BS 123400-003-2001 System of quality assessment - Capability detail specification - Flexible single-sided and double-sided printed boards without through-connections《质量评估体系 性能的详细规范.pdf

1、BRITISH STANDARD BS 123400-003: 2001 System of quality assessment Capability detail specification Flexible single-sided and double-sided printed boards without through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123400-003:2001 This British Standar

2、d, having been prepared under the direction of the Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard:

3、 Committee reference EPL/501 Draft for comment 01/204159 DC ISBN 0 580 38524 8 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Ass

4、ociation of Contract Electronics Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Dat

5、e CommentBS 123400-003:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 2 4 Capability qualifying component 2 5 Range of capability approval 5 6 Capability test programme 5 7 A

6、dditional capability 6 8 Traceability 6 Annex A (normative) Test pattern for marking inks 19 Annex B (normative) Test pattern for solder masks 20 Annex C (normative) Assembly of test pattern for rigidizers or stiffeners 21 Annex D (normative) Use of ANSI/IPC A-600F 23 Annex E (normative) Test method

7、 for solder resistance of organic coatings 25 Bibliography 27 Figure A.1 Test pattern for marking inks 19 Figure B.1 Test pattern for solder mask or coverlayer 20 Figure C.1 Assembly of test pattern for rigidizers or stiffeners 21 Figure C.2 Component parts of test pattern for rigidizers or stiffene

8、rs 22 Table 1 Base materials 3 Table 2 Metallic finishes 4 Table 3 Organic finishes 4 Table 4 Capability approval test schedule and performance requirements General 7 Table 5 Capability approval test schedule and performance requirements Additional metallic conductor finishes 11 Table 6 Capability a

9、pproval test schedule and performance requirements Additional contact finishes 14 Table 7 Capability approval test schedule and performance requirements Permanent organic finishes 15 Table 8 Capability approval test schedule and performance requirements Bonded stiffeners and rigidizers 17 Table D.1

10、Capability approval test schedule General and additional metallic conductor finishes 23 Table D.2 Capability approval test schedule Printed contacts 24 Table D.3 Capability approval test schedule Solder resist 25 Table D.4 Capability approval test schedule Flexible/flex-rigid printed boards 25BS 123

11、400-003:2001 ii BSI 17 December 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated a

12、nd voted on in CENELEC, but the CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish nation

13、al standards on the basis of the prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are con

14、sidered to be an improvement upon the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in

15、response to industry requests. c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account

16、of new European Eco-Directives. This British Standard is a capability detail specification, based upon the sectional specification, BS 123400. It should be read in conjunction with the generic specification, BS 123000, and the sectional specification, BS 123400. Users of printed boards procured usin

17、g this capability detail specification should satisfy themselves that the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specification. ACKNOWLEDGEMENT. Selected requirements from ANSI/IPC A-600F have be

18、en incorporated into the requirements of this British Standard. Copies of this and other IPC publications are widely available, but in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509 9798 www.ipc.orgBS 123400-003:2001 BSI 17 December 2001

19、iii Annex A, Annex B, Annex C, Annex D and Annex E are normative. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not

20、purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside fro

21、nt cover, pages i to iv, pages 1 to 27 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.iv blankBS 123400-003:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies the capability qualifying component, its characteristics

22、to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible single-sided and double-sided printed boards without through-connections. It is applicable for flexible single-sided and double-sided

23、printed boards without through-connections made with the materials and surface finishes specified in clause 4. This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normat

24、ive documents contain provisions which, through reference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to a

25、pplies. BS 2011-2.1Ca (IEC 60068-2-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state. BS 2011-2.1T:1981 (IEC 60068-2-20:1979), Environmental testing Part 2.1: Tests Test T Soldering. BS 2011-2.1Ta (IEC 60068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solde

26、rability testing by the wetting balance method. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:199

27、0), Printed wiring boards Part 2: Methods of test. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123400:2001, System of quality assessment Sectional specification Flexible single-sided and double-sided printed boards without through-connections. BS EN 60068-2-

28、2 (IEC 60068-2-2), Environmental testing Test methods Part 2-2: Test B Dry heat. BS EN 60249-2-1 (IEC 60249-2-1), Specifications Part 2-1: Specification for phenolic cellulose paper copper-clad laminated sheet, high electrical quality. BS EN 60249-2-2 (IEC 60249-2-2), Specifications Part 2-2: Specif

29、ication for phenolic cellulose paper copper-clad laminated sheet, economic quality. BS EN 60249-2-3 (IEC 60249-2-3), Specifications Part 2-3: Metal-clad base materials for printed wiring boards Copper-clad base material Specification for epoxide cellulose paper copper-clad laminated sheet of defined

