1、BRITISH STANDARD BS CECC 200025:1998 Harmonized system of quality assessment for electronic components Process Assessment Schedule: Printed board assembly facilities ICS 31.180BSCECC200025:1998 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was p
2、ublished underthe authority of the Standards Board and comes intoeffect on 15 August 1998 BSI 05-1999 ISBN 0 580 30192 3 National foreword This British Standard is the English language version of CECC200025:1998 published by the European Electronic Components Committee (CECC) of the European Committ
3、ee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee
4、any enquiries on the interpretation, or proposals for change, and keep the UKinterests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references
5、The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue.
6、A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises
7、a front cover, an inside front cover, pages i and ii, theCECC title page, pages 2 to 30 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since pub
8、lication Amd. No. Date CommentsBSCECC 200025:1998 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of CECC 200 025 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM CECC 200 025 May 1998 Process Assessment Schedule: Printed board assembly facilitiesUp-to-date
9、 lists and bibliographical references of other Process Assessment Schedules may be obtained on application to the Central Secretariat or to any CENELEC member. CENELEC members are the national electrotechnical committees of Austria, Belgium, CzechRepublic, Denmark, Finland, France, Germany, Greece,
10、Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue
11、 de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref. No. CECC 200 025:1998 ECECC 200025:1998 BSI 05-1999 2 Foreword This Process Assessment Schedule was prepared by: Joint BSI EPL91/EPL52 Working Party, (Now
12、 EPL 501) UK on behalf of Technical Committee CENELEC TC/CECC SC 91, Surfacemount technology. It is based, wherever possible, on publications of the International Electrotechnical Commission (IEC). Contents Page Foreword 2 Introduction 3 1 General requirements 3 1.1 Scope 3 1.2 Definitions and abbre
13、viations 3 1.3 Related documents 3 1.4 Units, symbols and terminology 4 1.5 Quality system 4 1.6 Rework and repair of printed board assemblies 4 2 Quality requirements of the process sequence 5 2.1 Process description 5 2.2 Quality factors 6 2.3 Process specifications 9 2.4 Demonstration, verificati
14、on and validation programmes 9 2.5 Maintenance programmes 9 2.6 Electrical, mechanical and environmental test methods 9 2.7 Identification and traceability 10 3 Specialist Assembly Facility documentation requirements 10 3.1 Process Manual 10 3.2 Process Approval reports 10 3.3 Abstract of descriptio
15、n of Process Approval 10 4 Audits 11 4.1 General 11 4.2 Audit preparation plans 11 4.3 Audit checklists 11 4.4 Internal audits 11 4.5 External audits 11 5 Corrective actions and failure analysis 12 5.1 Corrective actions 12 5.2 Failure analysis 12 Page 6 Interface between Assembly Facility and Custo
16、mer 12 6.1 General 12 6.2 Customer enquiries, orders and contracts 13 6.3 Guidance to Customer Document (GCD) 13 6.4 Customer Detail Specifications 14 6.5 Post-supply liaison 16 7 Training 16 7.1 General 16 7.2 Training procedures 16 8 Notification of modifications to capability 16 Annex A Definitio
17、ns 17 Annex B Form and content of process specifications 18 Annex C Form and content of Process Manuals 19 Annex D Format of first page of Process Approval report 23 Annex E Example abstract of description of Process Approval 24 Annex F Audit check list (technical) 24 Annex G Abbreviations 30 Figure
18、 C.1 Example activity flowchart for printedboard assembly operations 7 Table 1 Example matrix of critical parameters 7CECC200025:1998 BSI 05-1999 3 Introduction The CECC 200 000 series of specifications applies to Process Approval of specialist contractors to the electronic components industry in ac
19、cordance with RP14-V. The mechanism of Process Approval is described in the Process Assessment Schedule (PAS) which defines how the principles given in RP14-V are applied to a given process activity or service. PASs are a concept in CECC specifying in greater detail the manufacturing process and the
20、 associated quality factors. They are aimed at reducing or eliminating the need for costly end-of-line testing. PASdocumentation also permits, where relevant, the application of Statistical Process Control techniques. This specification describes the requirements that a Printed Board Assembly Facili
21、ty must satisfy in order to obtain a CECC Specialist Contractor Approval for the manufacture of soldered printed board assemblies. The Process Approval concept places emphasis on understanding of the technology concerned and on process control. NOTEThe term “Assembly Facility” has been chosen to des
22、cribe the assembly activity of both contract equipment manufacturers (CEMs) and original equipment manufacturers (OEMs). 1 General requirements 1.1 Scope This PAS specifies the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the op
23、eration of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality. Whereas Technology Approval requires that constituent added electronic components shall be CECC-approved, under the Process Approval system, prin
24、ted boards and the components attached to them need not necessarily be CECC-approved items. The use of CECC-approved added components and printed boards is recommended and where all of them are so released, the assembly may itself be released by the Assembly Facility under a CECC Certificate of Conf
25、ormity. However, it is impractical to make the use of CECC-approved components mandatory and the wishes of the customer are of primary consideration. Where one or more non CECC-approved components are use in a specific assembly, the approved specialist Assembly Facility may release it as having been
26、 assembled using a CECC-approved process using the following wording: “This soldered printed board assembly is (or These soldered assemblies are) released by a CECC-approved facility as having been assembled and tested using processes, methods and controls meeting the requirements of CECC 200 025”.
