BS CECC 123500-003-1994 Specification for harmonized system of quality assessment for electronic components - Capability detail specification flexible printed boards with through-c.pdf

1、BRITISH STANDARD BS CECC 123500-003: 1994 Incorporating Amendment No.1 Specification for Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boardswith through-connectionsBSCECC123500-003:1994 This British Standard, having been prepare

2、d under the directionof the Electronic Components Standards Policy Committee, was published underthe authorityofthe Standards Boardand comesintoeffect on 15 February1994 BSI09-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment93/206143

3、 DC ISBN 0 580 22732 4 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon which the following bodies were represented: British Telecommunications p

4、lc EEA (the Association of Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation GAMBICA (BEAMA Ltd.) Institute of Metal Finishing Ministry of Defence National Supervising Inspectorat

5、e Printed Circuit Interconnection Federation Surface Mount and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date Comments 9208 December 1996 Indicated by a sideline in the marginBSCECC123500-003:1994 BSI 09-1999 i Contents Page Committees responsible Inside fr

6、ont cover Foreword ii 1 General 1 2 Capability qualifying component (CQC) 1 3 Capability approval 3 4 Capability test programme 3 5 Traceability 4 Appendix A 21 Appendix B 23 Appendix C 24 Appendix D 25 Appendix E Edge connector imperfections 26 Appendix F Adhesion of plating: tape method 27 Appendi

7、x G Porosity of platings method of test 28 Appendix H Solvent resistance of organic coatings 29 Appendix J Solder resistance of organic coatings 29 Figure 1a Composite test pattern for flexible printed boards with through connections 21 Figure 1b Detailed dimensions of specimens shown in Figure 1a 2

8、2 Figure 2 Test pattern for marking inks 23 Figure 3 Test pattern for solder mask or coverlayer 24 Figure 4a Assembly of test pattern for rigidizers or stiffeners 25 Figure 4b Component parts of test pattern for rigidizers or stiffeners 26 Table I Capability approval test schedule 5 Table IIa Additi

9、onal metallic conductor finishes 10 Table IIb Additional contact finishes 14 Table III Permanent organic finishes 15 Table IV Bonded stiffeners and rigidizers 18 List of references Inside back coverBSCECC123500-003:1994 ii BSI 09-1999 Foreword This British Standard has been prepared under the direct

10、ion of the Electronic Components Standards Policy Committee. It is a capability detail specification (Cap DS) within the BS CECC system and should be read in conjunction with BSEN123500. It has been produced to reflect the capability level established in the UnitedKingdom for the supply of printed b

11、oards to the defence, computer, communications and similar industries over many years. It is generally equivalent to that defined by BS9000 General requirements for a system for electronic components of assessed quality and, in particular, by BS9761 Sectional specification for capability approval of

12、 manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes. The capability level defined is enhanced compared to that described by BSEN123500-800. In particular capability has been extended to include the following: a) more surface finishes, now split into

13、 two groups and referred to the connector area and the remainder of the board respectively; b) more metallic finishes; c) organic finishes used as solder resist; d) marking inks; e) bonded heatsinks; f) accelerated ageing; g) additional capability in the definition of minimum conductors and spacing

14、widths; h) traceability. There is no British Standard equivalent to CECC00010:1980 which comprises a list of the tests in IEC326-2 and its supplement IEC326-2A. A related BritishStandard to IEC326-2 and its supplements is BS6221-2 and its amendments. Cross-references International Standard Correspon

15、ding British Standard EN123000:1991 BS EN123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards (Identical) EN123500:1992 BS EN123500:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexibl

16、e printed boards with through connections (Identical) IEC68 BS2011 Environmental testing (Most Parts are identical) IEC249 BS4584 Metal-clad base materials for printed wiring boards (Most Parts are identical) ISO1463:1982 BS EN ISO1463:1995 Metallic and oxide coatings. Measurement of coating thickne

17、ss. Microscopical method (Identical) ISO3543:1981 BS EN ISO3543:1995 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method (Identical)BSCECC123500-003:1994 BSI 09-1999 iii The Technical Committee has reviewed the provisions of ISO3542:1982, to which reference is made

18、in the text, and has decided that they are acceptable for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard doe

19、s not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi to iv, pages1to30, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This w

