1、BSI Standards PublicationBS EN 16602-70-28:2014Space product assurance Repair and modification ofprinted circuit board assembliesfor space useBS EN 16602-70-28:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation ofEN 16602-70-28:2014.The UK participation in its prepa
2、ration was entrusted to Technical Committee ACE/68, Space systems and operations.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its co
3、rrect application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 84598 7 ICS 49.140 Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Stra
4、tegy Committee on 30 November 2014.Amendments/corrigenda issued since publicationDate T e x t a f f e c t e dEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-28 October 2014 ICS 49.140 English version Space product assurance - Repair and modification of printed circuit board assemblies
5、for space use Assurance produit des projets spatiaux - Rparation et modification des ensembles de circuits imprims pour utilisation spatiale Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen fr den Einsatz im WeltraumThis European Standard was approved by CEN on 11
6、April 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standa
7、rds may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into
8、its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finlan
9、d, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue
10、Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-70-28:2014 EBS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 2 Table of contents Foreword 9 1 Scope . 10 2 Normative
11、 references . 11 3 Terms, definitions and abbreviated terms 12 3.1 Terms from other standards 12 3.2 Terms specific to the present standard . 12 3.3 Abbreviated terms. 13 4 Requirements 14 4.1 Basic requirements . 14 4.1.1 Hazard, health and safety precautions 14 4.1.2 Materials . 14 4.1.3 Facilitie
12、s 14 4.1.4 General . 14 4.2 Repairs . 15 4.2.1 Repair criteria 15 4.2.2 Number of repairs . 15 4.3 Modifications . 15 4.3.1 Modification criteria . 15 4.3.2 Number of modifications 16 4.4 Rework . 16 4.4.1 Rework criteria 16 4.4.2 Number of reworks 16 4.5 Other requirements . 16 4.6 Removal of confo
13、rmal coating 17 4.6.1 Requirements 17 4.6.2 Procedure . 17 4.6.3 Acceptance criteria 17 4.7 Solder joint removal and unclinching 18 4.7.1 Procedure . 18 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 3 4.7.2 Acceptance criteria 18 4.8 Repair of damaged gold-plated areas . 18 4.8.1 Requirements 18 4.8
14、.2 Procedure . 18 4.8.3 Acceptance criteria 19 4.9 Repair of damaged conductor tracks 19 4.9.1 Requirements 19 4.9.2 Procedure . 19 4.9.3 Acceptance criteria 20 4.10 Repair of lifted conductors 20 4.10.1 Requirements 20 4.10.2 Procedure . 20 4.10.3 Acceptance criteria 20 4.11 Repair of lifted termin
15、al areas (pads) 21 4.11.1 Requirements 21 4.11.2 Procedure . 21 4.11.3 Acceptance criteria 21 4.12 Terminal post replacement . 21 4.12.1 Requirements 21 4.12.2 Procedure . 21 4.12.3 Acceptance criteria 21 4.13 Wire-to-wire joints . 22 4.13.1 Requirements 22 4.13.2 Procedure . 22 4.13.3 Acceptance cr
16、iteria 22 4.14 Addition of components 22 4.14.1 Requirements 22 4.14.2 Procedure . 23 4.14.3 Acceptance criteria 23 4.15 Removal and replacement of axial and multi-lead components. 24 4.15.1 Requirements 24 4.15.2 Procedure . 24 4.15.3 Acceptance criteria 24 4.16 Removal and replacement of flat-pack
17、 components 24 4.16.1 Requirements 24 4.16.2 Procedure . 24 4.16.3 Acceptance criteria 25 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 4 4.17 Modification of component connections 25 4.17.1 Requirements 25 4.17.2 Procedure . 25 4.17.3 Acceptance criteria 26 4.18 Cutting of internal track of a multi
18、-layer printed circuit board . 26 4.18.1 Procedure . 26 4.18.2 Acceptance criteria 26 4.19 Quality assurance . 26 4.19.1 General . 26 4.19.2 Data 26 4.19.3 Nonconformance . 27 4.19.4 Calibration . 27 4.19.5 Traceability . 27 4.19.6 Operator and inspector training and certification . 27 Annex A (info
19、rmative) Removal of conformal coating . 28 A.1 Introduction . 28 A.2 Tools and materials 28 A.3 Methods for the removal of conformal coating 28 A.3.1 Method for the removal of polyurethane and silicone-type coating 28 A.3.2 Method for the removal of epoxy-type coating . 29 Annex B (informative) Sold
20、er joint removal and unclinching 31 B.1 Introduction . 31 B.2 Tools and materials 31 B.3 Methods for solder joint removal and unclinching . 31 B.3.1 Method for solder extraction with continuous vacuum . 31 B.3.2 Method for solder extraction using sucker . 32 B.3.3 Method for hot jet extraction 33 B.
