BS EN 165000-1-1996 Film and hybrid integrated circuits Generic specification Capability approval procedure《薄膜集成电路和混合集成电路 通用规范 性能鉴定程序》.pdf

1、BRITISH STANDARD BS EN 165000-1:1996 Harmonized system of quality assessment for electronic components Film and hybrid integrated circuits Part 1: Generic specification Capability approval procedure The European Standard EN 165000-1:1996 has the status of a British Standard ICS 31.200BS EN165000-1:1

2、996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 October 1996 BSI 11-1998 The following BSI references relate to the work on this standard: Committee referenc

3、e EPL/47/1 Draft for comment 92/216398 DC ISBN 0 580 26183 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, upon which the following

4、bodies were represented: Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate (BSI Product Certification) Amendments issued since publication Amd. No. Date CommentsBS EN165000-1:1996 BSI 11-1998 i Contents Page Committees responsible Inside front cover Nationa

5、l foreword ii Foreword 2 Text of EN 165000-1 5 List of references Inside back coverBS EN165000-1:1996 ii BSI 11-1998 National foreword This British Standard has been prepared by Subcommittee EPL/47/1 and is the English language version of EN 165000-1:1996, Film and hybrid integrated circuits Part 1:

6、 Generic specification. Capability approval procedure published by the European Committee for Electrotechnical Standardization (CENELEC). Cross-references Publication referred to Corresponding British Standard BS EN 165000 Film and hybrid integrated circuits EN 165000-2:1996 BS EN 165000-2:1996 Inte

7、rnal visual inspection and special tests EN 165000-3:1996 BS EN 165000-3:1996 Self-audit checklist and report for film and hybrid integrated circuit manufacturers EN 165000-4:1996 BS EN 165000-4:1996 Customer information, product assessment level schedules and blank detail specification IEC 50 BS 47

8、27 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms EN 60068 Environmental testing EN 60068-1:1994 (IEC 68-1:1988) BS EN 60068-1:1995 General and guidance IEC 68-2 BS EN 60068-2 Test methods EN 60068-2-1:1993 (IEC 68-2-1:1990) BS EN 60068-2-1:1993 Tests

9、A. Cold EN 60068-2-2:1993 (IEC 68-2-2:1974) BS EN 60068-2-2:1993 Tests B. Dry heat BS 2011 Environmental testing Part 2.1 Tests HD 323.2.3 S2:1987 (IEC 68-2-3:1969) Part 2.1Ca:1977 Test Ca. Damp heat, steady state BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-6:1995 (IEC 68

10、-2-6:1995) BS EN 60068-2-6:1996 Test Fc. Vibration (sinusoidal) EN 60068-2-7:1993 (IEC 68-2-7:1983) BS EN 60068-2-7:1993 Test Ga and guidance. Acceleration, steady state BS 2011 Environmental testing Part 2.1 Tests HD 323.2.11 S1:1988 (IEC 68-2-11:1981) Part 2.1Ka:1982 Test Ka. Salt mist HD 323.2.14

11、 S2:1987 (IEC 68-2-14:1984) Part 2.1N:1985 Test N. Change of temperature BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-17:1994 (IEC 68-2-17:1994) BS EN 60068-2-17:1995 Test Q. Sealing BS 2011 Environmental testing Part 2.1 TestsBS EN165000-1:1996 BSI 11-1998 iii HD 323.2.20

12、 S3:1988 (IEC 68-2-20:1979) Part 2.1T:1981 Test T. Soldering HD 323.2.21 S3:1988 (IEC 68-2-21:1983) BS 2011:Part 2.1U:1984 Test U. Robustness of terminations and integral mounting devices BS EN 60068 Environmental testing BS EN 60068-2 Test methods EN 60068-2-27:1993 (IEC 68-2-27:1987) BS EN 60068-2

13、-27:1993 Environmental testing procedures. Tests. Test Ea and guidance. Shock BS 2011 Environmental testing Part 2.2 Guidance IEC 68-2-28:1990 Part 2.2C Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers; Part 4: Customer information, product assessment leve

14、l schedules and blank detail specification. Part 3 is primarily intended as a pro-forma for the manufacturer and is not considered essential for a customer in this form. Part 4 is considered an essential document for all users; in particular it includes a helpful introductory section which is aimed

15、at potential customers and seeks to explain the underlying philosophy upon which the whole standard is based. Contents Page Foreword 2 1 General 5 1.1 Scope 5 1.2 Normative references 5 1.3 Units, symbols and terminology 7 1.4 Standard and preferred values 9 1.5 Marking 9 2 Quality assessment proced

16、ures 9 2.1 General 9 2.1.1 Eligibility for capability approval 9 2.1.2 Primary stage of manufacture 9 2.1.3 Subcontracting 9 2.1.4 Control of procurement sources and incoming material 10 2.1.5 Validity of release for delivery 10 2.1.6 Rework 10 2.2 Procedures for capability approval 11 2.2.1 Applica

17、tion for capability approval 11 2.2.2 Granting of capability approval 11 2.2.3 Description of capability 11 2.2.4 Capability qualifying components 12 2.2.5 Demonstration and verification of capability 12 2.2.6 Procedures to be followed in the event of CQC failures 15 2.2.7 Abstract of description of

18、 capability 15 2.3 Procedures following the granting of capability approval 15 2.3.1 Maintenance of capability approval 15 2.3.2 Notification of changes likely to affectthevalidity of capability approval 15 2.4 Release for delivery 16 2.4.1 General 16 2.4.2 Quality conformance inspection requirement

