BS 123100-003-2001 System of quality assessment - Capability detail specification - Rigid single-sided and double-sided printed boards with plain holes《质量评估体系 性能详细规范 带光孔的刚性单面和双面印制板.pdf

1、BRITISH STANDARD BS 123100-003: 2001 System of quality assessment Capability detail specification Rigid single-sided and double-sided printed boards with plain holes ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123100-003:2001 This British Standard, having been

2、 prepared under the direction of the Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard: Committee ref

3、erence EPL/501 Draft for comment 01/204153 DC ISBN 0 580 38519 1 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Co

4、ntract Electronics Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentBS 12

5、3100-003:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 2 4 Capability qualifying component 2 5 Range of capability approval 4 6 Capability test programme 4 7 Additional capa

6、bility 5 8 Traceability 5 Annex A (normative) Test pattern for marking inks 16 Annex B (normative) Test pattern for solder masks 17 Annex C (normative) Use of ANSI/IPC A-600F 18 Annex D (normative) Test method for determination of characteristic impedance by Time Domain Reflectometry (TDR) 21 Annex

7、E (informative) Sample handling considerations for TDR 28 Annex F (informative) Additional information about TDR 29 Bibliography 31 Figure A.1 Test pattern for marking inks 16 Figure B.1 Test pattern for solder masks 17 Figure D.1 Test specimen details 24 Figure D.2 Possible equipment configuration

8、25 Figure D.3 Schematic showing undisturbed interval in situ method 26 Figure D.4 Incident wave voltage showing 2 air line delay 27 Figure D.5 Schematic showing undisturbed interval 28 Table 1 Base materials 2 Table 2 Metallic finishes 3 Table 3 Organic finishes 3 Table 4 Capability approval test sc

9、hedule and performance requirements General 6 Table 5 Capability approval test schedule and performance requirements Additional metallic conductor finishes 11 Table 6 Capability approval test schedule and performance requirements Additional contact finishes 13 Table 7 Capability approval test schedu

10、le and performance requirements Permanent organic finishes 14 Table C.1 Capability approval test schedule General and additional metallic conductor finishes 18 Table C.2 Capability approval test schedule Printed contacts 19 Table C.3 Capability approval test schedule Solder resist 20 Table C.4 Capab

11、ility approval test schedule Flexible/flex-rigid printed boards 20BS 123100-003:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to

12、revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant deroga

13、tion from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replace

14、d by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC

15、A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires s

16、tandards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a capability detail specification, based upon the sectional specification, BS 123100. It should be read in conjunction with the generic specification, BS 123000, and the s

17、ectional specification, BS 123100. Users of printed boards procured using this capability detail specification should satisfy themselves that the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specificat

18、ion. ACKNOWLEDGEMENT. Many of the illustrations in this British Standard have been included courtesy of IPC. Moreover, selected requirements from ANSI/IPC A-600F have been incorporated into the requirements of this British Standard. Copies of this and other IPC publications are widely available, but

19、 in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509 9798 www.ipc.orgBS 123100-003:2001 BSI 17 December 2001 iii Annex A, Annex B, Annex C and Annex D are normative. Annex E and Annex F are informative. It has been assumed in the preparatio

20、n of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsib

21、le for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 31 and a back cover. The BSI copyright notice displayed in this doc

22、ument indicates when the document was last issued.iv blankBS 123100-003:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for te

23、sting basic and additional capability, in relation to rigid single-sided and double-sided printed boards with plain holes. It is applicable for rigid single-sided and double-sided printed boards with plain holes made with the materials and surface finishes specified in clause 4. This British Standar

24、d is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated r

25、eferences, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 2011-2.1Ca (IEC 60068-2-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state. BS 2011-2.1Ta (IEC 60

26、068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solderability testing by the wetting balance method. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and

27、 electronics Group 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123100:2001, System of quality assessment Sectional specification Rigid single-sided and do

28、uble-sided printed boards with plain holes. BS EN 60249-2-1 (IEC 60249-2-1), Specifications Part 2-1: Specification for phenolic cellulose paper copper-clad laminated sheet, high electrical quality. BS EN 60249-2-2 (IEC 60249-2-2), Specifications Part 2-2: Specification for phenolic cellulose paper

29、copper-clad laminated sheet, economic quality. BS EN 60249-2-3 (IEC 60249-2-3), Specifications Part 2-3: Metal-clad base materials for printed wiring boards Copper-clad base material Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

30、. BS EN 60249-2-4 (IEC 60249-2-4), Specifications Part 2-4: Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade. BS EN 60249-2-5 (IEC 60249-2-5), Specifications Part 2-5: Specification No. 5 Epoxide woven glass fabric copper-clad laminated sheet of defined

