1、BRITISH STANDARD BS 123200-003: 2001 System of quality assessment Capability detail specification Rigid double-sided printed boards with plated-through holes ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123200-003:2001 This British Standard, having been prepare
2、d under the direction of the Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard: Committee reference E
3、PL/501 Draft for comment 01/204155 DC ISBN 0 580 38521 3 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract E
4、lectronics Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentBS 123200-003
5、:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 2 4 Capability qualifying component 2 5 Range of capability approval 4 6 Capability test programme 4 7 Additional capability 5
6、 8 Traceability 5 Annex A (normative) Test pattern for marking inks 20 Annex B (normative) Test pattern for solder masks 21 Annex C (normative) Test pattern for bonded heatsinks 22 Annex D (normative) Use of ANSI/IPC A-600F 23 Annex E (normative) Test method for determination of characteristic imped
7、ence by Time Domain Reflectometry (TDR) 26 Annex F (informative) Sample handling considerations for TDR 33 Annex G (informative) Additional information about TDR 34 Bibliography 35 Figure A.1 Test pattern for marking inks 20 Figure B.1 Test pattern for solder masks 21 Figure C.1 Test pattern for bon
8、ded heatsinks 22 Figure E.1 Test specimen details 29 Figure E.2 Possible equipment configuration 30 Figure E.3 Schematic showing undisturbed interval in situ method 31 Figure E.4 Incident wave voltage showing 2 air line delay 32 Figure E.5 Schematic showing undisturbed interval 33 Table 1 Base mater
9、ials 2 Table 2 Metallic finishes 3 Table 3 Organic finishes 3 Table 4 Capability approval test schedule and performance requirements General 6 Table 5 Capability approval test schedule and performance requirements Additional metallic conductor finishes 12 Table 6 Capability approval test schedule an
10、d performance requirements Additional contact finishes 15 Table 7 Capability approval test schedule and performance requirements Permanent organic finishes 16 Table 8 Capability approval test schedule and performance requirements Bonded heatsinks 18 Table D.1 Capability approval test schedule Genera
11、l and additional metallic conductor finishes 23 Table D.2 Capability approval test schedule Printed contacts 24 Table D.3 Capability approval test schedule Solder resist 25 Table D.4 Capability approval test schedule Flexible/flex-rigid printed boards 25BS 123200-003:2001 ii BSI 17 December 2001 For
12、eword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC
13、Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 12
14、3000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN
15、 series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) Refere
16、nces to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This Bri
17、tish Standard is a capability detail specification, based upon the sectional specification, BS 123200. It should be read in conjunction with the generic specification, BS 123000, and the sectional specification, BS 123200. Users of printed boards procured using this capability detail specification s
18、hould satisfy themselves that the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specification. ACKNOWLEDGEMENT. Many of the illustrations in this British Standard have been included courtesy of IPC. Mor
19、eover, selected requirements from ANSI/IPC A-600F have been incorporated into the requirements of this British Standard. Copies of this and other IPC publications are widely available, but in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509
20、 9798 www.ipc.orgBS 123200-003:2001 BSI 17 December 2001 iii Annex A, Annex B, Annex C, Annex D and Annex E are normative. Annex F and Annex G are informative. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qual
21、ified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity
22、 from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 35 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.iv blankBS 123200-003:2001 BSI 17 December 2001 1 1 S
23、cope This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid double-sided printed boards with plated-thr
24、ough holes. It is applicable for rigid double-sided printed boards with plated-through holes made with the materials and surface finishes specified in clause 4. This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic compo
25、nents. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, t
26、he latest edition of the publication referred to applies. BS 2011-2.1Ca (IEC 60068-2-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state. BS 2011-2.1Ta (IEC 60068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solderability testing by the wetting balance method.
