ASTM E801-2006 Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices《控制电子装置放射性检验质量的标准实施规程》.pdf

1、Designation: E 801 06Standard Practice forControlling Quality of Radiological Examination ofElectronic Devices1This standard is issued under the fixed designation E 801; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of l

2、ast revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This practice relates to the radiolog

3、ical examination ofelectronic devices for internal discontinuities, extraneous ma-terial, missing components, crimped or broken wires, anddefective solder joints in cavities, in the encapsulating materi-als, or the boards. Requirements expressed in this practice areintended to control the quality an

4、d repeatability of the radio-logical images and are not intended for controlling the accept-ability or quality of the electronic devices imaged.NOTE 1Refer to the following publications for pertinent informationon methodology and safety and protection: Guides E94and E 1000, and“General Safety Standa

5、rd for Installation Using Non-Medical X Ray andSealed Gamma Ray Sources, Energies Up to 10 MeV Equipment Designand Use,” Handbook No. 114.21.2 If a nondestructive testing agency as described inPractice E 543 is used to perform the examination, the testingagency should meet the requirements of Practi

6、ce E 543.1.3 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Ref

7、erenced Documents2.1 ASTM Standards:3E94 Guide for Radiographic ExaminationE 543 Specification for Agencies Performing Nondestruc-tive TestingE 1000 Guide for RadioscopyE 1255 Practice for RadioscopyE 1316 Terminology for Nondestructive Examinations3. Terminology3.1 DefinitionsRefer to Terminology E

8、 1316, Section D.4. Direction of Radiation4.1 When not otherwise specified, the direction of thecentral beam of radiation shall be as perpendicular (65%)aspossible to the surface of the film or detector.5. Image Quality Indicators (IQIs)5.1 The quality of all levels of radiological examinationshall

9、be determined by IQIs conforming to the followingspecifications:5.1.1 The IQIs shall be fabricated of clear acrylic plasticwith steel covers, lead spheres, gold or tungsten wires, and leadnumbers. The steel covers serve as shims.5.1.1.1 The IQIs shall conform to the requirements ofFig. 1.5.1.1.2 The

10、 IQIs shall be permanently identified with theappropriate IQI number as shown in Fig. 1. The number shallbe affixed by mounting a 0.125-in. (3.18-mm) tall lead numberon the flat bottom of a 0.250-in. (6.35-mm) diameter hole. Theidentification number shall be located as shown in Fig. 1 andshall be of

11、 sufficient contrast to be clearly discernible in theradiological image.5.1.1.3 Each semiconductor IQI will have a serial numberpermanently etched or engraved on it. Each serial number willbe traceable to the calibration image supplied by the manufac-turer. The manufacturer shall radiograph the IQI

12、with leadmarkers identifying the serial number. See Fig. 2.6. Application of the Image Quality Indicator (IQI)6.1 The application of the IQIs shall be made in such amanner as to simulate as closely as possible the device beingexamined. To accomplish this objective, a set of eight IQIs isprovided. Th

13、ese provide a range of cover thickness (of steelshim stock) that is radiologically equivalent to the range ofdevices from glass diodes or plastic-encapsulated circuits(number one) to large power or hybrid circuit devices (numbereight). Wire size increases with shim stock thickness because1This pract

14、ice is under the jurisdiction of ASTM Committee E07 on Nonde-structive Testing and is the direct responsibility of Subcommittee E07.01 onRadiology (X and Gamma) Method.Current edition approved Dec. 1, 2006. Published January 2007. Originallyapproved in 1981. Last previous edition approved in 2001 as

15、 E 801 - 01.2Available from National Institute of Standards and Technology (NIST), 100Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http:/www.nist.gov.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of AS

16、TMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.higher power devices that have thicker coverings normally uselarger interconnecting wires

17、 than small signal devices that usethin coverings. Particle size is normally independent of devicetype, so these remain constant.6.2 The IQI used shall be the one with a radiographicdensity or grey level nearest to that of the electronic devicebeing examined. The radiographic density or grey level i