31、 flammability (vertical burning test). BS EN 60249-2-6 (IEC 60249-2-6), Specifications Part 2-6: Specification No. 6 Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test). BS EN 60249-2-7 (IEC 60249-2-7), Specifications Part 2-7: Specification No. 7 P

32、henolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 61249 (IEC 61249) (all parts), Materials for interconnection structures. BS EN ISO 1463:1982, Metallic and oxide coatings Measurement thickness Microscopical method. BS EN ISO 3543:1981, Metall

33、ic and non-metallic coatings Measurement thickness Beta backscatter method. BS QC 221100, Radio frequency connectors RF coaxial connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with screw coupling Characteristic impedance 50 ohms (Type SMA). ANSI/IPC A-600F, Acceptability of prin

34、ted boards.BS 123100-003:2001 2 BSI 17 December 2001 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123100 together with the following apply. 3.1 referee method test method, where a choice of methods is given,

35、 to be used in the case of disputed test data arising from the two methods 4 Capability qualifying component 4.1 General Test boards to be used as capability qualifying components for basic capability shall: a) be made from one of the copper-clad base materials specified in 4.2, with a base material

36、 thickness of (1.6 0.14) mm, and 35 m copper foil on both sides; b) bear the composite test pattern specified in BS 123100:2001, 9.3 (or equivalent composite test pattern); c) have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 4.3. Test boards to be used as modi

37、fied capability qualifying components for the demonstration of additional capability shall be as specified in clause 7. 4.2 Base materials For the demonstration of basic capability, the base materials specified in Table 1 shall be used and shall conform to the performance requirements specified in T

38、able 4, Table 5, Table 6 and Table 7. For the demonstration of additional capability, if base materials other than those specified in Table 1 are used, they shall be detailed in the manufacturers capability manual. Base materials used for the demonstration of additional capability shall conform to t

39、he performance requirements specified in Table 4, Table 5, Table 6 and Table 7 unless they have inherent electrical or physical characteristics that prevent the performance requirements from being met, in which case they shall conform to the criteria detailed in the relevant base material specificat

40、ion. Table 1 Base materials Material group designation Material specified in Base material type Grade Base material thickness range Copper thickness mm m A BS EN 60249-2-1 Phenolic paper High electrical 0.2 to 6.4 18, 35, 70, 105 BS EN 60249-2-2 Phenolic paper Economic BS EN 60249-2-3 Epoxide paper

41、Defined flammability (vertical) BS EN 60249-2-6 Phenolic paper Defined flammability (horizontal) BS EN 60249-2-7 Phenolic paper Defined flammability (vertical) B BS EN 60249-2-4 Epoxide woven glass General purpose 0.2 to 6.4 18, 35, 70, 105 BS EN 60249-2-5 Epoxide woven glass Defined flammability (v

42、ertical)BS 123100-003:2001 BSI 17 December 2001 3 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes shall be as specified in Table 2. Table 2 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 1

43、2, 13, 14, 15, 16, 17 or 18. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separately. 4.3.1.2 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16, 17 or 18

44、to solder after extended or adverse storage conditions shall be demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inclusion of an ast

45、erisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified product list. 4.3.2 Organic finishes Organic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b, c or d shall b

46、e over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder resist shall be tested separately. Finish group designation Surface finish Abbreviation Revalidation period a 11 Bare copper Cu 1 month 12 Copper with solderable organic protective coating Cu (opc) 6 months 13

47、Copper with oxide Cu (CuO) Not applicable 14 Tin, TinLead Sn, SnPb 12 months 15 TinLead (fused) SnPb (f) 12 months 16 TinLead (dipped and levelled) SnPb (dl) 18 months 17 TinLead (roller coated) SnPb (rt) 3 months 18 Immersion gold over electroless nickel AuNi (smt) 3 months 19 Not assigned 20 Not a

48、ssigned 21 Specimen K b5 m, gold-plated on copper; all other specimens using finish group 11 to 18 c 5 AuCu 22 Specimen K b0.7 m, gold-plated on nickel; all other specimens using finish group 11 to 18 c 0.7 AuNi 23 Specimen K b2.5 m, gold-plated on copper; all other specimens using finish group 11 t

49、o 18 c 2.5 AuCu 24 Specimen K b2.5 m, gold-plated on nickel; all other specimens using finish group 11 to 18 c 2.5 AuNi a See BS 123000:2001, 4.4. b The specimens are defined in BS 123100:2001, Figure 1. c See clause 5. Finish group designation Organic finish Abbreviation a Dry film solder mask DSM b Wet resist solder mask WSM c Liquid photopolymer solder mask LSM dM a r k i n g i n k M I e Conductive ink CIBS 123100-003: