BS EN 123200-1989 Harmonized system of quality assessment for electronic components Sectional specification Single and double sided printed boards with plated through holes《电子元器件质量.pdf

1、BRITISH STANDARD BS EN 123200:1992 Incorporating Amendment No. 1 BS CECC 23200:1989 renumbered Harmonized system of quality assessment for electronic components Sectional specification: Single and double sided printed boards with plated through holes The European Standard EN 123200:1992 has the stat

2、us of a British StandardBS EN123200:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards PolicyCommittee, was publishedunder the authorityofthe Board of BSIandcomes into effect on 29September1989 BSI 01-2000 The following BSI references relate to

3、 the work on this standard: Committee reference ECL/19 Draft for comment 86/31649 DC ISBN 0 580 17504 9 Committees responsible for this BritishStandard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19

4、 upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Instit

5、ute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspactorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendments issued since publication Amd. No. Date of issue Comments 7361 November 1992 Adopt

6、ion as a European standard: renumbering as BS EN 123200:1992 9251 September 1996 Indicated by a sideline in the marginBS EN123200:1992 BSI 01-2000 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN 123200 5 Publications referred to Inside back coverB

7、S EN123200:1992 ii BSI 01-2000 National foreword This British Standard has been prepared under the direction of the Electronics Components Standards Policy Committee. It is identical with CENELEC Electronics Components Committee (CECC)23200:1985 “Harmonized system of quality assessment for electroni

8、c components: Sectional specification: Single and double sided printed boards with plated through holes”. This standard is a harmonized specification within the CECC system and should be read in conjunction with BSCECC23000 In1992the CENELEC Electronic Components Committee (CECC) accepted CECC23200:

9、1985 as European Standard EN123200:1992. There is no British Standard equivalent to CECC00010 which comprises only a list of the tests in IEC326-2 and its supplement IEC326-2A. The Technical Committee has reviewed the provisions of IEC194, IEC321 and IEC326-3, to which reference is made in the text,

10、 and has decided that they are acceptable for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of its

11、elf confer immunity from legal obligations. Cross-references International Standard Corresponding British Standard IEC 68 BS 2011 Basic environmental testing procedures (Most Parts are identical) IEC 249 BS EN 60249 Base materials for printed circuits (Most parts are identical) IEC 326-2 BS 6221: Pr

12、inted wiring boards Part 2:1982 Methods of test (Technically equivalent) IEC 326-5 Part 5:1982 Method for specifying single and double sided printed wiring boards with plated through holes (Identical) CECC 23000 BS CECC 23000:1988 Harmonized system of quality assessment for electronic components: ge

13、neric specification: printed boards (Identical) Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theEN title page, pages2 to26, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorpora

14、ted. This will be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123200 May 1992 + A1 August 1995 ICS 31.180 Descriptors: Printed boards, single and double sided, plated-through holes, test specimens, capability test, quality conforman

15、ce inspection, test patterns English version Sectional Specification: Single and double sided printed boards with plated-through holes (includes amendment A1:1995) Spcification intermdiaire: Cartes imprimes simples et doubles faces avec trous mtalliss (inclut lamendement A1:1995) Rahmenspezifikation

16、: Leiterplattenmit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Lchern (enthlt nderungen A1:1995) This European Standard was approved by the CENELEC Electronic Components Committee (CECC) on12December1991. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulat

17、ions which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This

18、European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members

19、are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europe

20、n de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Ref. No. EN 123200:1992 + A1:1995 EEN123200:1992 BSI 01-2000 2 Foreword The CENELEC Electronic Components Committee

21、 (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the

22、 specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has be

23、en formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized SECTIONAL SPECIFICATIONS for SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES. It should be read in conjunction with the current regulations for

24、 the CECC System. Preface This Sectional Specification was prepared by CECC Working Group23: Printed Circuits. It is based on publications of the International Electrotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the documents indicated below and

25、 was ratified by the President of the CECC for printing as a CECC Specification. SECRETARIAT NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THIS SPECIFICATION, THE PRESIDENT OF THE CECC HAS RULED THAT IT BE PUBLISHED WITHOUT THE FULL EDITORIAL PROCEDURE BEING APPLIED. USERS OF THE SPECIFICATION ARE ASK

26、ED TO REPORT TO THE CECC GENERAL SECRETARIAT ANY ERRORS THEY FIND SO THAT AMENDING ACTION CAN BE INITIATED. The text is published initially in English and German. The French version will follow as soon as it has been prepared. Foreword to amendment A1 This amendment was prepared by CLC/TC CECC/WG23.