18、smeasured on an area of the IQI image that contains no wire orFIG. 1 Image Quality Indicator for Electron DevicesDimensions, in. (mm)a. 0.187 ( 4.750) f. 1.00 (25.40) k. 1.125 (28.575)b. 0.375 ( 9.525) g. 0.375 ( 9.525) l. 1.313 (33.350)c. 0.500 (12.700) h. 0.500 (12.700) m. 1.50 (38.10)d. 0.625 (15

19、.875) i. 0.625 (15.875) n. 0.125 ( 3.175)e. 0.813 (20.650) j. 0.938 (23.825) p. 0.250 ( 6.350)Particle Diameter, in. (mm)G. 0.015(0.381) J. 0.006(0.152)H. 0.010(0.254) K. 0.004(0.102)I. 0.008(0.203) L. 0.002(0.051)Shim and Wire SpecificationsIQINumberShimThickness, in. (mm)Wire Diameters, in. (mm)AB

20、CDEF1 0 0.002 0.001 0.0005 0.0005 0.001 0.0020 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0051)2 0.002 0.002 0.001 0.0005 0.0005 0.001 0.002(0.051) (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)3 0.005 0.002 0.001 0.0005 0.0005 0.001 0.002(0.127) (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)4

21、 0.007 0.002 0.001 0.0005 0.0005 0.001 0.0020.178 (0.051) (0.025) (0.0127) (0.0127) (0.025) (0.051)5 0.010 0.003 0.002 0.001 0.001 0.002 0.003(0.254) (0.076) (0.051) (0.025) (0.025) (0.051) (0.076)6 0.015 0.003 0.002 0.001 0.001 0.002 0.003(0.381) (0.076) (0.051) (0.025) (0.025) (0.051) (0.076)7 0.0

22、25 0.005 0.003 0.002 0.002 0.003 0.005(0.635) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)8 0.035 0.005 0.003 0.002 0.002 0.003 0.005(0.889) (0.127) (0.076) (0.051) (0.051) (0.076) (0.127)NOTE 1Use additional layers of shim material as required. The layers shall be 1 by 1.625 in. (25.4 by 41.275

23、mm). The additional shim material shallbe identified by the placement of lead numbers which denote the thickness immediately adjacent to the IQI during exposure, or as an alternative,documented on the radiographic technique.NOTE 2Tolerance is 60.001 in. (0.025 mm) where dimensions are 0.000 and 60.0

24、03 in. (0.076 mm) where dimensions are 0.00.NOTE 3Bond materials together with cyanoacrylic or equivalent fast-drying epoxy.NOTE 4Particle holes are 0.031 in. (0.787 mm) nominal diameter.NOTE 5Tolerance on particle diameter is + 0.0003 in. (0.0076 mm).NOTE 6Wire grooves are 0.007 in. (0.178 mm) dept

25、h with 90 inclusive angle.NOTE 7The number hole is 0.25 in. (0.635 mm) nominal diameter and 0.125 in. (0.318 mm) deep.E801062particle images. It shall be measured using a calibrateddensitometer in the case of film, or by pixel grey level value inthe case of radioscopic examination. When necessary to

26、 meetthe requirements of 8.1.1, additional shim stock shall be used.The shim(s) shall be of the same type of steel as in the IQI andshall be placed under the IQI. The additional shim(s) shallexceed the IQI outside dimensions by at least 0.125 in. (3.18mm) on at least one side. The thickness of the s

27、hims shall benoted with lead numerals placed adjacent to the shimmed IQIor documented on the radiographic technique.NOTE 2Radiographic film densities shall be measured with a cali-brated densitometer. When films are exposed simultaneously in one filmholder, density variations should be determined on

28、 the single or combinedfilms, depending on the manner in which they are read and interpreted.Radiographic film density shall be in the range of 1.0 to 3.5, unlessotherwise specified.6.3 The image distortion shall not exceed 10 % unless ahigher or lower percentage is agreed upon between thepurchaser

