ASTM D7447-2008e1 866 Standard Practice for Symbolizing Adhesive Applications《标示粘合剂应用标准方法》.pdf

1、Designation: D 7447 081Standard Practice forSymbolizing Adhesive Applications1This standard is issued under the fixed designation D 7447; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in parent

2、heses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1NOTETable 3 was corrected editorially in April 2009.1. Scope1.1 This practice covers a standard symbol that may be usedby the design-engineering community on engi

3、neering drawingsto indicate a bonded assembly for any type of adhesive.1.2 This design is based on criteria contained in ANSI/AWSA2.4 as well as ISO 15785.1.3 The values given in SI units are to be regarded as thestandard. The values in parentheses are for information only.1.4 This standard does not

4、 purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ANSI/AWS Stand

5、ard:2ANSI/AWS A2.4 Symbols for Welding and NondestructiveTesting2.2 ISO Standard:2ISO 15785 Technical DrawingsSymbolic Presentationand Indication of Adhesive, Fold and Pressed Joints3. Significance and Use3.1 An adhesive symbol provides an efficient means ofplacing complete information about adhesiv

6、es on engineeringdrawings. The joint is the basis of reference for the symbol towhich the arrow line is pointed. The reference line of thesymbol is used to designate the type of adhesive to be used,including information about its physical form, chemical tech-nology family, requirements for surface p

7、reparation, applica-tion method (bead versus roll coat), and cure method. Theoptional tail (shown at left in Fig. 1) provides a place to includeadditional information about the adhesive that is not referencedin other notations.3.2 Refer to Fig. 1 for an overview schematic of theadhesive symbol denot

8、ed by a mast supporting a circle with theletter “A” inside for adhesive. Detail behind each of theelements noted (for example, FORM, CHEM, APPL METH)can be found in corresponding tables in Section 5.4. Elements of the Adhesive Symbol4.1 The elements represented in Fig. 1 are explained ingreater deta

9、il in Tables 1-5 and Fig. 2.4.2 Fig. 3 illustrates an expanded view of the parametersdetailed in the tables described in Tables 1-5 and Fig. 2.5. References and Other Notations5.1 Symbols With ReferencesWhen specifications, pro-cesses, or other references are used with the adhesive symbol,the notati

10、on is placed in the tail (see “T” symbol in Fig. 1 orFig. 3). This notation may reflect information about a particularmanufacturers product or other pertinent data not contained inthe symbol elements.5.2 Symbols Without ReferencesSymbols may be usedwithout specifications, processes, or other referen

11、ces when:5.2.1 A note appears on the drawing: “Unless otherwisedesignated, all adhesive bonds are to be made in accordancewith Specification No .”5.2.2 The bonding procedure to be used is described else-where such as in shop instructions and process sheets: “Referto Instruction for bonding procedure

12、.”5.3 Orientation of Bond JointThe horizontal orientation isdefault (“parallel line” element should be omitted) or theelement is present only when either inclined or vertical:5.3.1 If vertical orientation, display lines as “| |” or5.3.2 If inclined orientation, display lines as “/.”5.4 Symbol Attach

13、ments to the Reference Line:5.4.1 Geometry of cross section of the dispensed bead styleBEAD X-SECT and5.4.2 An arrow-shaped element indicating surface applica-tion of the adhesive APP SURF that may be shown posi-tioned as:5.4.2.1 Above line onlyIf adhesive is to applied to sub-strate surface to whic

14、h arrow is pointing,5.4.2.2 Below line onlyIf adhesive is to be applied tosubstrate surface opposite to which arrow is pointing, and5.4.2.3 Both above and below lineIf adhesive is to beapplied to both substrate surfaces.1This practice is under the jurisdiction of ASTM Committee D14 on Adhesivesand i

15、s the direct responsibility of Subcommittee D14.60 on Adhesive MaterialClassification System.Current edition approved Oct. 1, 2008. Published November 2008.2Available from American National Standards Institute (ANSI), 25 W. 43rd St.,4th Floor, New York, NY 10036, http:/www.ansi.org.1Copyright ASTM I

16、nternational, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.5.5 Symbol Attachments to the Intersection of the Referenceand Arrow LinesA circle is noted where the adhesive is to beapplied around the perimeter of a joint (for example, pipe toflange joint).5.6 The

