1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58ICS 31.200Integrated circuits EMC evaluation of CAN transceiversDRAFT FOR DEVELOPMENTDD IEC/TS 6222
2、8:2007DD IEC/TS 62228:2007This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 30 March 2007 BSI 2007ISBN 978 0 580 50359 7into an international Standard, to extend the life of the Technical Specification or to withdraw it. Comments should be
3、 sent to the Secretary of the responsible BSI Technical Committee at British Standards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on EPL/47 can be obtained on req
4、uest to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Amendments issued since publicationAmd. No. Date Commentsthat UK experience can be reported to the international organization responsible f
5、or its conversion to an international standard. A review of this publication will be initiated not later than 3 years after its publication by the international organization so that a decision can be taken on its status. Notification of the start of the review period will be made in an announcement
6、in the appropriate issue of Update Standards.According to the replies received by the end of the review period, the responsible BSI Committee will decide whether to support the conversion National forewordThis Draft for Development was published by BSI. It is the UK implementation of IEC/TS 62228:20
7、07.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publications and is of a provisional nature. It should be applied on this provisional basis, so that information and experience of its practical application can be obtained.Comme
8、nts arising from the use of this Draft for Development are requested so TECHNICAL SPECIFICATION IECTS 62228First edition2007-02Integrated circuits EMC evaluation of CAN transceivers Reference number IEC/TS 62228:2007(E) DD IEC/TS 62228:2007CONTENTS 1 2 3 4 4.1 4.2 4.3 5 Figure 1 Overview of a minimu
9、m configuration of a CAN system for emission and Figure 2 Example of the circuit diagram of the minimum network for a CAN high speed system for measuring emission and immunity in respect to RF disturbances and Figure 3 Example of the circuit diagram of the minimum network for a CAN low speed system
10、for measuring emission and immunity in respect to RF disturbances and Figure 4 Example of the circuit diagram of the minimum network for a CAN high Figure 5 Example of the circuit diagram of the minimum network for a CAN low speed Figure 7 Decoupling network for emission measurement at CAN_High and
11、CAN_Low Figure 8 Example of the circuit diagram of the minimum network for a CAN high Figure 9 Example of the circuit diagram of the minimum network for a CAN low speed Figure 13 Coupling network for DPI measurements on VBatFigure 14 RF monitoring network for DPI measurements of VBatFigure 17 Exampl
12、e of the circuit diagram of the minimum network for a CAN high Figure 18 Example of the circuit diagram of the minimum network for a CAN low Scope.4 Normative references .4 Terms and definitions .5 Measurements and tests.5 General .5 RF and transient tests .6 ESD 33 Test report37 Annex A (informativ
13、e) Test circuit boards.38 Annex B (informative) Documentation of test results 40 Bibliography42 immunity tests against transient and RF disturbances.7 transients8 transients9 speed system for measuring the emission of RF disturbances 13 system for measuring the emission of RF disturbances.14 Figure
14、6 Test set-up for measurement of RF disturbances on the bus lines16 in the frequency domain16 speed system for testing the RF immunity.19 system for testing the RF immunity .20 Figure 10 Test set-up for DPI measurements .22 Figure 11 Coupling network for DPI measurements on bus lines 23 Figure 12 RF
15、 monitoring network for DPI measurements of bus lines.23 23 .24 Figure 15 Coupling network for DPI measurements on wake-up.24 Figure 16 RF monitoring network for DPI measurements of wake-up24 speed system for testing the transient immunity27 speed system for testing the transient immunity28 2 DD IEC
16、/TS 62228:2007Figure 20 Coupling network for direct capacitive impulse coupling on CAN_High and Figure 21 Coupling network for direct capacitive impulse coupling on VBatFigure 23 Circuit diagram of the test set-up for ESD measurements at CAN high Figure 24 Circuit diagram of the test set-up for ESD
17、measurements at CAN low Figure 26 Coupling network for ESD measurements on bus lines, VBatTable 9 Settings of the measurement device for measurement of emission in the 3 Figure 19 Test set-up for direct capacitive impulse coupling 30 CAN_Low .31 31 Figure 22 Coupling network for direct capacitive im
