BS EN 16602-70-07-2014 Space product assurance Verification and approval of automatic machine wave soldering《焊接和相关工艺 金属焊接工艺的定义》.pdf

1、BSI Standards PublicationBS EN 16602-70-07:2014Space product assurance Verification and approvalof automatic machine wavesolderingBS EN 16602-70-07:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN16602-70-07:2014. It supersedes BS EN 14612:2003 which iswithd

2、rawn.The UK participation in its preparation was entrusted to TechnicalCommittee ACE/68, Space systems and operations.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contrac

3、t. Users are responsible for its correctapplication. The British Standards Institution 2014. Published by BSI StandardsLimited 2014ISBN 978 0 580 84424 9ICS 49.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority o

4、f theStandards Policy and Strategy Committee on 31 October 2014.Amendments issued since publicationDate Text affectedBS EN 16602-70-07:2014EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-07 October 2014 ICS 49.140 Supersedes EN 14612:2003 English version Space product assurance - Verif

5、ication and approval of automatic machine wave soldering Assurance produits des projets spatiaux - Validation et approbation du brasage automatique la vague Raumfahrtproduktsicherung - Verifikation und Zulassung von Maschinenschwallltverfahren This European Standard was approved by CEN on 20 March 2

6、014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may

7、 be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own

8、 language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Form

9、er Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix

10、17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-70-07:2014 EBS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 2 Table of contents Foreword 4 Introduction 5 1 Scope . 6 2 No

11、rmative references . 7 3 Terms, definitions and abbreviated terms 8 3.1 Terms from other standards 8 3.2 Terms specific to the present standard . 8 3.3 Abbreviated terms. 9 4 Principles 10 5 Requirements 11 5.1 General . 11 5.1.1 PCB design constraints . 11 5.1.2 Rework 11 5.2 Request for verificati

12、on of the automatic wave soldering process . 12 5.2.1 General . 12 5.2.2 Technology samples . 12 5.2.3 Examination 12 5.3 Line audit 13 5.4 Verification 13 5.4.1 Planning, management and finance 13 5.4.2 Description of samples 13 5.4.3 Initial tests . 14 5.4.4 Environmental exposure . 15 5.4.5 Final

13、 tests . 15 5.4.6 Final verification report 16 5.5 Approval . 16 5.5.1 Notification 16 5.5.2 Renewal of approval . 16 5.5.3 Withdrawal of approval 16 BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 3 5.5.4 Approval for future project . 17 5.6 Process requirements for wave soldering of printed circuit

14、boards 17 Annex A (normative) Solder joint discrepancy log DRD . 20 Annex B (normative) Request for verification of the automatic wave soldering process - DRD. 22 Annex C (normative) Automatic wave soldering process verification report DRD 24 Annex D (normative) Machine-soldering logbook DRD 26 Anne

15、x E (normative) Wave soldering process identification document (PID) DRD 27 Bibliography . 28 Figures Figure 4-1: Sequence of main events for final customer verification and approval of wave soldering process 10 Figure A-1 : Example of a solder joint discrepancy log . 21 Tables Table 5-1: Limits for

16、 warp and twist 14 BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 4 Foreword This document (EN 16602-70-07:2014) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16602-70-07:2014) originates from ECSS-Q-ST-70-07C. This European

17、Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by April 2015, and conflicting national standards shall be withdrawn at the latest by April 2015. Attention is drawn to the possibility that some of the elements of

18、this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document supersedes EN 14612:2003. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Tra

19、de Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations o

20、f the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Net

21、herlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 5 Introduction Wave soldering is regarded as a critical process that can find limited application during the assembly of component

22、s on to printed circuit boards (PCBs) intended for spacecraft. The preferred procedure is by manual soldering to the requirements of ECSS-Q-ST-70-08. Generally the small number of identically designed circuits does not warrant the setting up of unique machine parameters for each individual layout. W

23、hen wave soldering is identified as a suitable alternative to manual soldering for use in the customers projects, it can be essential to follow the steps outlined in this document before the final customers approval is granted. The sequence of main events is shown in Figure 4-1. Each step is fully c

24、ompleted and the details recorded, so that a dossier is compiled for each manufacturers assembly line. All dossiers are kept updated by the approval authority and serve as a reference for the approval authoritys Project Engineers. A general qualification is not granted for wave soldering. Wave solde

25、ring lines that have been previously verified (see also clause 5.2) can be also approved for use on named projects, but this depends entirely on the specific project requirements. Project process approval is requested, as for all materials and critical processes, by means of ECSS-Q-ST-70. BS EN 1660

26、2-70-07:2014EN 16602-70-07:2014 (E) 6 1 Scope This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined. Th

27、is standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00. BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 7 2 Normative references The following normative documents contain provisions which, through reference in this text, constitut

28、e provisions of this ECSS Standard. For dated references, subsequent amendments to, or revision of any of these publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the more recent editions of the normative do

29、cuments indicated below. For undated references, the latest edition of the publication referred to applies. EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance Nonconformance control system EN 1660