27、1.2 Definitions and abbreviations Definitions relevant to the technology in addition to those given in CECC RP14-V are given in Annex A. Where an Assembly Facility uses terms other than those found in Annex A, such terms shall be defined in the Assembly Facilitys Process Manual. Abbreviations are gi
28、ven in Annex G. 1.3 Related documents 1.3.1 Requirements The Assembly Facility shall list all documents referenced in its Process Manual under the following, or similar, headings: documents referenced in the PAS other National or International Standards internal (i.e. Assembly Facilitys own) issued
29、documents The list shall give full titles and reference numbers in respect of documents to which reference is made in the Process Manual. Subsequently, it is sufficient to quote the reference number only (for example, “EN ISO9002”).CECC200025:1998 4 BSI 05-1999 1.3.2 Documents referenced in this PAS
30、 EN 100114-1, Rule of procedure 14 Quality Assessment Procedures Part1:CECC requirements for the approval of an organization (RP14-I). CECC 00 114-5, Rule of procedure 14: Quality assessment procedures Part5:Process approval of specialist contractors within the electronic components industry (RP14-V
31、). CECC 00 200, CECC Qualified Products List. CECC 00 401, Glossary of abbreviations, terms and definitions of the CECC System. EN ISO 9000, Quality management and quality assurance standards Guidelines for selection and use. EN ISO 9002, Quality systems Model for quality assurance in production, in
32、stallation and servicing. IEC 61189, Test methods for electrical materials, printed boards and other interconnection structures and assemblies. IEC 61191-1, Printed board assemblies Part1:Generic specification Soldered electrical and electronic assemblies using surface mount and related assembly tec
33、hnologies. IEC 61191-2, Part 2: Sectional specification Surface mount soldered assemblies. IEC 61191-3, Part 3: Sectional specification Through-hole mount soldered assemblies. IEC 61191-4, Part 4: Sectional specification Terminal soldered assembly. IEC 61760-1, Surface mounting technology Part1:Stan
34、dard method for the specification of surface mounting components (SMDs). CECC 200 003, Technical assessment schedule for printed board manufacturing facilities. CECC 200 012, Process assessment schedule for printed board design facilities. 1.4 Units, symbols and terminology Units, graphical symbols,
35、 letter symbols and terminology shall, whenever possible, be taken from the following documents: ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. IEC 60027, Letter symbols to be used in electrical technology. IEC 60050, International electrotechnical
36、vocabulary. IEC 60617, Graphical symbols for diagrams. ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. Any otherer units, symbols and terminology peculiar to the processes or services covered by this PAS shall be taken from the relevant IEC or ISO do
37、cuments, listed under “Related documents”. NOTEAll terms and concepts specifically relating to Process Approval are explained in RP14-V, in other parts of RP14 or in CECC00 401. Specialist assemblers who are unfamiliar with these documents are advised to study them. 1.5 Quality system The Assembly F
38、acility shall establish and maintain a quality system satisfying the requirements of ENISO9002, as invoked by RP14-I and RP14-V. Certain of these requirements receive particular attention and are developed further in the following subclauses of this PAS. In carrying out the appraisal of an Assembly
39、Facility, the ONS shall take account of any relevant certificate to ENISO9002 issued by an organisation declared competent to do so by the appropriate national authority. 1.6 Rework and repair of printed board assemblies 1.6.1 Rework Rework is defined in Annex A and may be carried out optionally to
40、correct process deviations that are within the allowable process limits or as a mandatory operation where it is necessary to rectify errors classed as “unacceptable”.CECC200025:1998 BSI 05-1999 5 Rework is carried out either by means not differing from the current manufacturing process (reprocessing
41、), or by the rework processes as permitted by the relevant Process Approval document(s)/Process Assessment Schedule(s) or by a combination of both; and using methods that do not cause unacceptable degradation of the reliability of the assembly. Where the purchaser of an assembly, or any other third
42、party, performs an electrical test or visual inspection that may not have been carried out by the original approved facility and non-conformance occurs, provided the assembly has not been released, it may be reworked by any facility approved to carry out the type of rework used, retested and inspect
43、ed to the original applicable standard and then be released either by the original approved assembly facility, or by any other facility approved under this specification. When the pre-release rework is carried out by an unapproved assembly facility or any other unapproved organisation, the assembly
44、shall not be claimed as having been manufactured and released under this specification or under any other CECC specification. 1.6.2 Repair Repair is defined in Annex A. Under the CECC system for release of approved components or of assemblies made using processes of assessed quality by an approved f
45、acility, repaired products may not be re-released as conforming with the original or any other CECC specification, even though they may be tested and found to meet the requirements. 2 Quality requirements of the process sequence 2.1 Process description The activities covered by this PAS are: The man
46、ufacture, electrical test and subsequent control of subcontracted electrical testing of soldered printed board assemblies (Class A), or, The manufacture and electrical test of soldered printed board assemblies (Class B). A Process Approval for this activity shall fall into one of the two categories
47、Class A or Class B) set out in2.1.1 and 2.1.2. The Assembly Facility shall declare the extent of the processes or services for which approval is sought, indicating how they fall within the scope of this PAS. Class A or Class B facilities may operate as independent assembly houses or as part of larg
48、er organisations, e.g., as OEMs. NOTEIt is a requirement that both Class A and Class B Assembly Facilities shall have the ability to perform either in-circuit or functional electrical tests, (preferably both), or physical (e.g., thermal, X-ray) means of assessing joint integrity. Because the quality
49、 of soldered joints cannot be properly assessed using visual inspection alone, shipment of completely untested assemblies is not an acceptable procedure for release of assembled circuits under this specification. The contract to supply printed board assemblies is between the customer and the Assembly Facility, not between the customer and the electrical test organisation. When the Assembly Facility designs in or supplies components or other parts, it shall be the responsibility of the customer to confirm the suitability thereof
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