18、pulse coupling on wake-up 31 speed transceivers34 speed transceivers34 Figure 25 Test set-up for ESD measurements35 and wake-up 36 Figure A.1 Example of IC interconnections of CAN high and CAN low38 Figure B.1 Example of presentation of emission test results in the frequency domain 40 Figure B.2 Exa
19、mple of presentation of DPI test results.41 Table 1 Overview of requested measurements and tests5 Table 2 General test conditions6 Table 3 Communication test signal TX1 .11 Table 4 Communication test signal TX2 .11 Table 5 Basic scheme for immunity evaluation.12 Table 6 Boundary values for normal IC
20、 operation.12 Table 7 Overview of decoupling ports for emission.15 Table 8 Parameters for emission test in the frequency domain.17 frequency domain .18 Table 10 Overview of coupling ports 21 Table 11 Specifications for DPI measurements 25 Table 12 Required DPI measurements for function test26 Table
21、13 Combination of resistors for coupling on DPI measurements .26 Table 14 Overview of coupling ports 29 Table 15 Parameters for functional test32 Table 16 Required impulse tests for functioning.32 Table 17 Parameters for impulse test (damage test) 33 Table 18 Required impulse tests for damage .33 Ta
22、ble 19 Summery of ESD coupling points 35 Table 20 Specifications for ESD measurements.37 Table A.1 Parameter ESD test circuit board .39 DD IEC/TS 62228:2007INTEGRATED CIRCUITS EMC EVALUATION OF CAN TRANSCEIVERS 1 Scope This document specifies test and measurement methods, test conditions, test setup
23、s, test procedures, failure criteria and test signals for the EMC evaluation of CAN transceivers concerning: the immunity against RF common mode disturbances on the signal lines, the emissions caused by non-symmetrical signals regarding the time and frequency domain, the immunity against transients
24、(function and damage), and the immunity against electrostatic discharges ESD (damage). All measurements and functional tests except ESD are performed in a small (three transceiver) network. For ESD damage tests a single transceiver configuration on a special test board is used. External protection c
25、ircuits are not applied during the tests in order to get results for the transceiver IC only. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edi
26、tion of the referenced document (including any amendments) applies. IEC 61967 (all parts), Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz IEC 61967-4, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emiss
27、ions 1 /150 direct coupling method IEC 62132 (all parts), Integrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz IEC 62132-1, Integrated circuits Measurement of electromagnetic immunity, 150 kHz to 1 GHz Part 1: General conditions and definitions IEC 62132-4, Integrated circui
28、ts Measurement of electromagnetic immunity 150 kHz to 1 GHz Part 4: Direct RF Power Injection Method IEC 61000-4-2:1995, Electromagnetic compatibility Part 4: Testing and measurement techniques Section 2: Electrostatic discharge immunity test1)Amendment 1 (1998) Amendment 2 (2000) ISO 7637-2: 2004,
29、Road vehicles Electrical disturbances from conduction and coupling Part 2: Electrical transient conduction along supply lines only 1) A consolidated edition 1.2 exists, including IEC 61000-4-2:1995 and its Amendment 1 (1998) and Amendment 2 (2000) 4 DD IEC/TS 62228:20073 Terms and definitions For th
30、e purposes of this document, the terms and definitions given in IEC 61967 and IEC 62132 apply. 4 Measurements and tests 4.1 General For evaluation of the EMC characteristic of CAN transceivers different test conditions and test set-ups are used: configuration of three powered transceivers in a CAN n
31、etwork for: evaluation of narrowband emission at the bus lines and evaluation of RF and transient immunity at the bus lines, voltage supply line VBatand the wake-up line; configuration of single unpowered transceiver for testing the damage immunity against ESD of the pins for bus lines, VBatand wake
32、-up on a test board with functional required external components. An overview of the requested measurements and tests is given in Table 1. Table 1 Overview of requested measurements and tests Transceiver state Required test Test method Evaluation Transceiver mode RF emission 150 direct coupling (IEC
33、 61967-4) Spectrum and asymmetry Normal Normal Stand by RF immunity DPI (IEC 62132-4) Function Sleep Normal Stand by Function Sleep Active (powered) Transient immunity Supply lines- direct galvanic coupling I/O lines- capacitive coupling Test pulse wave forms (ISO 7637-2) Damage Normal Passive (unpo
34、wered) ESD Contact discharge (IEC 61000-4-2) Damage Normal In order to reduce the effort for the characterization and to increase the compatibility of the results of different transceiver types, the number of test methods is defined to a necessary minimum. The 150 direct coupling, DPI and direct gal