20、ill be indicated in the amendment table on the inside front cover.iv blankBSCECC123500-003:1994 BSI 09-1999 1 1 General 1.1 Scope This Capability Detail Specification is based on BS EN123500. It relates to double-sided flexible printed boards with through connections made with materials and surface

21、finishes as specified in2. 1.2 Object To specify the Capability Qualifying Component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability. 2 Capability Qualifying Component (CQC) Test b

22、oards to be used as CQCs for basic capability shall be made of one of the copper-clad base materials specified in2.1 of this Cap DS, with a nominal base film thickness of75 4m Polyester film or504m Polyimide film, clad with35 4m copper foil on both sides. bear the composite test pattern (CTP) specif

23、ied in Appendix A of this document; have one of the surface finishes specified by groups11,12,13,14,15,16,17 or18 in2.2 of this Capability Detail Specification. Test boards to be used as CQCs for additional capability shall be modified to demonstrate the claimed capability see 3.5.3 of BS EN123000.

24、2.1 Materials Material group designations A and B cover the base materials for flexible circuits; C and D cover materials for film stiffeners; E and F cover rigid board materials used for the fabrication of rigidizers. Material group designation Specification Material (seefootnote) Material thicknes

25、s range 4m Cu thickness 4m IEC Type Grade A 249-2-8 Polyester film General purpose 12.5.125 18, 35,70 B 249-2-13 249-2-15 Polyimide film Polyimide film General purpose Defined flammability (vertical) 12.5.125 18, 35,70 C 249-2-8 Polyester film General purpose 12.5.125 0,18,35,70 D 249-2-13 249-2-15

26、Polyimide film Polyimide film General purpose Defined flammability (vertical) 12.5.125 0,18,35,70 E 249-2-1 249-2-2 249-2-6 249-2-7 249-2-14 249-2-3 Phenolic paper Phenolic paper Phenolic paper Phenolic paper Phenolic paper Epoxide paper High electrical Economic Defined flammability (horizontal) Def

27、ined flammability (vertical) Economic, Defined flammability (vertical) Defined flammability (vertical) 200.6,400 0,18,35,70 F 249-2-4 249-2-5 Epoxide woven glass Epoxide woven glass General purpose Defined flammability (vertical) 200.6,400 0,18,35,70BSCECC123500-003:1994 2 BSI 09-1999 2.2 Surface fi

28、nishes 2.2.1 Metallic finishes The demonstration of metallic finish group21,22,23 or24, if claimed, shall be combined with a finish from group11,12,13,15,16 or17. 2.2.1.1 Accelerated ageing The ability of finishes from group11,12,13,14,15,16,17 or18 to solder after extended or adverse storage condit

29、ions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the accelerated ageing test is highlighted by the inclusion of all asterisk (*) adjacent to that finish in the m

30、anufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish group a, b, c, d, or e shall be over one finish from group11,12,13, or one fromgroup 14,15,16,17 or18. All claimed types of solder mask/coverlayer and marking ink shall be tested s

31、eparately. Film coverlayers having different adhesive types shall be tested separately. 2.3 Variant designation The combination of any material group designated in2.1 and any of the surface finishes as designated in2.2 constitutes a variant. The variant is designated by the combination of material a

32、nd finish group designations e.g.A12(b) or A12/21(c). Finish group designation Surface finish Abbreviation for QPL 11 Bare copper Cu 12 Copper with temporary protective coating Cu(tpc) 13 Copper with oxide Cu(CuO) 14 Tin, tin-lead (as plated) Sn, SnPb 15 Tin-lead (fused) SnPb(f) 16 Tin-lead (dipped

33、and levelled) SnPb(dl) 17 Tin-lead (roller coated) SnPb(rt) 18 Immersion gold over electroless nickel AuNi (Smt) 21 Specimen K54mmin. gold plated on copper, remainder using finish group11 17 (see below) 5 Au/Cu, Cu, Sn, SnPb 22 Specimen K0.74mmin. gold plated on nickel, remainder using finish group1

34、1 17 (see below) 0.7 Au/Ni Cu, Sn, SnPb 23 Specimen K2.54mmin. gold plated on copper, remainder using finish group11 17 (see below) 2.5 Au/Cu Cu, Sn, SnPb 24 Specimen K2.54mmin. gold plated on nickel, remainder using finish group11 17 (see below) 2.5 Au/Ni Cu, Sn, SnPb Finish group designation Organ