17、mast line contains “A” notation to denote adhesive.5.7 Symbol Attachments to “Circle A” Mast Line:5.7.1 The presence of a filled flag indicates the adhesive isto be applied in the field and the absence of this elementindicates factory application.5.8 Fig. 4 and Fig. 5 are examples of a bonded joint

18、beforeand after the use of the symbol. For illustrative purposes,assume adhesive is applied in the plant.6. Keywords6.1 adhesive; CAD; joint; symbolFIG. 1 Standard Locations of Elements of the Adhesive SymbolTABLE 1 FORM(Adhesive Physical Forms)One-Part System 1CTwo-Part System 2CFilm FILFoam FOAOth

19、er (specify)TABLE 2 TECH(Technology Families)Acrylic (other than AN, CA) ACAnaerobic ANCasein CSCyanoacrylate CAEpoxy EPHot Melt HMMelamine-Formaldehyde MFPhenol-Formaldehyde PFPolyimide PIPolyurethane PURPolyurethane/Epoxy Hybrid PUR/EPSilane Modified SLSilicone SIOther (specify)TABLE 3 SURF PREP(S

20、urface Preparation)a. DETERGENT CLEANINGA(insert type)b. SOLVENT WIPEB(insert type)c. CHEMICAL TREATMENTC(insert type)d. MECHANICAL TREATMENTD(insert type)Note (SAND grit size) or(GRIT shot size) as neededADetergent Cleaning types may include but are not limited to: (1) detergent; (2)soap; (3) caust

21、ic soda.BSolvent Wipe types may include but are not limited to: (1) acetone; (2)isopropyl alcohol.CChemical Treatment types may include but are not limited to: (1) corona; (2)flame; (3) plasma; (4) chemical etching; (5) conversion coating; (6) silicatization.DMechanical Treatment types may include b

22、ut are not limited to: (1) manualsanding; (2) sandblasting; (3) tumbling; (4) vapor honing. Indicate SAND grit sizeor GRIT shot size as needed.D74470812TABLE 4 APP METH(Application Method)DISPENSED BEAD ROLL COATSelect Dispensed Bead or Roll Coat Application YES NO YES NOa. Cross Section (BEAD X-SEC

23、) See Fig. 2 N/Ab. Mix Ratio (MIX) X:Y X:Yc. Applied Thickness (APP THCK) orCoat Weight (COAT WT)Applied Thickness(dimension)Coat Weight(wt/area)d. Coverage Area (AREA) (as % of total area) N/A A %e. Design (Final) Bond Line Thickness (BL THCK) (dimension) (dimension)f. Bond Line Set Method (BL SET)

24、 Part Stand-Off(PSO): (dimension)Mechanical Spacer(MS): (dimension)Part Stand-Off(PSO): (dimension)Mechanical Spacer(MS): (dimension)g. Surface of Application (APP SURF)AAElement is displayed above, below, or on both sides of reference line depending on which substrate surface adhesive is to be appl

25、ied.TABLE 5 CURE(Curing Parameters)Heat:Exposure Time: (min)Temperature: TcC (Tf F) at ambient humidityHeat Application Method:A(insert type)Moisture: Exposure Time: (min)Humidity Range: (% range)Ultraviolet Light (UV):BWavelength: (nm) Time: (sec) Intensity: (mW/cm2)Electron Beam (EB):BElectron Ene

26、rgy: (keV) Time: (sec) Electron Current Density: (A/cm2)Radio Frequency (RF):BFrequency: (Mhz, Ghz) Time: (sec) Intensity: (W/cm2)Visible Light (VIS):BWavelength: (nm) Time: (sec)Other: (specify)AHeat Application Method may include but is not limited to: (1) heated press; (2) oven; (3) infrared (IR)

27、; (4) hot air impingement; (5) induction heating.BAt the design phase, dosage, wavelength, and time parameters may NOT be known as ultimate values will depend on the specifics of the manufacturing process; thesefields should be left blank under these circumstances.1NoteThis criteria may only be appl

28、icable if adhesive is mastic; if self-leveling, leave blank.FIG. 2 BEAD X-SECT1(Geometry of Dispensed Bead Cross-Section)D74470813FIG. 3 Expanded Detail of Elements of the Adhesive SymbolD74470814FIG. 4 Drawing Before SymbolFIG. 5 Application of Symbol(1 in. = 2.54 cm and tc=(tf 32)/1.8)(for clarity

29、, symbol is shown for upper adhesive bond only)D74470815ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent

30、 rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either

31、 for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hea

32、ring you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).D74470816