27、 BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of te
28、st. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123200:2001, System of quality assessment Sectional specification Rigid double-sided printed boards with plated-through holes. BS EN 60249-2-1 (IEC 60249-2-1), Specifications Part 2-1: Specification for phenoli
29、c cellulose paper copper-clad laminated sheet, high electrical quality. BS EN 60249-2-2 (IEC 60249-2-2), Specifications Part 2-2: Specification for phenolic cellulose paper copper-clad laminated sheet, economic quality. BS EN 60249-2-3 (IEC 60249-2-3), Specifications Part 2-3: Metal-clad base materi
30、als for printed wiring boards Copper-clad base material Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-4 (IEC 60249-2-4), Specifications Part 2-4: Specification for epoxide woven glass fabric copper-clad laminated
31、sheet, general purpose grade. BS EN 60249-2-5 (IEC 60249-2-5), Specifications Part 2-5: Specification No. 5 Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-6 (IEC 60249-2-6), Specifications Part 2-6: Specification No. 6 Phenolic c
32、ellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test). BS EN 60249-2-7 (IEC 60249-2-7), Specifications Part 2-7: Specification No. 7 Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 61249 (IEC 61249) (a
33、ll parts), Materials for interconnection structures. BS EN ISO 1463:1982, Metallic and oxide coatings Measurement thickness Microscopical method. BS EN ISO 3543:1981, Metallic and non-metallic coatings Measurement thickness Beta backscatter method. BS QC 221100, Radio frequency connectors RF coaxial
34、 connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with screw coupling Characteristic impedance 50 ohms (Type SMA). ANSI/IPC A-600F, Acceptability of printed boards.BS 123200-003:2001 2 BSI 17 December 2001 3 Terms and definitions For the purposes of this British Standard the term
35、s and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123200 together with the following apply. 3.1 referee method test method, where a choice of methods is given, to be used in the case of disputed test data arising from the two methods 4 Capability qualifying component 4.1 General Test b
36、oards to be used as capability qualifying components for basic capability shall: a) be made from one of the copper-clad base materials specified in 4.2, with a base material thickness of (1.6 0.14) mm, and 35 m copper foil on both sides; b) bear the composite test pattern specified in BS 123200:2001
37、, 9.3 (or equivalent composite test pattern); c) have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 4.3. Test boards to be used as modified capability qualifying components for the demonstration of additional capability shall be as specified in clause 7. 4.2 Bas
38、e materials For the demonstration of basic capability, the base materials specified in Table 1 shall be used and shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Table 8. For the demonstration of additional capability, if base materials other than tho
39、se specified in Table 1 are used, they shall be detailed in the manufacturers capability manual. Base materials used for the demonstration of additional capability shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Table 8 unless they have inherent elec
40、trical or physical characteristics that prevent the performance requirements from being met, in which case they shall conform to the criteria detailed in the relevant base material specification. Table 1 Base materials 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes sh
41、all be as specified in Table 2. Material group designation Material specified in Base material type Grade Base material thickness range Copper thickness mm m A BS EN 60249-2-1 Phenolic paper High electrical 0.2 to 6.4 18, 35, 70, 105 BS EN 60249-2-2 Phenolic paper Economic BS EN 60249-2-3 Epoxide pa
42、per Defined flammability (vertical) BS EN 60249-2-6 Phenolic paper Defined flammability (horizontal) BS EN 60249-2-7 Phenolic paper Defined flammability (vertical) B BS EN 60249-2-4 Epoxide woven glass General purpose 0.2 to 6.4 18, 35, 70, 105 BS EN 60249-2-5 Epoxide woven glass Defined flammabilit
43、y (vertical)BS 123200-003:2001 BSI 17 December 2001 3 Table 2 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. Each claimed combination of metallic finishes shall be tested separately. Select
44、ive and non-selective finishes of the same material, where claimed, shall be demonstrated separately. 4.3.1.2 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16, 17 or 18 to solder after extended or adverse storage conditions shall be demonstrated using accelerated ageing. This t
45、est shall be carried out on those finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified p
46、roduct list. 4.3.2 Organic finishes Organic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder resist shall be tes
47、ted separately. Finish group designation Surface finish Abbreviation Revalidation period a 11 Bare copper Cu 1 month 12 Copper with solderable organic surface protection Cu (osp) 6 months 13 Copper with oxide Cu (CuO) Not applicable 14 Tin, TinLead Sn, SnPb 12 months 15 TinLead (fused) SnPb (f) 12 m
48、onths 16 TinLead (dipped and levelled) SnPb (dl) 18 months 17 TinLead (roller coated) SnPb (rt) 3 months 18 Immersion gold over electroless nickel AuNi (smt) 3 months 19 Not assigned 20 Not assigned 21 Specimen K b5 m, gold-plated on copper; all other specimens using finish group 11 to 18 c 5 AuCu 2
49、2 Specimen K b0.7 m, gold-plated on nickel; all other specimens using finish group 11 to 18 c 0.7 AuNi 23 Specimen K b2.5 m, gold-plated on copper; all other specimens using finish group 11 to 18 c 2.5 AuCu 24 Specimen K b2.5 m, gold-plated on nickel; all other specimens using finish group 11 to 18 c 2.5 AuNi a See BS 123000:2001, 4.4. b The specimens are defined in BS 123200:2001, Figure 1 and Figure 2. c See claus
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