BS CECC 23800-801-1998 Harmonized system of quality assessment for electronic components - Capability detail specification flexible multilayer printed boards with through connectio.pdf

1、BRITISH STANDARD BS CECC 23800-801:1998 Harmonized system of quality assessment for electronic components Capability detail specification: Flexible multilayer printed boards with through connections ICS 31.180BSCECC23800-801:1998 This British Standard, having been prepared under the directionof the

2、ElectrotechnicalSector Board, was published under the authorityof the Standards Boardand comes into effect on 15 June 1998 BSI 05-1999 ISBN 0 580 29889 2 National foreword This British Standard is the English language version of CECC23800-801:1998 published by the European Electronic Components Comm

3、ittee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). This standard should be read in conjunction with the most recent editions of BS EN123000 and BS EN123800. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly t

4、echnology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and

5、promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under t

6、he section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct appli

7、cation. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theCECC title page, pages 2 to 18 and a back cover. This standard has been updated (see copyright date)

8、 and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSCECC23800-801:1998 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of CECC 23800-801 3ii bl

9、ankDETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23800-801 February 1998 English version Capability Detail Specification: Flexible multilayer printed boards with through connections Spcification particulire dAgrment: Cartes imprimes multicouches souples avec connexions trans

10、versales Bauartspezifikation zur Anerkennung der Befhigung: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen This Capability Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical references of other detail specifications relating to EN123000:1991 and EN123800:19

11、96 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language an

12、d notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain,

13、Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in

14、 any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 800-801:1998 ECECC23800-801:1998 BSI 05-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC 52, Printed Boards (formerly designated CECC Working Group23). It was approved as C

15、ECC 23 800-801 on 1997-08-06. It should be read in conjunction with EN123000:1991 and EN123800:1996 and with the current regulations for the CECC System. Contents Page Foreword 2 1 General 3 1.1 Scope 3 1.2 Object 3 2 Capability Qualifying Component 3 2.1 Materials 3 2.2 Surface finishes 4 2.2.1 Met

16、allic finishes 4 2.2.1.1 Accelerated ageing 4 2.2.2 Organic finishes 4 2.3 Variant designation 5 3 Capability approval 5 3.1 Range of capability approval 5 3.2 QPL information 5 4 Capability test programme 5 4.1 Capability demonstration 5 4.1.1 Other metallic surface finishes 5 4.1.2 Organic surface

17、 finishes 5 5 Additional capability 6 6 Traceability 6 Annex A Edge connector imperfections 17 Annex B Circumferential defects in plated-through holes 18 Table I Capability approval test schedule 6 Table IIa Additional metallic conductor finishes 11 Table IIb Additional contact finishes 14 Table III

18、 Permanent organic finishes 15CECC23800-801:1998 BSI 05-1999 3 1 General 1.1 Scope This Capability Detail Specification (CapDS) is based upon EN123800. It relates to flexible multilayer printed boards with through connections, made with materials and surface finishes as specified in clause2. 1.2 Obj

19、ect To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic c

20、apability shall be made from a combination of the materials specified in 2.1 of this CapDS. The construction shall be as given in8.3 of EN123800. bear the composite test pattern (CTP) specified in8.3 of EN123800 (or equivalent CTP), for basic and other metallic finishes. CTPs as specified in8.2 of E

21、N123200 (or equivalent CTP) shall be used to demonstrate organic surface finishes and externally bonded heat sinks. have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, or 17 in2.2 of this CapDS. be fabricated using a copper thickness determined by the needs of the process an

22、d parameters to be demonstrated (e.g.conductor width and separation). The CQC copper thickness shall be detailed in the capability manual. Requirements for test boards to be used as modified CQCs for the demonstration of additional capability are detailed in clause5 of this CapDS. 2.1 Materials Mate

23、rial group designation Specification Base Material Base material thickness range Type Grade EN 60249-2-13 Polyimide film General purpose 12,5 125 4m A EN 60249-3-15 Polyimide film Defined flammability 12,5 125 4mCECC23800-801:1998 4 BSI 05-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demons

24、tration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups11, 12, 13, 14, 15, 16 or 17. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separ

25、ately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16 or 17 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has comp

26、lied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish groups a, b, c or d shall be over a finish from gro

27、ups 11, 12, 13, 14, 15, 16 or 17. All claimed types of solder resist shall be tested separately. Finish group Designation Surface finish Abbreviation for QPL Remarks 11 Bare copper Cu 12 Copper with solderable organic protective coating Cu(opc) 13 Copper with oxide Cu(CuO) 14 Tin, Tin-Lead Sn, SnPb

28、15 Tin-Lead (fused) SnPb(f) 16 Tin-Lead (dipped and levelled) SnPb(dI) selective and non-selective applications to be demonstrated separately where claimed 17 Immersion Gold over Electroless Nickel AuNi(smt) 18 not assigned 19 not assigned 20 not assigned 21 Specimen K 5 4m, gold plated on copper, r