30、2-70 ECSS-Q-ST-70 Space product assurance - Materials, mechanical parts and processes EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance - Manual soldering of high-reliability electrical connections EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance - Qualification of printed circuit boards

31、EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance - Repair and modification of printed circuit board assemblies for space use BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 8 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and

32、 definitions from ECSS-S-ST-00-01 ECSS-Q-ST-70, ECSS-Q-ST-70-08 and ECSS-Q-ST-70-28 apply. 3.2 Terms specific to the present standard 3.2.1 approval authority entity/organization responsible for executing (or sub-contracting) the examination of the technology samples, performing the automatic wave s

33、oldering process line-audit, authorizing the implementation of the suppliers verification programme, and notifying, renewing or withdrawing the approval of the verification NOTE The approval authority is the final customer or the representative nominated by him. For example, for ESA programmes, the

34、final customer is ESA. 3.2.2 component density number of components per unit board area 3.2.3 ionisable contaminant process residues that exist as ions and when dissolved, increase electrical conductivity NOTE Examples of such process residues flux are activators, fingerprints, etching and plating s

35、alts. 3.2.4 machine oil liquid compounds formulated for use as oil in wave-soldering equipment NOTE They serve primarily to provide a barrier between the atmosphere and molten solder, thereby reducing the oxidation (drossing) of the solder. Certain oils also reduce the surface tension of molten sold

36、er, thereby enhancing the wetting characteristics of the solder. BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 9 3.2.5 measling condition existing in the base laminate of a printed circuit board in the form of discrete white spots or “crosses” below the surface of the base laminate, reflecting a sep

37、aration of fibres in the glass cloth at the weave intersection 3.2.6 technology samples samples of wave-solder assembled boards NOTE These samples are provided by the supplier in addition to the application for verification. 3.2.7 wave soldering process wherein printed circuit boards are brought in

38、contact with a gently overflowing wave of liquid solder which is circulated by a pump in an appropriately designed solder pot reservoir NOTE The prime functions of the molten wave are to serve as a heat source and heat transfer medium and to supply solder to the joint area. 3.2.8 wave-soldering equi

39、pment systems that achieve wave soldering NOTE 1 A typical wave soldering equipment consist of stations for fluxing, preheating, and soldering by means of a conveyer. NOTE 2 Cleaning is usually offered as an option. Normally, additional cleaning can be required in order to meet ECSS (or customer spe

40、cific) cleanliness standards. 3.3 Abbreviated terms For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01 and the following apply: Abbreviation Meaning PID process identification document BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 10 4 Principles The sequence of main events

41、 for final customer verification and approval of wave soldering process is given in Figure 4-1. Identification of wave solder suitability Technology samples Verification Programme (5.4) Initial Tests 5 PCB samples (5.4.3a.) Reference PCB 1 sample (5.4.3b.) Environmental Exposure 4 samples (5.4.4) Fi

42、nal tests (5.4.5) Report (5.4.6) Final Customer Approval (5.5) Final Customer Verification Final Customer Assessment on samples Final Customer Line Audit Process Verification Request Figure 4-1: Sequence of main events for final customer verification and approval of wave soldering process BS EN 1660

43、2-70-07:2014EN 16602-70-07:2014 (E) 11 5 Requirements 5.1 General 5.1.1 PCB design constraints a. The supplier shall specify to the designers of printed circuit boards intended to be manufactured, the design constraints of using an automatic wave soldering process. b. The design constraint specifica

44、tion specified in 5.1.1a shall, at least, include the following statements: 1. To avoid solder bridging, orient circuit tracks that are spaced close together in line with the pass direction. 2. Avoid large heat sink areas for ground planes and large leads closely connected to massive metal parts. 5.

45、1.2 Rework a. For rework of soldered joints, ECSS-Q-ST-70-08 shall apply with a maximum of 5 % rework on each wave soldered circuit NOTE Deficient wave-soldered connections are caused most frequently by the movement of component leads during solidification, the presence of solder alloy within stress

46、 relief bends and the entrapment of machine oils and solder fluxes within the solder fillet. Rework of any nature is costly. It involves not only the risk of irreparable lifted pads and measling, but also the possibility of heat damage to sensitive components. b. The supplier shall maintain a solder

47、 joint discrepancy log in conformance with the DRD in Annex A. NOTE This is an aid to process control, optimization of parameters and repeatability. BS EN 16602-70-07:2014EN 16602-70-07:2014 (E) 12 5.2 Request for verification of the automatic wave soldering process 5.2.1 General a. The supplier sha

48、ll establish a request for verification of the automatic wave soldering process in conformance with Annex B- DRD b. The request for verification of the automatic wave soldering process shall be signed by the suppliers person responsible for space component assembly processes. c. The request for veri

49、fication of the automatic wave soldering process shall be submitted to the approval authority. 5.2.2 Technology samples a. In addition to the request for verification of the automatic wave soldering process, the supplier shall provide three technology samples of wave-solder assembled boards whose complexity is typical of that found in spacecraft and which meet space-quality workmanship standards. b. The supplier shall perform a cleaning without conformal coating of the samples specified in 5.2.2a. c. The technology samples specified in 5.2.2a shall consist of PCB