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本文(BS 123600-003-2001 System of quality assessment - Capability detail specification - Flex-rigid multilayer printed boards with through-connections《质量评估体系 性能的详细规范 直通连接的软-硬性多层印制板》.pdf)为本站会员(proposalcash356)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

BS 123600-003-2001 System of quality assessment - Capability detail specification - Flex-rigid multilayer printed boards with through-connections《质量评估体系 性能的详细规范 直通连接的软-硬性多层印制板》.pdf

1、BRITISH STANDARD BS 123600-003: 2001 System of quality assessment Capability detail specification Flex-rigid multilayer printed boards with through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123600-003:2001 This British Standard, having been prepa

2、red under the direction of the Electrotechnical Standards Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to work on this British Standard: Committee reference

3、 EPL/501 Draft for comment 01/204163 DC ISBN 0 580 38528 0 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract

4、 Electronics Manufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentBS 123600-0

5、03:2001 BSI 17 December 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 2 4 Capability qualifying component 2 5 Range of capability approval 4 6 Capability test programme 5 7 Additional capability

6、 5 8 Traceability 5 Annex A (normative) Use of ANSI/IPC A-600F 16 Bibliography 19 Table 1 Base materials 3 Table 2 Metallic finishes 3 Table 3 Organic finishes 4 Table 4 Capability approval test schedule and performance requirements General 6 Table 5 Capability approval test schedule and performance

7、 requirements Additional metallic conductor finishes 11 Table 6 Capability approval test schedule and performance requirements Additional contact finishes 13 Table 7 Capability approval test schedule and performance requirements Permanent organic finishes 14 Table A.1 Capability approval test schedu

8、le General and additional metallic conductor finishes 16 Table A.2 Capability approval test schedule Printed contacts 17 Table A.3 Capability approval test schedule Solder resist 18 Table A.4 Capability approval test schedule Flexible/flex-rigid printed boards 18BS 123600-003:2001 ii BSI 17 December

9、 2001 Foreword This British Standard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the

10、 CENELEC Technical Board decided not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of th

11、e prEN 123000 series (Technical Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement up

12、on the EN series, for the following reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests.

13、c) References to obsolete CECC regulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives.

14、 This British Standard is a capability detail specification, based upon the sectional specification, BS 123600. It should be read in conjunction with the generic specification, BS 123000, and the sectional specification, BS 123600. Users of printed boards procured using this capability detail specif

15、ication should satisfy themselves that the sample sizes and frequencies are appropriate for the needs of their product. Alternative requirements should be included in the customer detail specification. ACKNOWLEDGEMENT. Selected requirements from ANSI/IPC A-600F have been incorporated into the requir

16、ements of this British Standard. Copies of this and other IPC publications are widely available, but in case of difficulties contact: IPC 2215 Sanders Road Northbrook Illinois USA Tel: +847 509 9700 Fax: +847 509 9798 www.ipc.orgBS 123600-003:2001 BSI 17 December 2001 iii Annex A is normative. It ha

17、s been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and experienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of

18、 British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 19 and a back cover. This BSI copyr

19、ight notice displayed in this document indicates when the document was last issued.iv blankBS 123600-003:2001 BSI 17 December 2001 1 1 Scope This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the re

20、quirements to be fulfilled for testing basic and additional capability, in relation to flex-rigid multilayer printed boards with through-connections. It is applicable for flex-rigid multilayer printed boards with through-connections made with the materials and surface finishes specified in clause 4.

21、 This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this British

22、Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 2011-2.1Ca (IEC 60068-2-3), Environmental testing Part 2.1: Tests Test Ca Damp heat, steady state.

23、BS 2011-2.1Ta (IEC 60068-2-54), Environmental testing Part 2.1: Tests Test Ta Soldering Solderability testing by the wetting balance method. BS 4584-103.1, Metal-clad base materials for printed wiring boards Part 103: Special materials used in connection with printed circuits Section 103.1: Specific

24、ation for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board. BS 4727-1:Group 11 (IEC 60194), Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group

25、 11: Printed circuits. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 123000:2001, System of quality assessment Generic specification Printed boards. BS 123200:2001, System of quality assessment Sectional specification Rigid double-sided printed boards with plat

26、ed-through holes. BS 123500-003:2001, System of quality assessment Capability detail specification Flexible printed boards with through-connections. BS 123600:2001, System of quality assessment Sectional specification Flex-rigid multilayer printed boards with through-connections. BS EN 60249-2-8 (IE

27、C 60249-2-8), Base material for printed circuits Specifications Part 2-8: Specification for flexible copper-clad polyester (PETP) film. BS EN 60249-2-11 (IEC 60249-2-11), Specifications Part 2-11: Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, f

28、or use in the fabrication of multilayer printed boards. BS EN 60249-2-12 (IEC 60249-2-12), Specifications Part 2-12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards. BS EN 60249-2-13 (IEC 60249-2-13), Base m

29、aterial for printed circuits Specifications Part 2-13: Flexible copper-clad polyimide film, general purpose grade. BS EN 60249-2-15 (IEC 60249-2-15), Specifications Part 2-15: Flexible copper-clad polyimide film, of defined flammability. BS EN ISO 1463:1982, Metallic and oxide coatings Measurement t

30、hickness Microscopical method. BS EN ISO 3543:1981, Metallic and non-metallic coatings Measurement thickness Beta backscatter method. ANSI/IPC A-600F, Acceptability of printed boards.BS 123600-003:2001 2 BSI 17 December 2001 3 Terms and definitions For the purposes of this British Standard the terms