35、ic finish Abbreviation for QPL a Adhesive-coated film coverlayer AFC b Dry film solder mask DSM c Wet resist solder mask/coverlayer WRC d Liquid photopolymer solder mask/coverlayer WPC e Marking inks MIBSCECC123500-003:1994 BSI 09-1999 3 3 Capability approval 3.1 Range of capability approval Capabil

36、ity approval granted on the testing of one variant is valid within the limits specified in 3.7 of BSEN123000 for metal-clad base material within one group designation, all base material thicknesses and all foil thicknesses in accordance with2.1 as follows: approval for material group A covers materi

37、al group A only; approval for material group B covers material groups A and B. all metallic surface finishes within one surface finish group as quoted in2.2.1, that is: finish group11 covers finish group11 only finish group12 covers finish group11 and12 finish group13 covers finish group11 and13 fin

38、ish group13 covers finish group11 and14 finish group15 covers finish group11 and15 finish group16 covers finish group11 and16 finish group17 covers finish group11 and17 finish group18 covers finish group18 only finish group21 covers finish group21 only finish group22 cover finish group22 and24 finis

39、h group23 covers finish group21 and23 finish group24 covers finish group24 only Each organic finish in2.2.2 over a finish from group11,12 or13 covers11,12 or13 only. Each organic finish in2.2.2 over a finish from group14,15,16 or17 covers11,12 or13 in addition. 3.2 QPL information The QPL informatio

40、n shall be given in accordance with 3.4 of BS EN123000 and shall contain the following details: 4 Capability test programme Each separate process shall be assessed within the test programme. 4.1 Capability demonstration Capability shall be demonstrated by the manufacturer using9 composite test patte

41、rns (CTPs) of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in2.2.1, shall be demonstrated by the manufacture of3 CTPs which include sufficient extra specimen

42、s A and H to meet the requirements of Table II. Testing shall be in accordance with Table II. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of metallic surface finishes using materials from group A or group B apply to that group only. reference

43、 to the BS EN Generic Specification :123000 reference to the BS EN Sectional Specification :123500 reference to this BS CECC Capability Detail Specification :123500-003 materials for which approval is granted as given in2.1 surface finishes for which approval is granted as given in2.2 any additional

44、 capability, 3.5.3 of BS EN123000 refers.BSCECC123500-003:1994 4 BSI 09-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in2.2.2, shall be demonstrated by the manufacture of3 CTPs using the pattern in Appendix B for marking inks and Appendix C for coverlayers/so

45、lder mask. Testing shall be in accordance with Table III. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of organic surface finishes shall be made on each material group claimed. 4.1.3 Bonded stiffeners and rigidizers Material for stiffeners sha

46、ll be selected from material group C or D, as appropriate for base materials groupA or B. Rigidizer materials shall be selected from material group E and F. Each combination of stiffener and adhesive system and of rigidizer and adhesive system shall be demonstrated by the manufacture of3 CTPs using

47、the pattern specified in Appendix D. Testing shall be in accordance with Table IV 5 Traceability Traceability of all test specimens to the original production panel shall be maintained. The method used to identify individual test specimens shall not affect the test results.BSCECC123500-003:1994 BSI

48、09-1999 5 Table I Capability approval test schedule Characteristics Test No. CECC00010 Specimen of Composite Test Pattern Number of specimens Test Conditions Requirements/Material Remarks Required Failures Permitted IEC249-2- 8 (Polyester) 13 (Polyimide) 15 (Polyimide) GENERAL EXAMINATION (before su

49、bdivision into specimens) Visual inspection Conformity and identification Appearance and workmanship Plated-through holes Board edges Eyelets Bonding conductor to substrate Conductor defects 1 1a 1a 1a 1a 1a 1b Complete CQC Complete CQC Complete CQC Complete CQC Complete CQC Complete CQC Complete CQC All CQCs All CQCs All CQCs All CQCs All CQCs All CQCs All CQCs 0 0 0 0 0 0 0 Pattern, material and finishes shall comply with this Capability Detail Specification. Any identification for traceability purposes shal