1、Designation: E3034 15Standard Guide forWorkforce Education in Nanotechnology PatternGeneration1This standard is issued under the fixed designation E3034; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A
2、number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This guide provides a framework for a basic workforceeducation in pattern generation topics related tonanotechnology, to be taught at a
3、n undergraduate college level.The education should be broadbased, preparing an individualto work in one of many areas in naotechnology research,development, or manufacturing. The individual so educatedmay be involved in nanoscale pattern definition.1.2 This guide may be used to develop or evaluate a
4、neducation program for pattern generation topics in the nano-technology field. This guide provides listings of key topics thatshould be covered in a nanotechnology education program onthis subject, but it does not provide specific course material tobe used in such a program. This approach is taken i
5、n order toallow workforce education entities to ensure their programscover the required material while also enabling these institu-tions to tailor their programs to meet the needs of their localemployers.1.3 While no units of measurements are used in thisstandard guide, values stated in SI units are
6、 to be regarded asstandard.1.4 This standard does not purport to address all of themethods and concepts needed for pattern generation in nano-technology. It may not cover knowledge and skill objectivesapplicable to local conditions or required by local regulations.1.5 This standard does not purport
7、to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2E2456 T
8、erminology Relating to NanotechnologyE2996 Guide for Workforce Education in NanotechnologyHealth and SafetyE3001 Practice for Workforce Education in NanotechnologyCharacterization2.2 ISO Standards:3ISO/TS 80004-2 Nanotechnologies VocabularyPart 2:Nano-ObjectsISO/TS 80004-8 Nanotechnologies Vocabular
9、yPart 8:Nanomanufacturing Processes3. Terminology3.1 Definitions:3.1.1 For definitions of terms related to nanotechnology ingeneral, refer to Terminology E2456 and ISO/TS 80004-2.3.1.2 For definitions of terms related to nanotechnologypattern generation in general, refer to ISO/TS 80004-8.3.2 Defini
10、tions of Terms Specific to This Standard:3.2.1 education, nthe teaching of specific topics as part ofa degree or certificate program, or as training to provideadditional skills and knowledge.3.2.2 pattern, na design or a layout for fabricated struc-tures.3.2.3 pattern generation, nthe technique(s) t
11、o create andtransfer a pattern onto a medium as applied in fabrication at themicro- or nanoscale; for example, photolithography is anoptical technique used in chip manufacturing for generating apattern on a substrate.4. Summary of Guide4.1 This guide designates a list of six topics on patterngenerat
12、ion relevant to nanotechnology workforce education.1This guide is under the jurisdiction of ASTM Committee E56 on Nanotech-nology and is the direct responsibility of Subcommittee E56.03 on Environment,Health, and Safety.Current edition approved Oct. 15, 2015. Published November 2015. DOI:10.1520/E30
13、34-15.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from International Organization for Standard
14、ization (ISO), ISOCentral Secretariat, BIBC II, Chemin de Blandonnet 8, CP 401, 1214 Vernier,Geneva, Switzerland, http:/www.iso.org.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States1Selection of the techniques, concepts, and materials a
15、re basedon inputs from industry, nanotechnology educators and subjectmatter experts.4.2 In this list, the first topic (8.1) pertains to the design ofthe patterns. The following five topics cover various lithogra-phy techniques. Three of the topics (8.2, 8.3, and 8.5) covertechniques requiring physic
16、al masks to generate the patterns ona substrate. The other two topics (8.4 and 8.6) do not utilize anyphysical masks, but use either electronic design files (8.4)orengineering of the materials (8.6).5. Significance and Use5.1 The purpose of this guide is to provide a basic educa-tional structure for
17、 pattern generation in nanotechnology toorganizations developing or carrying out education programsfor the nanotechnology workforce. This guide helps to describethe minimum knowledge base for anyone involved in nano-manufacturing or nanomaterials research.5.2 The basic education should prepare an in
18、dividual forvaried roles in the nanotechnology workplace. The material inthis standard may require a post-secondary two-year science ortechnology background to be understood sufficiently. Depth onthe topics should be sufficient to transfer between variousapplications of nanotechnology such as nanoma
19、terialfabrication, nanomaterial characterization, nanolithography,and patterning.5.3 Workers may transition in their roles in the workplace.Participants in such education will have a broad understandingof a complement of pattern generation methods, thus increas-ing their marketability for jobs withi