35、vanic and capacitive coupling methods are chosen for the evaluation of the EMC characteristic of active transceivers in a network configuration with three CAN nodes. While using a conductive decoupling and coupling, these three test methods are based on the same approach. Thus it is possible to use
36、the same PCB for all required active/functional tests and measurements. These tests can be performed on the same test board in a common test configuration and set-up. To get more reproducible test results, all measurement and tests should be done with soldered transceivers. The described test condit
37、ions, configurations and test procedures are based on present stand-alone CAN transceivers. In case of ASICs with an integrated CAN transceiver, the test conditions cannot be defined completely for any type of IC. If it is possible, the test conditions 5 DD IEC/TS 62228:2007of stand-alone CAN transc
38、eivers should be used. The configuration of the physical layer of the CAN bus should be the same. 4.2 RF and transient tests 4.2.1 General test conditions and configurations 4.2.1.1 Test conditions The general test conditions are given in Table 2: Table 2 General test conditions Parameter Value Volt
39、age supply VBat(14 0,2) V Voltage supply VCC(5 0,1) V (default) Voltage supply VIO(5 0,1) V (default) Test temperature (23 5) C The ambient noise floor for emission measurements shall be below the expected signal noise and shall be documented in the test report. 4.2.1.2 Test configuration For the tr
40、ansceiver EMC analysis, a minimum network of three bus nodes has to be set up according to Figure 1. 6 DD IEC/TS 62228:2007TransceivernetworkDecouplingNode 1CAN_HCAN_LVCC GNDERRINHTransceiverNode 2CAN_HCAN_LVCC GNDTransceiverNode 3CAN_HCAN_LVCC GNDCoupling/networksCAN_HCAN_LHF1ERR1INH1VCCGNDVCCGNDVC
41、CGNDVBatmode 1modemodemodeVBatVBatmode 2mode 3VBatVBatVBatVBatHF21) only for CAN high speedFilterCentralHF3Wake-upRX1RXIMP1IMP2IMP3TX TX1ERRINHERR2INH2RX2RXERRINHERR3INH3RX3RX1)terminationnetworkDecouplingnetworkDecouplingdecouplingEMI1Figure 1 Overview of a minimum configuration of a CAN system for
42、 emission and immunity tests against transient and RF disturbances An example of a test circuit diagram for filter and the transceiver network for CAN high speed systems is given in Figure 2 and for CAN low speed systems in Figure 3. IEC 206/07 7 DD IEC/TS 62228:2007R141KR161KR131KC11100nX11ERR1X12I
43、NH1X13RX1R12R11R171KX14TX1TX1GND2Vcc3RXD4/STB14CANH13CANL12SPLIT11VI/O5EN6INH7VBat10Wake9/ERR8A1CAN HS 14R760C12100nR15STB1VccEN1JP11 Node 1R241KR261KR231KC21100nX15ERR2X16INH2X17RX2R22R21TX1GND2Vcc3RXD4/STB14CANH13CANL12SPLIT11VI/O5EN6INH7VBat10Wake9/ERR8A2CAN HS 14C22100nR25STB2VccEN2JP21Node 2R34
44、1KR361KR331KC31100nX18ERR3X19INH3X20RX3R32R31TX1GND2Vcc3RXD4/STB14CANH13CANL12SPLIT11VI/O5EN6INH7VBat10Wake9/ERR8A3CAN HS 14C32100nR35STB3VccEN3JP31 Node 3L147 HL2e.g. 6-hole ferriteC42330 pC411 nX30VBatJP1D2C4322uFVBATL347 HL4e.g. 6-hole ferriteC45330 pC441 nX31VccC4622uFVccX32GNDFilterCoupling/ de
45、coupling networksCentralterminationVBATFigure 2 Example of the circuit diagram of the minimum network for a CAN high speed system for measuring emission and immunity in respect to RF disturbances and transients IEC 207/07 8 DD IEC/TS 62228:2007R141KR151KR131KC11100nX11ERR1X12RX1X13TX1R12R11R161KX14I
46、NH1C12100nR17STB1VccEN1JP11Node 1Node 2Node 3L147 HL2e.g. 6-hole ferriteC42330 pC411 nX30VBatJP1D2C4322uFVBATL347 HL4e.g. 6-hole ferriteC45330 pC441 nX31VccC4622uFVccX32GNDFilterCoupling/ decoupling networksVBATINH1TX2RX3ERR4Vbat14GND13CL12CH11STB5EN6Wake7Vcc10RTL9RTH8A1CAN LS TCR17560R18560R241KR25
47、1KR231KC21100nX15ERR2X16RX2X17INH2R22R21C22100nR26STB2VccEN2JP21INH1TX2RX3ERR4Vbat14GND13CL12CH11STB5EN6Wake7Vcc10RTL9RTH8A2CAN LS TCR27560R28560R341KR351KR331KC31100nX18ERR3X19RX3X20INH3R32R31C32100nR36STB3VccEN3JP31INH1TX2RX3ERR4Vbat14GND13CL12CH11STB5EN6Wake7Vcc10RTL9RTH8A3CAN LS TCR37560R38560Fi
48、gure 3 Example of the circuit diagram of the minimum network for a CAN low speed system for measuring emission and immunity in respect to RF disturbances and transients IEC 208/07 9 DD IEC/TS 62228:2007 CAN nodes: A CAN node consists of a transceiver, mandatory external components for functional set
49、tings and support and decoupling networks at monitored pins or inputs. Node 1 operates as a transmitter for a bit pattern, which simulates a CAN message to be received and monitored at the RX output ports of all nodes in the configured network. At all voltage supply ports (VBat, VCC) of the transceiver buffer, ceramic capacitors shall be u
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