29、and the supplier. Measurements for computation ofimage distortion shall be made in the grid formed by thecrossing wires.6.3.1 Determine percent image distortion (Note 3) as fol-lows:D 5 SM2 SA!/SA# 3 100where:D = percent distortion,SM= wire spacing as measured on the radiograph, andSA= actual wire s

30、pacing.NOTE 3Distortion may be positive or negative.6.4 Particles G through L shall be visible in the image whenIQIs 1 through 7 are used and particles G through K shall bevisible in the image when IQI number 8 is used.6.4.1 If shims are required, the number and size of particlesthat can be resolved

31、 shall be agreed on between the purchaserand the supplier.7. Positioning of IQIs7.1 The IQIs shall be placed so that the plane of the IQI isnormal to the radiation beam.7.1.1 The IQIs used for each exposure or field of view shallbe positioned at the outer edges of the film or field of view butnot im

32、peding the area of interest being examined.8. Number of IQIs8.1 Two IQIs shall be used for each radiograph as shown inFig. 3. The IQIs shall be located at diagonally opposite cornersof the film as shown in Fig. 3. In radioscopic examinations, IQIqualification is required at least once during examina

33、tion ofsimilar parts. The procedure for radioscopic IQI qualificationshall be established to subject the IQIs to the same imagemagnification and distortion as the parts will be subjected toduring inspection and the procedure shall be documented onthe radioscopic scan plan/technique.8.1.1 The radiogr

34、aphic density or grey level of the IQIsshall bracket the radiographic density or grey level of thedevices being examined. Additional shim(s) may be used asdescribed in 6.2 to achieve this requirement.9. Part Identification9.1 In radiography, the image of identification markers forthe coordination of

35、 the part with the film shall appear on thefilm, so as not to interfere with the interpretation of theradiograph and so that it is evident that the complete part orderwas obtained. These marker positions shall coincide with thepart serial number.9.2 In radioscopy, the image header for each part imag

36、eshall include a part serial number for traceability and to ensurethat the complete part order was obtained.10. Identification of the Image10.1 In both radiography and radioscopy, a system ofpositive identification of the image shall be provided inaddition to Section 9. Any or all of the following m

37、ay appear:the name of the examining laboratory, the date, the partnumber, the serial number, the date code, the view, and whetheroriginal or subsequent exposure.11. Multiple-Film Techniques11.1 Film techniques with two or more films of equal ordifferent speeds in the same holder will be permitted, p

38、rovidedthat the appropriate wires and particles in the IQI for a specificarea are demonstrated.12. Non-Film Techniques12.1 The use of non-film imaging techniques will be per-mitted, provided that the applicable IQI wires and particles aredemonstrated in the resultant image.13. Image Quality13.1 The

39、radiographic image shall be free of blemishes thatinterfere with its interpretation.14. Source-Film Distance14.1 Any source-film distance will be satisfactory providedthat the required IQI quality level is attained.NOTE 1Permanently etched or engraved serial number.NOTE 218 in. lead markers correspo

40、nding to serial number.FIG. 2 Arrangement of IQI and Lead Serial Number for CalibrationImageE80106315. Records15.1 Complete records of the radiological technique or scanplan details, or both, shall be maintained by the examininglaboratory.15.2 A calibration image shall be made by exposing theindivid

41、ual semiconductor IQI at the proper distance from thefocal spot. The IQI shall be centered in the beam during thisexposure. The certificate shall show the actual dimensions ofthe grids formed by the cross wires and the parallel varianceswithin the grid. It shall also state the actual size of eachpar

42、ticle.16. Keywords16.1 electronic devices; IQIs; radiography; radioscopy;shim; wireASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the

43、validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your

44、comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments h

45、ave not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).FIG. 3 Typical Image Quality Indicator Arrangement for Electronic DeviceE801064