BS EN 60191-6-13-2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid A.pdf

1、Mechanical standardization of semiconductor devicesPart 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)BS EN 60191-6-13:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordTh

2、is British Standard is the UK implementation of EN 60191-6-13:2016. It isidentical to IEC 60191-6-13:2016. It supersedes BS EN 60191-6-13:2007which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on t

3、his committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 83163 8ICS

4、31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 December 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 601

5、91-6-13:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60191-6-13 November 2016 ICS 31.080.01 Supersedes EN 60191-6-13:2007 English Version Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and F

6、ine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) Normalisation mcanique des dispositifs semiconducteurs - Partie 6-13: Guide de conception pour les supports sans couvercle pour les botiers matriciels billes et pas fins (FBGA) et les botiers matriciels zone de contact plate et pas fins (FLGA) (

7、IEC 60191-6-13:2016) Mechanische Normung von Halbleiterbauelementen - Teil 6-13: Konstruktionsleitfaden fr Open-top-Fassungen fr Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA) (IEC 60191-6-13:2016) This European Standard was approved by CENELEC on 2016-11-01. CENELEC members a

8、re bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to

9、 the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Mana

10、gement Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ir

11、eland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches K

12、omitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60191-6-13:2016 E BS EN 60191-6-13:2016EN 60191-6-13:2016 2 European foreword

13、The text of document 47D/878/FDIS, future edition 2 of IEC 60191-6-13, prepared by SC 47D “Semiconductor devices packaging“ of IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60191-6-13:2016. The following dates are fixed: latest date by

14、 which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-08-01 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-11-01 This document supersedes EN 60191-6-13:2007.

15、 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60191-6-13:2016 was app

16、roved by CENELEC as a European Standard without any modification. BS EN 60191-6-13:2016EN 60191-6-13:2016 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced

17、in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modificatio

18、ns, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60191-2 - Mechanical standardization of semiconductor devices - Part 2: Dime

19、nsions - - IEC 60191-6 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 60191-6-13:2016 2 IEC 60191-6-13:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Sco

20、pe 6 2 Normative references. 6 3 Terms and definitions 6 4 Socket code 6 4.1 Construction of socket code 6 4.2 Symbols 7 4.2.1 Semiconductor sockets symbol . 7 4.2.2 Socket type symbol 7 4.2.3 Socket nominal dimension symbol 7 4.2.4 Number of terminal arrays 7 4.2.5 Terminal pitch 7 5 Terminal numbe

21、r . 7 6 Socket nominal dimension . 8 7 Socket length and width . 8 8 Reference symbols and schematics . 8 8.1 Outline drawings . 8 8.2 Reference symbols and schematics of recommended socket mounting pattern on printed circuit board 11 8.3 Overall dimensions 12 8.4 Recommended dimensions of socket mo

22、unting pattern on printed circuit board 17 9 Individual outline drawing standard registration 18 Figure 1 Outline drawings of the socket 9 Figure 2 Outline drawings for the definition of terminal diameter . 10 Figure 3 Applicable package outline . 10 Figure 4 Socket mounting pattern . 11 Table 1 Ove

23、rview for the different socket groups 8 Table 2 Overall dimensions (1 of 2) 12 Table 3 Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2) 14 Table 4 Socket dimension for Group 4 (square or rectangular socket) . 16 Table 5 Socket mounting dimensions 17 Table 6 Registration table 18 BS EN

24、 60191-6-13:2016IEC 60191-6-13:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) FOREWORD 1) The Internationa

25、l Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic f

26、ields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any

27、IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardiz

28、ation (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has represe

29、ntation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC c

30、annot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publicat

31、ions. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas,

32、access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including

33、individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance u

34、pon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the element

35、s of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-13 has been prepared by subcommittee 47D: Semiconductor devices packaging, of IEC technical committee 47: Semiconductor d

36、evices. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expande

37、d to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4. BS EN 60191-6-13:2016 4 IEC 60191-6-13:2016 IEC 2016 The text of this standard is based on the following

38、 documents: FDIS Report on voting 47D/878/FDIS 47D/885/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts

39、in the IEC 60191 series, under the general title Mechanical standardization of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.ie

40、c.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 60191-6-13:2016IEC 60191-6-13:2016 IEC 2016 5 INTRODUCTION This part of IEC 60191 aims to standardize the outer dimensions of the sock

41、ets for FBGA and FLGA, where leading-edge developments are aggressively innovated, to establish their compatibility with the needs of the surface-mount industry that is globally expanding due to enhanced functions and performances of electrical devices. For defining each dimension, the target was to

42、 indicate the standard design value which has the concept of the design centre as much as possible, aiming to enhance the function as a standardization index. BS EN 60191-6-13:2016 6 IEC 60191-6-13:2016 IEC 2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-13: Design guideline of open-

43、top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) 1 Scope This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC

44、 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated referen

45、ces, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2, Mechanical standardization of semiconductor devices Part 2: Dimensions IEC 60191-6, Mechanical standardization of semiconductor devices Part 6:

46、General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60191-6 apply. 4 Socket code 4.1 Construction of socket code A socket code is constructed as follow

47、s. EXAMPLE Symbol of socket 4.2.1 Symbol of socket type 4.2.2 Symbol of nominal dimension 4.2.3 Number of terminal arrays 4.2.4 Terminal pitch 4.2.5 SFB TX 2120AB 1616 080 BS EN 60191-6-13:2016IEC 60191-6-13:2016 IEC 2016 7 4.2 Symbols 4.2.1 Semiconductor sockets symbol The symbol for socket shall b

48、e expressed in three characters. The first character, “S”, refers to socket and the rest to the package code. FBGA shall be expressed as “FB”, FLGA shall be expressed as “FL”. 4.2.2 Socket type symbol The symbol for socket type shall be expressed in two characters. The first character “T” refers to

49、open-top type and the rest remains option “X”. Clamshell type socket is referred to as “C”. 4.2.3 Socket nominal dimension symbol The symbol for nominal dimension shall be expressed in six characters, which consist of four numeric characters and two alphabetical characters. The first four numeric characters comply with nominal dimension E D, which refers to the applicable maximum width and length of FBGA/FLGA package. The last two alphabeti