21、3.4 Method for the use of wicking braid . 33 B.3.5 Method for unclinching of leads . 34 Annex C (informative) Repair of damaged gold-plated areas 35 C.1 Introduction . 35 C.2 Tools and materials 35 C.3 Methods for the repair of damaged gold-plated areas . 35 C.3.1 Method for the removal of solder sp
22、latter on gold plating 35 Annex D (informative) Repair of damaged conductor tracks 36 D.1 Introduction . 36 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 5 D.2 Tools and materials 36 D.3 Method for the repair of damaged conductor tracks 36 Annex E (informative) Repair of lifted conductors . 37 E.1 I
23、ntroduction . 37 E.2 Tools and materials 37 E.3 Methods for repair of lifted conductors 38 E.3.1 Method for the use of epoxy under conductor . 38 E.3.2 Method for the use of epoxy over conductor . 38 Annex F (informative) Repair of lifted terminal areas (pads) . 39 F.1 Introduction . 39 F.2 Tools an
24、d materials 40 F.3 Method for the repair of lifted terminal areas (pads) 40 Annex G (informative) Terminal post replacement . 41 G.1 Introduction . 41 G.2 Tools and materials 41 G.3 Method for the replacement of terminal post . 41 Annex H (informative) Wire-to-wire joints . 43 H.1 Introduction . 43
25、H.2 Tools and materials 43 H.3 Method for wire-to-wire joining 43 Annex I (informative) Addition of components . 45 I.1 Introduction . 45 I.2 Tools and materials 45 I.3 Methods for addition of components . 46 I.3.1 Method for additional components mounted on reverse (non-component) side of board . 4
26、6 I.3.2 Method for additional components mounted on component side of board. 47 I.3.3 Method for additional components mounted on terminal posts, including “piggyback“ mounting . 48 I.3.4 Method for additional components mounted (on reverse side or on component side of board) using staking compound.
27、 49 I.3.5 Method for additional components mounted (on reverse side or on component side of board) to leads of adjacent components 50 I.3.6 Method for the addition of a wire link onto soldered chips on a single side piece of PCB with appropriate pads . 55 I.3.7 Method for the addition of a wire link
28、 onto metallized cap of chips directly glued on PCB 56 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 6 Annex J (informative) Removal and replacement of axial and multi-lead components . 57 J.1 Introduction . 57 J.2 Tools and materials 57 J.3 Methods for removal and replacement of axial and multi-lea
29、d components 57 J.3.1 Method for the removal of components with axial leads (destructive removal) 57 J.3.2 Method for the removal of multi-lead components (destructive removal) 58 Annex K (informative) Removal and replacement of flat-pack components 60 K.1 Introduction . 60 K.2 Tools and materials 6
30、0 K.3 Method for the removal and replacement of flat-pack components . 60 Annex L (informative) Modification of component connections . 62 L.1 Introduction . 62 L.2 Tools and materials 62 L.3 Methods for modification of component connections . 62 L.3.1 Method for the soldering of a wrap-around conne
31、ction to an extended component lead 62 L.3.2 Method for the soldering of component lead to a stud lead mounted into an existing hole 63 L.3.3 Method for mounting a dual-in-line (DIL) package with or without a wire link soldered onto a cropped lead 64 L.3.4 Method for mounting a connector with or wit
32、hout a wire link soldered onto a cropped lead 66 L.3.5 Method for the addition of a wire link into a plated-through hole occupied by a flat-section lead 67 L.3.6 Method for the addition of a wire link on top of a flat-pack lead . 69 L.3.7 Method for the isolation of a component lead 69 L.3.8 Method
33、for the addition of a wire link onto terminal pad of soldered chips . 71 Annex M (informative) Cutting of internal track of a multi-layer printed circuit board . 73 M.1 Introduction . 73 M.2 Tools and materials 73 M.3 Method for cutting the internal track of a multi-layer printed circuit board 73 Bi
34、bliography . 75 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 7 Figures Figure A-1 : Removal of coating by thermal parting device . 30 Figure B-1 : Continuous vacuum solder extraction on stud lead . 32 Figure B-2 : Pulse-type solder sucker in use 32 Figure B-3 : Lifting individual leads with hot jet
