.4 mm 6 1.6 mm (1 by1 in. 6 0.0625 in.). Measure the thickness of the adhesive filmto the nearest 0.013 mm (0.0005 in.). Cut strips of standardsubstrate measuring 25.4 6 1.6 by 76 mm (1 6 0.0625 by 3in.) with 76-mm (3-in.) dimension in the machine d

12、irection.6.3 Prepare a lap joint measuring 25.4 by 25.4 mm (1 by 1in.) inside two strips of standard substrate. Place this assemblybetween a folded sheet of silicone-coated release paper orTeflon cloth (Note 1). Insert the assembly between the platensof the heat sealer having only the upper platen h

13、eated. Makethe seal under the following conditions and seal at least 6specimens of each adhesive for test.6.3.1 TemperatureAs needed to activate hot-melt adhe-sive (Note 2).6.3.2 Pressure103.4 kPa (15 psi).1This test method is under the jurisdiction of ASTM Committee D14 onAdhesives and is the direc

14、t responsibility of Subcommittee D14.50 on Hot MeltPressure Sensitive Archive Adhesives.Current edition approved May 1, 2007. Published June 2007. Originallyapproved in 1985. Last previous edition approved in 2000 as D 4498 00.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orc

15、ontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from National Institute of Standards and Technology (NIST), 100Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http:/ww

16、w.nist.gov.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.6.3.3 Dwell Time1.5 s.NOTE 1Use of the coated release paper or TFE-fluorocarbon clothmay require a higher than expected sealing temperature because ofthermal insulating effec

17、ts.NOTE 2The operator should test at least two bonds after cooling toroom temperature to ensure that adequate adhesion has been obtained.Adjust sealing temperature to obtain that adhesion.6.4 Measure the thickness of the two pieces of substrate,calculate, and record the adhesive thickness, which is

18、to bebetween 25.4 and 76.2 m (1 and 3 mils). Condition thebonded specimens for 24 h according to Specification E 171before testing.7. Procedure7.1 Randomly select and suspend three bonded replicates inthe oven. Attach the weight to the bottom tab of substrate sothat the total load is 500 6 5 g (1.1

19、6 0.01 lb). Although theweight designated is recommended, other weights can be used.If so, report.7.2 Set the initial oven temperature at approximately 25 to40C (45 to 70F) below the softening point of the adhesive, aspreviously determined in accordance with Test Method E28.Increase the oven tempera

20、ture sequentially; for manual con-trols 5C (10F) at 10-min intervals, for programmed controls30C (60F)/h. Continue to increase the oven temperature untilall specimens fail.7.3 Record the temperature at which each specimen fails.Average the results for replicate specimens and report to thenearest deg

21、ree as the heat-fail temperature. Also report threeindividual results.8. Report8.1 Complete identification of the adhesive tested, includingtype, source, manufacturers code, lot number, and form inwhich received.8.2 Complete identity of substrates used if different from thestandard substrate.8.3 Act

22、ivation temperature used to make lap joint speci-mens.8.4 Weight used if other than 500 6 5 g (1.1 6 0.01 lb) testweight.8.5 A tabulation of test results, including the measuredthickness of adhesive for each test specimen as determined inaccordance with 6.2.9. Precision and Bias9.1 PrecisionTable 1

23、and Table 2 show data from roundrobin testing from an early study. An interlaboratory studyusing Practice E 691 will be conducted to generate data torevise Section 9 to bring it into conformance with the Precisionand Bias section in the ASTM Form and Style Manual.9.2 BiasNo statement is made about t

24、he bias of this testmethod since the result merely records a temperature at whichfailure of bond under shear load is observed.10. Keywords10.1 heat fail temperature; hot-melt adhesive; shearASTM International takes no position respecting the validity of any patent rights asserted in connection with

25、any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technic

26、al committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration

27、 at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbo

28、r Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.a

29、stm.org).TABLE 1 Heat-Fail Temperature Round Robin Data, FAdhesiveTypeLaboratory1PA2M3M4P5M6M7M8M9M10M10PEVA 145 160 138 149 . . . 145 . . . 140 135 149 132Polyester 265 270 268 270 275 277 259/265 . . . 260 253 262Polyamide 261 275 254 259 265 264 250 250 243 253 262Polypropylene 188 170 124 176 .

30、. . 153 170 152 . . . 158 176Polyethylene 195 200 184 191 195 192 180 181 163 196 192AP is an abbreviation for programmed oven. M is an abbreviation for manual control oven.TABLE 2 Summary of Results (10 Laboratories)AdhesiveTypeAv. Heat-failTemperature, FStandardDeviation, FEVA 142 9.3Polyester 263 11.7Polyamide 256 11.5Polypropylene 160 19.5Polyethylene 187 11.2D4498072