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本文(ASTM E2698-2018 Standard Practice for Radiographic Examination Using Digital Detector Arrays《用数字探测器阵列进行射线照相检查的标准实施规程》.pdf)为本站会员(刘芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

ASTM E2698-2018 Standard Practice for Radiographic Examination Using Digital Detector Arrays《用数字探测器阵列进行射线照相检查的标准实施规程》.pdf

1、Designation: E2698 10E2698 18Standard Practice forRadiologicalRadiographic Examination Using DigitalDetector Arrays1This standard is issued under the fixed designation E2698; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year

2、 of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This practice establishes the minimum requirements for radiologicalradiographic examination forof metallic andnonm

3、etallic materialmaterials using a digital detector array (DDA) system.arrays (DDAs).1.2 The stated requirements of this specification are based on the use of an X-ray generating source. Additionally, some of thetests and requirements may not be applicable to X-ray energy levels 450kV.1.3 The require

4、ments in this practice are intended to control the quality of radiologic images radiographic examinations obtainedusing DDAs and are not intended to establish acceptance criteria for parts or materials.1.4 This practice covers the radiologicradiographic examination with DDAs including DDAs described

5、 in PracticeE2597E2597/E2597M such as a device that contains a photoconductor attached to a Thin Film Transistor (TFT) read out structure,a device that has a phosphor coupled directly to an amorphous silicon read-out structure, and devices where a phosphor is coupledto a CMOS (Complementary(compleme

6、ntary metaloxidesemiconductor) array, a Linear DetectorArray (LDA) or a CCD (chargecoupled device) crystalline silicon read-out structure.1.5 The requirements of this practice and Practice E2737 shall be used together. The requirements of Practice E2737 willprovide the baseline evaluation and long t

7、erm stability test procedures for the DDA system. The user of the DDA system shallestablish a written procedure that addresses the specific requirements and tests to be used in their application and shall be approvedby the Cognizant Radiographic Level 3 before examination of production hardware. Thi

8、s practice also requires the user to performa system qualification suitable for its intended purpose and to issue a system qualification report (see 9.1).1.6 The DDA shall be selected for an NDT application based on knowledge of the technology described in Guide E2736, andof the selected DDA propert

9、ies provided by the manufacturer in accordance with Practice E2597E2597/E2597M.1.5 The requirements of this practice and Practice E2737 shall be used together and both be approved by the CEO Level 3 inRadiography before inspection of production hardware. The requirements of Practice E2737 will provi

10、de the baseline evaluationand long term stability test procedures for the DDA system.1.6 The requirements in this practice shall be used when placing a DDAinto NDT service and, before being placed into service,an established baseline of system qualification shall be performed in accordance with Prac

11、tice E2737.1.7 Techniques and applications employed with DDAs are diverse. This practice is not intended to be limiting or restrictive.Refer to Guides E94E94/E94M, E1000, and E2736,Terminology E1316, PracticePractices E747 and E1025, Fed. Std. Nos. 21CFR1020.40 and 29 CFR 1910.96 and Federal Standar

12、ds 21-CFR-1020.40 and 29-CFR-1910.96 for a list of documents that provideadditional information and guidance.1.8 This international standard was developed in accordance with internationally recognized principles on standardizationestablished in the Decision on Principles for the Development of Inter

13、national Standards, Guides and Recommendations issuedby the World Trade Organization Technical Barriers to Trade (TBT) Committee.2. Referenced Documents2.1 ASTM Standards:2E94E94/E94M Guide for Radiographic Examination Using Industrial Radiographic Film1 This practice is under the jurisdiction ofAST

14、M Committee E07 on Nondestructive Testing and is the direct responsibility of Subcommittee E07.01 on Radiology (X andGamma) Method.Current edition approved April 15, 2010Feb. 1, 2018. Published July 2010April 2018. Originally approved in 2010. Last previous edition approved in 2010 as E2698 10.DOI:

15、10.1520/E2698-18.2 For referencedASTM standards, visit theASTM website, www.astm.org, or contactASTM Customer Service at serviceastm.org. For Annual Book of ASTM Standardsvolume information, refer to the standards Document Summary page on the ASTM website.This document is not an ASTM standard and is

16、 intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Becauseit may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the

17、current versionof the standard as published by ASTM is to be considered the official document.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1E543 Specification for Agencies Performing Nondestructive TestingE747 Practice for Design, M