30、 flammability (vertical burning test). BS EN 60249-2-4 (IEC 60249-2-4), Specifications Part 2-4: Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade. BS EN 60249-2-5 (IEC 60249-2-5), Specifications Part 2-5: Specification No. 5 Epoxide woven glass fabric c

31、opper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-6 (IEC 60249-2-6), Specifications Part 2-6: Specification No. 6 Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test). BS EN 60249-2-7 (IEC 60249-2-7), Specifica

32、tions Part 2-7: Specification No. 7 Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). BS EN 60249-2-8 (IEC 60249-2-8), Base material for printed circuits Specifications Part 2-8: Specification for flexible copper-clad polyester (PETP) film. BS EN 6

33、0249-2-13 (IEC 60249-2-13), Base material for printed circuits Specifications Part 2-13: Flexible copper-clad polyimide film, general purpose grade. BS EN 60249-2-14 (IEC 60249-2-14), Specifications Part 2-14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical bur

34、ning test), economic quality. BS EN 60249-2-15 (IEC 60249-2-15), Specifications Part 2-15: Flexible copper-clad polyimide film, of defined flammability.BS 123400-003:2001 2 BSI 17 December 2001 BS EN ISO 1463:1982, Metallic and oxide coatings Measurement thickness Microscopical method. BS EN ISO 354

35、3:1981, Metallic and non-metallic coatings Measurement thickness Beta backscatter method. ANSI/IPC A-600F, Acceptability of printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123400 together with t

36、he following apply. 3.1 referee method test method, where a choice of methods is given, to be used in the case of disputed test data arising from the two methods 4 Capability qualifying component 4.1 General Test boards to be used as capability qualifying components for basic capability shall: a) be

37、 made of one of the copper-clad base materials specified in 4.2; b) bear the composite test pattern specified in BS 123400:2001, 9.3 (or equivalent composite test pattern); c) have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16 or 17 in 4.3; d) be fabricated using a copper th

38、ickness determined by the needs of the process and parameters to be demonstrated (e.g. conductor width and separation). The copper thickness shall be detailed in the capability manual. Test boards to be used as capability qualifying components for additional capability shall be modified to demonstra

39、te the claimed capability. See BS 123000:2001, 5.3.3. 4.2 Base materials For the demonstration of basic capability, the base materials specified in Table 1 shall be used and shall conform to the performance requirements specified in Table 4, Table 5, Table 6, Table 7 and Table 8. For the demonstrati

40、on of additional capability, if base materials other than those specified in Table 1 are used, they shall be detailed in the manufacturers capability manual. Base materials used for the demonstration of additional capability shall conform to the performance requirements specified in Table 4, Table 5

41、 Table 6, Table 7 and Table 8 unless they have inherent electrical or physical characteristics that prevent the performance requirements from being met, in which case they shall conform to the criteria detailed in the relevant base material specification.BS 123400-003:2001 BSI 17 December 2001 3 Ta

42、ble 1 Base materials 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes shall be as specified in Table 2. Material group designation Material specified in Base material type a Grade Base material thickness range Copper thickness mm m A BS EN 60249-2-8 Polyester film Gener

43、al purpose 12.5 to 125 18, 35, 70 B BS EN 60249-2-13 Polyimide film General purpose BS EN 60249-3-15 Polyimide film Defined flammability (vertical) C BS EN 60249-2-8 Polyester film General purpose 0, 18, 35, 70 D BS EN 60249-2-13 Polyimide film General purpose BS EN 60249-2-15 Polyimide film Defined

44、 flammability (vertical) E BS EN 60249-2-1 Phenolic paper High electrical 200 to 6 400 BS EN 60249-2-2 Phenolic paper Economic BS EN 60249-2-3 Epoxide paper Defined flammability (vertical) BS EN 60249-2-6 Phenolic paper Defined flammability (horizontal) BS EN 60249-2-7 Phenolic paper Defined flammab

45、ility (vertical) BS EN 60249-2-14 Phenolic paper Economic, defined flammability (vertical) F BS EN 60249-2-4 Epoxide woven glass General purpose 200 to 6 400 0, 18, 35, 70 BS EN 60249-2-5 Epoxide woven glass Defined flammability a Material group designations: A and B cover the base materials for fle

46、xible circuits; C and D cover materials for film stiffeners; E and F cover rigid board materials used for the fabrication of rigidizers.BS 123400-003:2001 4 BSI 17 December 2001 Table 2 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish fr

47、om groups 11, 12, 13, 14, 15, 16 or 17. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separately. 4.3.1.2 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16

48、 or 17 to solder after extended or adverse storage conditions shall be demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inclusion of

49、 an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified product list. 4.3.2 Organic finishes Organic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b, c, d or e shall be over a finish from groups 11, 12, 13, 14, 15, 16 or 17. All claimed types of solder resist shall be tested separately.