29、emainder using finish group 11-17 (see below) 5AuCu 22 Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 0,7AuNi 23 Specimen K 2,5 4m, gold plated on copper, remainder using finish group 11-17 (see below) 2,5AuCu 24 Specimen K 2,5 4m, gold plated on nickel, rem

30、ainder using finish group 11-17 (see below) 2,5AuNi Finish group designation Organic finish Abbreviation for QPL a Adhesive coated film coverlayer AFC b Dry film solder mask DSM c Wet resist Solder mask WSM d Liquid photopolymer solder mask LSM e Marking ink MI f Conductive ink CICECC23800-801:1998

31、BSI 05-1999 5 2.3 Variant designation The combination of any material group designated in2.1 and any of the surface finishes designated in2.2 constitutes a variant. The variant is designated by the combination of both material and finish group designations, e.g.A12(b) or A12/21(c). 3 Capability appr

32、oval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in3.7 of EN123000 for metal clad base material within one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with

33、2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is 3.2 QPL information Information for the QPL (published as CECC 00 200) shall be given in accordance with 3.4 of EN123000, and shall contain the following details relative to

34、the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using 9 CTPs of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface fini

35、shes If claimed, other metallic surface finishes, as designated in2.2.1 shall be demonstrated by the manufacture and testing of 3 CTPs plus sufficient extra A and H specimens to meet the requirements of Table II. The maximum active board size for the finish shall be demonstrated. See also clause5. 4

36、1.2 Organic surface finishes Each claimed organic surface finish, as designated in2.2.2, shall be demonstrated by the manufacture and testing of 3CTPs using the pattern specified in Annex A (marking inks) or Annex B (solder masks) of CECC23 200-801. Testing shall be in accordance with Table III of

37、this CapDS. finish group 11 finish group 12 finish group 13 finish group 14 finish group 15 finish group 16 finish group 17 finish group 21 finish group 22 finish group 23 finish group 24 covers finish group 11 only covers finish group 11 and 12 covers finish group 11 and 13 covers finish group 11 a

38、nd 14 covers finish group 11 and 15 covers finish group 11 and 16 covers finish group 17 only covers finish group 21 only covers finish group 22 and 24 covers finish group 21 and 23 covers finish group 24 only reference to the CECC Generic Specification reference to the CECC Sectional Specification

39、reference to the CECC CapDS base material for which approval is granted the surface finishes for which approval is granted any additional capability EN 123000 EN 123800 CECC 23 800-801 as given in 2.1 of this CapDS as given in 2.2 of this CapDS 3.5.3 of EN 123000 refersCECC23800-801:1998 6 BSI 05-19

40、99 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Table I Capability approval test schedule Maximum active board size see 8.3 of EN 123000 Min

41、imum conductor width and spacing Specimen F of the CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this demonstration, but the thickness used shall be declared. Metallic conductor finishes

42、Manufacturers are permitted to demonstrate conductor finishes other than those detailed in2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability Manual. Characteristics Test No. IEC 60326-2 Specimen of Composite Test Pattern Requirements Rem

43、arks General examination Visual examination Conformity and identification 1 All CQCs Pattern, marking, identification, material and finishes shall comply with this CapDS. There shall be no apparent defects. Any identification for traceability purposes shall be verified. Appearance and Workmanship 1a

44、 All CQCs The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. The base materials, conductors, surface finishes shall be of uniform appearance and free from cracks, burns, pits, nodules and blisters. Metallic surface finishes s

45、hall be free from scratches which penetrate to an underlying surface. Plated-through holes All CQCs Plated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed10% of the total wall area. Th

46、e largest dimension shall not exceed 25% of the hole circumference in the horizontal plane, and25% of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the conductive pattern or internal layer ring. The interface

47、shall be considered to extend into the hole below the surface of the board a distance of 1,5 times the total copper thickness on the surface or to be two times the inner layer thickness at the level of contact ring. 1a There shall be no circumferential cracks of the copper, or circumferential separa

48、tion of the copper from the wall of the plated-through hole See Annex B Holes with plating voids shall not exceed5% of the total number of plated-through holesCECC23800-801:1998 BSI 05-1999 7 Table I Capability approval test schedule Characteristics Test No. IEC 60326-2 Specimen of Composite Test Pa

49、ttern Requirements Remarks Board edges All CQCs The edges of the board and internal cut-outs shall be clean cut without tears and nicks Eyelets All CQCs Eyelets shall be firmly secured. Plated eyelets shall not have exposed bare metal. Eyelets shall not have cracked flanges. There shall be no damage to conductors or substrate around the eyelet. Bonding Conductor to substrate All CQCs There shall be no separation of the conductors from the substrate by apparent blisters or wrinkles other than those permitted in the material specif