18、anufacture and Material Grouping Classification of Wire Image Quality Indicators (IQI) Used forRadiologyE1000 Guide for RadioscopyE1025 Practice for Design, Manufacture, and Material Grouping Classification of Hole-Type Image Quality Indicators (IQI)Used for RadiographyE1165 Test Method for Measurem

19、ent of Focal Spots of Industrial X-Ray Tubes by Pinhole ImagingE1316 Terminology for Nondestructive ExaminationsE1647E1742/E1742M Practice for Determining Contrast Sensitivity in RadiologyRadiographic ExaminationE1742E1817 Practice for Radiographic ExaminationControlling Quality of Radiological Exam

20、ination by Using RepresentativeQuality Indicators (RQIs)E2002 Practice for Determining Total Image Unsharpness and Basic Spatial Resolution in Radiography and RadioscopyE2339 Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE)E2597E2597/E2597M Practice for Manufactu

21、ring Characterization of Digital Detector ArraysE2699 Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE) for Digital Radiographic(DR) Test MethodsE2736 Guide for Digital Detector ArraysArray RadiographyE2737 Practice for Digital Detector Array Performance Evaluatio

22、n and Long-Term StabilityE2903 Test Method for Measurement of the Effective Focal Spot Size of Mini and Micro Focus X-ray Tubes2.2 AWS Documents:3AWS A2.4 Symbols for Welding and Nondestructive Testing2.3 Aerospace Industries Association Document:4NAS 410 Certification the model and manufacturer of

23、the x-ray tube and the focal spot size.e.1) The nominal exposure: voltage, current, exposure time, frame rate, frames averaged, beam and/or detector collimation, beam filters used including their loca-tions (tube, part, detector, and so forth)f.) For radioisotope source exposures: the isotope type a

24、nd source size.f.1) The nominal exposure: source strength, exposure time, frame rate, frames averaged, beam and/or detector collimation, beam filters used including their loca-tions (tube, part, detector, and so forth).g.) The make, model, and manufacturer of the DDA used in the examination. The det

25、ectors iSRbdetector shall be addressed on the procedure, technique, or otherrelated documentation along with the detector mode (full resolution, pixel binned, and so forth) and the detectors gain setting (as available).h.) The geometric magnification factor used, including source to object and objec

26、t to detector distances and the measured or calculated total image unsharp-ness.i.) The IQI size and type, the required radiographic quality level and a minimum quality level to achieve in the region of interest. If alternate IQIs are used, in-clude details of the design or reference to documents wh

27、ere such information is found.j.) Thickness and type of material for shims or blocks, or both if used.k.) The window width and level used to visualize the image as well as any digital image zoom.l.) Any image processing parameters used to obtain the required image quality or improve fine detail dete

28、ction. This would include noise reduction methods,contrast enhancement, or other filtering procedures.m.) The acceptance limits shall be documented and if applicable, the zones or sections of the part or assembly to which they apply. If permitted, the acceptancecriteria may be separate from the proc

29、edure but documented and available to the image interpreters.n.) A system of measurement verification shall be documented. If a physical standard is used to verify the accuracy of a measurement, the standard shall becertified annually using standards traceable to NIST (or other recognized standardiz

30、ing body). The user and the CEO shall agree to the tolerance of thisstandard.9.2.1 Name and address of the NDT facility, the date, and revision of the procedure.9.2.2 Radiological Image Identification scheme used to correlate the exposure to part. If the examination procedures are similarfor many co

31、mponents, a master written procedure shall be used that covers the details common to a variety of components. Allwritten procedures shall be approved by an individual qualified and certified as a Level 3 in Radiographic Testing in accordancewith 4.1.9.2.3 The thickness and type of material.9.2.4 A d

32、rawing, sketch, or photograph of a component showing the location of the part and IQI with respect to the radiationsource for each exposure. The angle of the radiation beam in relation to the component, the source to DDA distance, part to DDAdistance, and any blocking or masking, if used shall be do

33、cumented. For robotic or similar systems with hard fixturing andcontrolled scan plans, a drawing, sketch or photograph is not required.9.2.5 The nominal exposure for the x-ray machine: voltage, milliamps, filter, exposure time, frame averages, beam- or detector-collimation, and effective focal spot

34、size. For radioisotope sources: the isotope type, source strength, exposure time, frameaverages, beam- or detector- collimation, and source size.9.2.6 The make, model and manufacturer of the DDA used in the inspection.9.2.7 The geometrical magnification factor used including source to object and obj