27、 The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A1to EN123200:1992 on1995-07-04. The following dates were fixed: Document Date of Voting Report on the Voting CECC(Secretariat) 1053/1053A CECC(Secretariat) 1548 November 1981 August 1984

28、 CECC(Secretariat) 1251 CECC(Secretariat) 1619 latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1996-07-01 latest date by which the national standards conflicting with the amendment have to be withdraw

29、n (dow) 1996-07-01EN123200:1992 BSI 01-2000 3 Contents Page Foreword 2 1 Introduction 5 1.1 Scope and object 5 1.2 Related documents 5 2 General 5 3 Test specimens 6 3.1 Capability approval 6 3.2 Quality conformance inspection 6 4 Relevant specification 6 5 Characteristics of printed boards 6 6 Capa

30、bility test programme 15 7 Quality conformance inspection 16 8 Test patterns 20 8.1 Application of test patterns and test boards 20 8.2 Composite test pattern (CTP) 20 8.3 Multiple arrangements of the CTP 21 Figure 1 Length of defect 19 Figure 2a Composite test pattern (obverse) 22 Figure 2b Composi

31、te test pattern (reserve) 23 Figure 2c Multiple arrangements 24 Figure 3 Examples of soldered holes 25 Table I Basic characteristics 7 Table II Additional characteristics 13 Table III 15 Table IV 174 blankEN123200:1992 BSI 01-2000 5 1 Introduction IEC326-5 is the IEC-Standard for single and double s

32、ided printed boards with plated-through holes. The following document comprises this IEC-Standard and in accordance with the generic specification CECC23000 the information additionally necessary for printed boards intended to be handled within the CENELEC system for Electronic Components of Assesse

33、d Quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to single and double sided printed boards with plated-through holes irrespective of their method of manufacture, when they are ready for mounting of the components. It defines the characteristics to be assessed

34、and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing procedures. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials f

35、or printed circuits. IEC 321, Guidance for the design and use of components intended for mounting on printed boards. IEC 326-2, Printed boards test methods. IEC 326-3, Design and use of printed boards. IEC 326-5, Specification for single and double sided printed boards with plated-through holes. CEC

36、C 00010, Printed boards test methods. CECC 23000, Generic Specification Printed boards of assessed quality. 2 General This Sectional Specification (SS) applies to single and double sided printed boards with plated-through holes and is intended as a basis for the preparation of Capability Detail Spec

37、ification (Cap DS) applying to specific materials, e.g.according to IEC249-2, and to be used for capability approval procedures. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national body or by a manufacturer (see also CECC00111).

38、Customer Detail Specification (CDS) for the custom built printed boards, according to5 of CECC23000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in CECC23000 and in CECC00107-III. Table I contains the basic characteris

39、tics that will normally be important for single and double sided printed boards with plated-through holes and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain single and double sided printed b

40、oards with plated-through holes and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from thisTable II. Where additional details for a test have to be specified in the

41、 relevant specification, this is indicated by an asterisk in the relevant column. These details shall then be specified in accordance with CECC00010 (IEC326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as capability qualifying component. Tabl

42、e IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence, the tests may be carried out in any sequence, unless otherwise specified.EN123200:1992 6 BSI 01-2000 3 Test specimens 3.1 Capability Approval 3.1.1 Basic Capability The tes

43、t shall be carried out on the composite test pattern given in8. 3.1.2 Additional Capability 3.5.3 of CECC23000 shall apply. For multiple arrangements see also8. 3.1.3 Maintenance of Capability Approval 3.8 of CECC23000 shall apply. 3.2 Quality conformance inspection Unless otherwise specified produc

44、tion boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specially designed test patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test patterncla

45、use8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “Relevant Specification” means a product specification for an actual printed board, i.e.a CDS as well as a Cap DS applied to a specific material and technique, as applicable. The relevan

46、t specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescriptions. Permissible deviations shall be stated where necessary, nominal val

47、ues without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance class

48、es etc., the selections given in IEC326-3 shall preferably be applied. In case of discrepancy between the CDS and any other pertinent specification (e.g.BS, GS, or SS), the CDS shall prevail. 5 Characteristics of printed boards Basic characteristics of single and double sided printed boards with pla

49、ted-through holes are given inTable I. Additional characteristics of single and double sided printed boards with plated-through holes are given inTable II.EN123200:1992 BSI 01-2000 7 Table I Basic characteristics Characteristics Test No. IEC Publication 326-2 Additional test details to be specified in the relevant specification Specimen of composite test pattern Requirements Remarks General examination Visual examination Conformity, identification 1 a Pattern, marking, identification and material finishes shall comply with the rele