20、n as well as beyond thenanotechnology field.5.4 This guide is intended to be one in a series of standardsdeveloped for workforce education in various aspects ofnanotechnology. It will assist in providing an organization abasic structure for developing a program applicable to manyareas in nanotechnol
21、ogy, thus providing dynamic and evolvingworkforce education.6. General Background Knowledge and Skills6.1 Introductory algebra, chemistry, physics, and statistics atthe college level.6.2 The environmental, health and safety (EHS) hazardspresented by nanoscale materials can be very different fromthos
22、e presented by bulk materials. Students should have a basicunderstanding of the unique EHS factors when handlingnanoscale materials.NOTE 1See Guide E2996 for details.6.3 A basic knowledge of the physical and chemical prop-erties of nanoscale materials.6.4 During the pattern generation procedure, mea
23、surementshave to be made to track the progress and product quality aftervarious process steps. Students should have a basic understand-ing of characterization methods at the nanoscale.NOTE 2See Practice E3001 for details.7. Concepts and Skills to be Covered7.1 Relevant methods for workforce educatio
24、n in nanotech-nology pattern generation are listed in Section 8, with specificimportant topics to be covered for each method. Additionalmethods or topics, or both, may be added on an as-neededbasis.8. Concepts and Techniques Relevant to NanotechnologyPattern Generation8.1 Layout Design:8.1.1 Define
25、function.8.1.2 Design partition.8.1.3 Design simulation.8.2 Optical Lithography:8.2.1 Optics for lithography:8.2.1.1 Diffraction.8.2.1.2 Interference.8.2.1.3 Reflection.8.2.1.4 Refraction.8.2.1.5 Scattering.8.2.2 Resists:8.2.2.1 Sensitivity.8.2.2.2 Contrast.8.2.2.3 Dose.8.2.2.4 Positive/negative pho
26、toresists.8.2.2.5 Adhesion promoters.8.2.2.6 Chemically amplified photoresist.8.2.2.7 Lift-off resist.8.2.2.8 Anti-reflective coating (TARC/BARC).8.2.2.9 Edge bead remover.8.2.3 Systems:8.2.3.1 Light sources and their wavelengths.8.2.3.2 Immersion lithography.8.2.3.3 Contact lithography.8.2.3.4 Prox
27、imity lithography.8.2.3.5 Projection lithography.8.2.4 Process Steps:8.2.4.1 Substrate cleaning.8.2.4.2 Dehydration bake.8.2.4.3 Spin coat primer.8.2.4.4 Spin coat photoresist.8.2.4.5 Soft bake.8.2.4.6 Alignment8.2.4.7 Exposure.8.2.4.8 Post exposure bake.8.2.4.9 Development and rinse.8.2.4.10 Hard b
28、ake (if needed).8.3 X-Ray Lithography:8.3.1 X-ray lithography.8.3.2 Extreme ultra violet (EUV) lithography.8.4 Direct Writing:8.4.1 Electron/Ion Beam/Laser Lithography:8.4.1.1 Resists:(1) Positive/negative resists.(2) Chemically amplified resists.(3) Adhesion promoter.E3034 1528.4.1.2 Systems:(1) Be
29、am source (emitter).(2) Aperture.(3) Lenses and optical filters.(4) Electron projection lithography.(5) Multiple electron beam lithography.8.4.1.3 Process Steps:(1) Dose array.(2) Beam current/spot size.8.4.2 Scanning Probe Microscope (SPM) Lithography:8.4.2.1 Dip pen lithography.8.4.2.2 Near-field
30、scanning optical microscopy (NSOM)lithography.8.4.2.3 Local oxidation lithography.8.4.2.4 Electrochemical etching.8.4.2.5 Field-induced deposition.8.5 Nano-Imprint Lithography (NIL):8.5.1 Thermal nano-imprint lithography:8.5.1.1 Resists:(1) Thermo plastics materials.8.5.1.2 Systems:(1) Piston type p
31、ressurization method.(2) Air cushion pressurization method.8.5.1.3 Process Steps:(1) Master mold fabrication.(2) Anti-stiction layer coating.(3) Pattern alignment.(4) Common pattern defects control.8.5.2 UV Nano-Imprint Lithography:8.5.2.1 Resists:(1) UV curable materials.8.5.2.2 Systems:(1) UV nano
32、-imprint tool.(2) Step-and-Flash nano-imprint tool.8.5.2.3 Process Steps:(1) Master mold (stamp) fabrication.(2) Secondary master mold (stamp) replication.(3) Pattern alignment.8.5.3 Other Nano-Imprint Lithography:8.5.3.1 Roll-to-roll nano-imprint lithography.8.6 Molecular Self-Assembly and Related
33、Techniques:8.6.1 Molecular Self-Assembly:8.6.1.1 Materials:(1) Ligands.8.6.2 Block Co-Polymer Lithography (BCL):8.6.2.1 Materials:(1) Random co-polymers.(2) Di-block co-polymers.(3) Tri-block co-polymers.8.6.2.2 Process Steps:(1) Phase separation.(2) Pattern transfer steps.8.6.3 Nano-sphere lithogra
34、phy (NSL).9. Keywords9.1 lithography; nano; pattern generation; workforce educa-tionRELATED MATERIALE2535 Standard Guide for Handling Unbound Engineered NanoscaleParticles in Occupational SettingsASTM International takes no position respecting the validity of any patent rights asserted in connection
35、 with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible t
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37、ration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr
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