35、ect to detector distances.9.2.8 The IQI size and type, the required radiologic quality level and a minimum quality level to achieve in the region ofinterest. If alternate IQIs are used, include details of the design or reference to documents where such information is found.9.2.9 Thickness and type o

36、f material for shims or blocks, or both if used.9.2.10 The window width and level used to visualize the image as well as any digital image zoom.E2698 1879.2.11 Any image processing parameters used to obtain the required image quality or improve fine detail detection. This wouldinclude noise reductio

37、n methods, contrast enhancement, or other filtering procedures.9.2.12 The acceptance limits shall be documented and if applicable, the zones or sections of the part or assembly to which theyapply. If permitted, the acceptance criteria may be separate from the procedure but documented and available t

38、o the imageinterpreters.9.2.13 A system of measurement verification shall be documented. If a physical standard is used to verify the accuracy of ameasurement, the standard shall be certified annually using standards traceable to NIST (or other recognized standardizing body).The user and the CEO sha

39、ll agree to the tolerance of this standard.10. Examination Details10.1 Components shall be examined without surface preparation or conditioning except as required to remove surfaceconditions that may interfere with proper interpretation of the image.10.1.1 Castings, forgings, and weldments shall be

40、exposedexamined in the as-cast, as forged as cast, as forged, or as weldedcondition provided the surface condition does not interfere with interpretation.10.2 Each exposureimage shall carry the identification or serial number of the component and view number, when multipleviews are taken. Each radio

41、logical exposure image shall also carry the identification of the NDT facility inspectingexamining thecomponent and date of the examination. Digital labeling shall never permanently alter the nature of the image or hinderinterpretation of an area within the image. Images of a repair/rework area shal

42、l be identified such that it can be uniquely relatedto the repair/rework that was attempted. For explosives and propellants, the conditioning temperature shall be identified on theexposureimage if the ordnance has been conditioned to a temperature other than facility ambient for purposes of examinat

43、ion.Other methods of identifying repairs may be used with prior approval of the CEO.10.3 The radiologicalradiographic exposure coverage of each part and sampling if used shall be as specified by drawing,exposure techniques, radiologicradiographic manuals, handbooks for aircraft technical orders, or

44、other specifications as applicable.Examination areas shall be identified on the drawing by using the symbols in accordance with ANSI/AWS A2.4 or other systemsof designations that are easily identified on the drawing. If the number of parts to be examined and coverage is not specified, allparts shall

45、 be examined and 100 % coverage will be necessary.10.4 The sequence for radiologicalradiographic examination in the production operation shall be specified in the manufacturingor assembly process, specification, and contract or purchase order. If not specified, radiologicalradiographic examination s

46、hall beperformed at a stage in the process of manufacturing or assembly at which discontinuities can be detected. RadiologicalRadio-graphic examination may be performed prior to heat treatment providing liquid penetrant or magnetic particle examinations areperformed after heat treatment.10.5 The fiv

47、e quality levels listed in Table 1 shall be assigned on the basis of IQI thickness and the perceptibility of one, two,or three holes in the Hole-Type IQI image on the image. If the quality level is not specified on the drawing or other applicabledocuments, it shall be 2-2T. Unless otherwise specifie

48、d by the CEO, Hole-Type IQIs used for examination of material6.35-mm6.35 mm (0.25 in.) or less in thickness shall be a minimum of 0.13 mm (0.005 in.) minimum thick.10.6 When placed directly on the component, one IQI shall represent an area with a pixel value equal to or less than the leastradiograph

49、ically dense area of the represented area of the image.TABLE 1 Quality Levels of ExaminationIQIDesignationRadiologicQualityLevelMaximumIQIThickness, %AMinimumHoleDiameterBEquivalentIQISensitivity, %CIQIDesignationRadiographicQualityLevelMaximumIQIThickness, %(a)MinimumHoleDiameter(b)EquivalentIQISensitivity, %(c)00 1-1T 1 1T 0.70 1-2T 1 2T 1.01 2-1T 2 1T 1.42 2-2T 2 2T 2.03 2-4T 2 4T 2.8(a) Expressed as a percentage of material thickness.(b) Expressed as multiple thickness of IQI.(c) Equivalent IQI sensitivity is that thickness of the IQI expressed as a percentage of the specim

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