31、 and definitions given in BS 4727-1:Group 11, BS 123000 and BS 123600 together with the following apply. 3.1 referee method test method, where a choice of methods is given, to be used in the case of disputed test data arising from the two methods 4 Capability qualifying component 4.1 General Test bo

32、ards to be used as capability qualifying components for basic capability shall: a) be made from a combination of the materials specified in 4.2. The construction shall be as given in BS 123600:2001, 9.4; b) bear the composite test pattern specified in BS 123600:2001, 9.3 (or equivalent composite tes

33、t pattern), for basic and other metallic finishes. Composite test patterns as specified in BS 123200:2001, 8.2 (or equivalent composite test pattern) shall be used to demonstrate organic surface finishes and external bonded heat sinks; c) have one of the surface finishes specified by groups 11, 12,

34、13, 14, 15, 16 or 18 in 4.3. Test boards to be used as modified capability qualifying components for the demonstration of additional capability shall be as specified in clause 7. 4.2 Base materials For the demonstration of basic capability, the base materials specified in Table 1 shall be used and s

35、hall conform to the performance requirements specified in Table 4, Table 5, Table 6 and Table 7. For the demonstration of additional capability, if base materials other than those specified in Table 1 are used, they shall be detailed in the manufacturers capability manual. Base materials used for th

36、e demonstration of additional capability shall conform to the performance requirements specified in Table 4, Table 5, Table 6 and Table 7 unless they have inherent electrical or physical characteristics that prevent the performance requirements from being met, in which case they shall conform to the

37、 criteria detailed in the relevant base material specification.BS 123600-003:2001 BSI 17 December 2001 3 Table 1 Base materials 4.3 Surface finishes 4.3.1 Metallic finishes 4.3.1.1 General Metallic finishes shall be as specified in Table 2. Table 2 Metallic finishes The demonstration of metallic gro

38、up finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16 or 18. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separately. Material group

39、designation Material specified in Base material type Grade Base material thickness range Copper thickness m A BS EN 60249-2-11 Epoxide woven glass General purpose 0.05 mm to 0.8 mm 18, 35, 70, 105 BS EN 60249-2-12 Epoxide woven glass Defined flammability 0.05 mm BS 4584-103.1 Prepreg General purpose

40、 0.05 mm Not applicable BS 4584-103.1 Prepreg Defined flammability B BS EN 60249-2-8 Polyester (PETP) film General purpose 12.5 m to 125 m 18, 35, 70 BS EN 60249-2-13 Polyimide film General purpose 12.5 m to 125 m BS EN 60249-2-15 Polyimide film Defined flammability 12.5 m to 125 m Finish group desi

41、gnation Surface finish Abbreviation Revalidation period a 11 Bare copper Cu 1 month 12 Copper with solderable organic protective coating Cu (opc) 6 months 13 Copper with oxide Cu (CuO) Not applicable 14 Tin, TinLead Sn, SnPb 12 months 15 TinLead (fused) SnPb (f) 12 months 16 TinLead (dipped and leve

42、lled) SnPb (dl) 18 months 17 Not assigned 18 Immersion gold over electroless nickel AuNi (smt) 3 months 19 Not assigned 20 Not assigned 21 Specimen K b5 m, gold-plated on copper; all other specimens using finish group 11 to 18 c 5 AuCu 22 Specimen K b0.7 m, gold-plated on nickel; all other specimens

43、 using finish group 11 to 18 c 0.7 AuNi 23 Specimen K b2.5 m, gold-plated on copper; all other specimens using finish group 11 to 18 c 2.5 AuCu 24 Specimen K b2.5 m, gold-plated on nickel; all other specimens using finish group 11 to 18 c 2.5 AuNi a See BS 123000:2001, 4.4. b The specimens are defin

44、ed in BS 123600:2001, Figure 1 to Figure 16. c See clause 5.BS 123600-003:2001 4 BSI 17 December 2001 4.3.1.2 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16 or 18 to solder after extended or adverse storage conditions shall demonstrated using accelerated ageing. This test sha

45、ll be carried out on those finishes where accelerated ageing is claimed. NOTE Each finish that conforms to the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the qualified product

46、list. 4.3.2 Organic finishesOrganic finishes, where claimed, shall be as specified in Table 3. Table 3 Organic finishes The demonstration of organic finish groups a, b, c, d, e, f or g shall be over a finish from groups 11, 12, 13, 14, 15, 16 or 18. All claimed types of solder resist shall be tested

47、 separately. 5 Range of capability approval Capability approval granted on the testing of one variant shall be deemed to be valid within the limits specified in BS 123000:2001, 5.5 for: a) metal-clad base materials within one group designation; b) all base material thicknesses and all foil thickness

48、es of the material in accordance with 4.2. NOTE In some cases, a demonstration of one metallic surface finish may also be taken as being representative of others, as listed below: 1) finish group 11 covers finish group 11 only; 2) finish group 12 covers finish group 11 and 12; 3) finish group 13 cov

49、ers finish group 11 and 13; 4) finish group 14 covers finish group 11 and 14; 5) finish group 15 covers finish group 11 and 15; 6) finish group 16 covers finish group 11 and 16; 7) finish group 18 covers finish group 18 only; 8) finish group 21 covers finish group 21 only; 9) finish group 22 covers finish group 22 and 24; 10) finish group 23 covers finish group 21 and 23; 11) finish group 24 covers finish group 24 only. Finish gr

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