19、s 16 2.4.3 Detail specification 17 2.4.3(1) General 17 2.4.3(2) Customer detail specification 17 2.4.3(3) Detail specification for standard catalogue circuits to be included in the Qualified Products List (QPL) 17 3 Test and measurement procedures 18 3.1 General 18 3.2 Standard conditions for testin

20、g 18 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1997-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1997-03-01EN165000-1:1996 BSI 11-1998 3 Page 3.3

21、 Visual inspections and package dimensions 20 3.4 Electrical measurement procedures 20 3.5 Environmental test procedures 21 Figure 1 Definition of axis for mechanical and other tests 19 Figure 2 Pulling force for bond strength test 43 Figure 3 Apparatus requirements for the added component bond stre

22、ngth destructive test 48 Table 1 Severities for damp heat, steady-state, Method 2 23 Table 2 Severities for damp heat, steady-state, Method 3 25 Table 3 Preferred conditions for shock 27 Table 4 Parameters for sealing test, Method 1 31 Table 5 “Preheat” times 34 Table 6 Minimum pulling force 424 bla

23、nkEN165000-1:1996 BSI 11-1998 5 1 General 1.1 Scope This specification prescribes the quality assessment procedures and methods of tests to be used in the assessment of film and hybrid integrated circuits intended for use in electronic equipment, under the capability approval procedure. It also appl

24、ies to part completed devices supplied to customers for subsequent processing. It should be read in conjunction with EN 165000-2, EN 165000-3 and EN 165000-4. 1.2 Normative references This European Standard incorporates by dated or undated reference, provisions from other publications. These normati

25、ve references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated referen

26、ces the latest edition of the publication referred to applies (including amendments). Publication Year Title EN/HD Year IEC 27 Letter symbols to be used in electrical technology IEC 50 International Electrotechnical Vocabulary IEC 68-1 1988 Environmental testing Part 1: General and guidance EN 60068

27、-1 1994 + Corrigendum + A1 1988 1992 IEC 68-2-1 A1 A2 1990 1993 1994 Part 2: Tests Tests A: Cold EN 60068-2-1 A1 A2 1993 1993 1994 IEC 68-2-2 + IEC 68-2-2A A1 A2 1974 1976 1993 1994 Tests B: Dry heat EN 60068-2-2 A1 A2 1993 1993 1994 IEC 68-2-3 + A1 1969 1984 Test Ca: Damp heat, steady state HD 323.

28、2.3 S2 1987 IEC 68-2-6 + Corrigendum 1995 1995 Test Fc and guidance: Vibration (sinusoidal) EN 60068-2-6 1995 IEC 68-2-7 + A1 1983 1986 Test Ga and guidance: Acceleration, steady state EN 60068-2-7 1993 IEC 68-2-11 1981 Test Ka: Salt mist HD 323.2.11 S1 1988 IEC 68-2-14 + A1 1984 1986 Test N: Change

29、 of temperature HD 323-2-14 S2 1987 IEC 68-2-17 1994 Test Q: Sealing EN 60068-2-17 1994 IEC 68-2-20 + A1 + A2 1979 1986 1987 Test T: Soldering HD 323.2.20S3 1988 IEC 68-2-21 1983 Test U: Robustness of terminations and integral mounting devices HD 323.2.21 S3 1988 + A1 + A2 + A3 1985 1991 1992 IEC 68

30、-2-27 1987 Test Ea and guidance: Shock EN 60068-2-27 1993EN165000-1:1996 6 BSI 11-1998 Publication Year Title EN/HD Year IEC 68-2-28 1990 Guidance for damp heat tests IEC 68-2-30 + A1 1990 1985 Test Db: Damp heat, cyclic HD 323.2.30 S3 1988 IEC 68-2-33 + A1 1971 1978 Guidance on change of temperatur

31、e tests HD 323.2.33 S1 1988 IEC 68-2-44 1979 Guidance on Test T: Soldering HD 323.2.44 S1 1988 IEC 68-2-45 1980 Test XA and guidance: Immersion in cleaning solvents EN 60068-2-45 1992 A1 1993 A1 1993 IEC 68-2-47 1982 Mounting of components, equipment and other articles for dynamic tests including sh

32、ock (Ea), bump (Eb), vibration (FC and FC), and steady-state acceleration (Ga) and guidance EN 60068-2-47 1993 IEC 134 1961 Rating systems for electronic tubes and valves and analogue semiconductor devices IEC 191 Mechanical standardization of semiconductor devices IEC 440 1973 Method of measurement

33、 for non-linearity in resistors IEC 617 Graphic symbols for diagrams IEC 695-2-2 1991 Fire hazard testing Part 2: Test methods Section 2: Needle-flame test EN 60695-2-2 + Corrigendum 1994 1994 IEC 747-1 a 1983 Semiconductor devices. Discrete devices Part1: General + A1 + A2 1991 1993 IEC 748-1 a 198

34、4 Semiconductor devices. Integrated circuits Part 1: General IEC 749 1984 Semiconductor devices. Mechanical and climatic test methods + A1 + A2 1991 1993 CECC 00 007 Sampling plans and procedures for inspection by attributes CECC 00 114 Quality Assessment Procedures (RP 14) Part I: Approval of manuf

35、acturers and other organizations (with addemdum) (RP 14/I) EN 100114-1 CECC 00 114/III Part III: Capability Approval of an electronic component manufacturing activity (RP 14/III) Radiographic inspection of electronic components EN 100012 Protection of electrostatic sensitive devices EN 100015 CECC 00 016 Basic requirements for the use of Statistical Process Control (SPC) in the CECC systems Part 1: Minimum requirements CECC 00 020 Register of firms, products and services approved under the CECC system