35、 . 33 Figure B-4 : Cross-sectional view of wicking method 34 Figure B-5 : Hot unclinching with thermal parting device 34 Figure E-1 : Lifted conductors. 37 Figure E-2 : Repair using epoxy under conductor . 38 Figure E-3 : Repair using epoxy over conductor . 38 Figure F-1 : Lifted terminal area . 39
36、Figure F-2 : Terminal areas without track . 39 Figure F-3 : Terminal areas with track attached 40 Figure G-1 : Terminal post replacement . 42 Figure H-1 : Use of approved type support clamp/heat sink . 44 Figure I-1 : Additional components mounted on reverse (non-component) side of board 47 Figure I
37、-2 : Additional components mounted on component side of board 48 Figure I-3 :“Piggyback” mounting of one component on top of another . 49 Figure I-4 : Mounting and wiring of additional axially-leaded components mounted (on reverse side or on component side of board) using staking compound 51 Figure
38、I-5 : Upside down mounting and wiring of additional side-brazed DIL component (on reverse side or on component side of board) using staking compound 52 Figure I-6 : Mounting of additional non-axially leaded components, e.g. capacitors, with wire connecting top or bottom sides of the circuit board us
39、ing staking compound (on reverse side or on component side of board) 52 Figure I-7 : Mounting of additional component (on component side of board) with wire connections on reverse side of board using staking compound 53 Figure I-8 : Mounting of additional component (on reverse side of board) across
40、extended leads of adjacent components 53 Figure I-9 : Mounting of additional component by linking to a “pigtailed” lead of an adjacent component . 54 Figure I-10 : Mounting of additional component by linking to lead of an adjacent transistor (or other large component) . 55 Figure I-11 : Addition of
41、a wire link onto metallized cap of chips directly glued on PCB 56 Figure J-1 : Removal of multi-lead components, clipping of component leads 58 Figure J-2 : Removal of multi-lead components, removal of remaining component leads . 59 Figure K-1 : Removal of flat-pack components . 61 Figure L-1 : Sold
42、ering of a wrap-around connection to an extended component lead . 63 Figure L-2 : Soldering of component lead to a stud lead mounted into an existing hole 64 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 8 Figure L-3 : Mounting a dual-in-line package with or without a wire link soldered onto a cropp
43、ed lead (cropped lead without connection and cropped lead with connection led through hole and onto board) . 65 Figure L-4 : Mounting a dual-in-line package with or without a wire link soldered onto a cropped lead (wire link passing away from board) 66 Figure L-5 : Mounting a connector with a wire l
44、ink soldered onto a cropped lead . 67 Figure L-6 : Addition of a wire link into a plated through hole occupied by a flat-section lead (wire link entering from the reverse side of the board) 68 Figure L-7 : Addition of a wire link into a plated through hole occupied by a flat-section lead (wire link
45、entering from the component side of the board) . 68 Figure L-8 : Addition of a wire link on top of a flat-pack lead . 69 Figure L-9 : Isolation of a component lead 71 Figure L-10 : Addition of a wire link onto terminal pad of soldered chips . 72 Figure M-1 : Cutting of internal track of a multi-laye
46、r circuit board 74 Tables Table 4-1: Wire diameters for given conductor widths 19 BS EN 16602-70-28:2014EN 16602-70-28:2014 (E) 9 Foreword This document (EN 16602-70-28:2014) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 166
47、02-70-28:2014) originates from ECSS-Q-ST-70-28C. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by April 2015, and conflicting national standards shall be withdrawn at the latest by April 2015. Atte
48、ntion is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the European Commission an
49、d the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
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