BS 123100-2001 System of quality assessment - Sectional specification - Rigid single-sided and double-sided printed boards with plain holes《质量评估体系 分规范 带光孔的刚性单面和双面印制板》.pdf

1、BRITISH STANDARD BS 123100:2001 System of quality assessment Sectional specification Rigid single-sided and double-sided printed boards with plain holes ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123100:2001 This British Standard, having been prepared under t

2、he direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to the work on this British Standard: Committee reference EPL/501 D

3、raft for comment 01/204152 DC ISBN 0 580 38518 3 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Engineers

4、 Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123100:2001 BSI 17

5、December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality conformity inspection

6、 2 9 Test patterns and test boards 6 Bibliography 9 Figure 1 Composite test pattern 7 Figure 2 Examples of multiple arrangements 8 Table 1 Group A quality conformity inspection 3 Table 2 Group B quality conformity inspection 4 Table 3 Group C quality conformity inspection 5 Table 4 Test specimen det

7、ails 6BS 123100:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circ

8、ulated and voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publis

9、h national standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they

10、 are considered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undert

11、aken in response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take

12、account of new European Eco-Directives. This British Standard is a sectional specification. It should be read in conjunction with the generic specification, BS 123000, and any associated capability detail specification. It has been assumed in the preparation of this British Standard that the executi

13、on of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Complianc

14、e with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 9 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last

15、issued.BS 123100:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformity inspection (lot-by-lot and periodic inspection). It is applicable for all rigid single-sided and

16、double-sided printed boards with plain holes, irrespective of their method of manufacture, when they are ready for the mounting of components. This British Standard is a sectional specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative referen

17、ces The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the p

18、ublication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling proc

19、edures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed w

20、iring boards. BS 123000:2001, System of quality assessment Generic specification Printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and BS 123000 together with the following apply. 3.1 relevant specification product

21、 specification for an actual batch of printed boards, i.e. a customer detail specification as well as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General requirements The following specifications for rigid single-sided and double-sided print

22、ed boards with plain holes shall be prepared, unless a suitable capability detail specification already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying to specific applications; b) customer detail specifications, which shall be prepared

23、 in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123100-003 is an example of a capability detail specification for rigid single-sided and double-sided printed boards with plain holes. NOTE 2 A capability detail specification is prepared either by an international or national body or by a manufactu

24、rer (see also BS CECC 00111-4). A customer detail specification should preferably be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capability approval 5.1 Basic capability Testing shall be carried out on

25、the composite test pattern detailed in clause 9. 5.2 Additional capability BS 123000:2001, 5.3.3 shall apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply.BS 123100:2001 2 BSI 17 December 2001 6 Relevant specification The re

26、levant specification shall contain all the information necessary to define the printed board clearly and completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without tolerances, or simple maximum or minimum values, shall be given

27、 where these are sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in BS 6221-3 shall be ap

28、plied as practical. In the case of discrepancy between the customer detail specification and other pertinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specification shall prevail. 7 Capability test programme For initi

29、al demonstration and subsequent re-demonstration, the capability approval test programme shall be in accordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001, 5.3.3. NOTE For composite test pattern specimens, see

30、clause 9 and Figure 1. Examples of multiple arrangements of test patterns are shown in Figure 2. There shall be no failures during any demonstration of capability. 8 Quality conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples that are either taken from the p

31、roduction batch, or representative of the production batch (i.e. manufactured using the same processes, having the same features, and concurrent with the released batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be used. In all cases th

32、ere shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be included in the panel. They may be

33、based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection groups Inspection level C shall be used, unless another inspection level is specified in the customer detail specification. Other inspection levels shall be in accordance with Table 1 and Table 2

34、 Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For definition of the inspection groups, see BS 123000:2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.BS 123100:2001 BSI 17 December 2

35、001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Conformity 1

36、S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Conductor defects 1a S2 2.5 % 100 % Misalignment of solder resist and land 1a S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimensi

37、ons 2 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 % Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Positional tolerance of hole centres 2 S1 4.0 % S4 2.5 % Misalignment of solder resist and

38、land 2a S1 2.5 % S4 2.5 % Subgroup A3 Spare group for additional group A tests NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999,

39、Table 1). c Acceptable quality level.BS 123100:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group B1 Dimensional in

40、terchangeability See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Board thickness (contact zone) 2 S2 2.5 % Flatness 12a S3 2.5 % Sub-group B2 Solderability As received 14a S2 2.5 % S3 2.5 % After accelerated ageing 20a S2 2.5 % S3 2.5 % Sub-group B3 Thermal shock tests Not applicable Sub-group B

41、4 Mechanical tests Peel strength, standard atmospheric conditions 10a S2 2.5 % Pull-off strength, lands with plain holes 11a S2 2.5 % Sub-group B5 Surface finish tests Adhesion of plating 13a S1 2.5 % S2 2.5 % Porosity of edge contact plating 13d #, 13e S1 2.5 % S2 2.5 % Thickness of plating, contac

42、t areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests Testing details marked “#” shall be included in the relevant capability detail specification. NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifi

43、cations. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6006-1:1999, Table 1). c Acceptability quality level.BS 123100:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. aAssessment level A Assessment level B Asses

44、sment level C Assessment level D No. bDefects c No. Defects No. Defects No. Defects Sub-group C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Insulation resistance: as received, and after damp heat 6a 20 1 Process contamination # 20 1 Resistance to solder # 6 1 Solv

45、ent and flux resistance # 6 1 Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals Testing details marked “#” shall be included in the relevant capability detail specification. NOTE This listing may be subject to continuing review, as required by

46、the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Number of specimens to be tested. c Maximum permissible number of defects.BS 123100:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 General A test pattern shall consist of: a) a

47、part of a conductive pattern on a production board (and used in the application of the printed board); or b) a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a test coupon (a portion of a printed board or a panel detach

48、ed prior to using the printed board); or 2) on a separate test board. 9.2 Capability approval testing Basic capability shall be assessed using the composite test pattern given in 9.3. Where additional capability claims are for a larger board size (active area) than that of a test board bearing one c

49、omposite test pattern (160 mm 160 mm), multiple arrangements as given in 9.4 shall be used. NOTE See also BS 123000:2001, 5.3. 9.3 Composite test pattern The composite test pattern shall be used for testing capability (see BS 123000:2001, 5.3). NOTE Using the single test specimens of the composite test pattern shown in Figure 1, the tests shown in Table 4 can be made. Table 4 Test specimen details 9.4 Multiple arrangements of the composite test pattern Where additional capability claims are for larger boar