BS EN 60191-6-4-2003 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - .pdf

1、BRITISH STANDARD BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA) The European Standard EN 60191-

2、6-4:2003 has the status of a British Standard ICS 31.080.01 BS EN 60191-6-4:2003 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 4 August 2003 BSI 4 August 2003 ISBN 0 580 42356 5 National foreword This British Standard is the official Englis

3、h language version of EN 60191-6-4:2003. It is identical with IEC 60191-6-4:2003. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to

4、its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electron

5、ic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to unde

6、rstand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document compris

7、es a front cover, an inside front cover, the EN title page, pages 2 to 17 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-4 NORME EUROPENNE EUROPI

8、SCHE NORM July 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by

9、 any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-4:2003 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for p

10、ackage dimensions of ball grid array (BGA) (IEC 60191-6-4:2003) Normalisation mcanique des dispositifs semiconducteurs Partie 6-4: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface - Mthodes de mesure pour les dimensions des botiers matrici

11、els billes (CEI 60191-6-4:2003) Mechanische Normung von Halbleiterbauelementen Teil 6-4: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Messverfahren fr Gehusemae von Ball Grid Array (BGA) (IEC 60191-6-4:2003) This European Standard was approved by CENELEC on 2

12、003-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may b

13、e obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to th

14、e Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta, Netherlands, Norway, Portug

15、al, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 47D/531/FDIS, future edition 1 of IEC 60191-6-4, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and

16、 was approved by CENELEC as EN 60191-6-4 on 2003-07-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-04-01 latest date by which the national standards conflicting with

17、 the EN have to be withdrawn (dow) 2006-07-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-4:2003 was approved by CENELEC as a

18、European Standard without any modification. _ Page2 EN6019164:2003CONTENTS 1 Scope4 2 Normative references.4 3 Terms and definitions4 4 Reference character and drawings5 4.1 Ball grid array package (BGA) Type 1 Ball datum 5 4.2 Ball grid array package (BGA) Type 2 Body datum 6 5 Measuring method7 5.

19、1 Datum S as pertaining to ball coplanarity .7 5.2 Datum A, B7 5.3 Definition of specified dimensions and measuring method 9 5.4 Profile of a package edge surface v .11 5.5 Mounting height A12 5.6 First stand-off A1.12 5.7 Second stand-off A413 5.8 Ball diameter b 14 5.9 Ball centre position X.14 5.

20、10 Ball coplanarity y.16 5.11 Package top flatness y1.16 Annex ZA (normative references to international publications with their corresponding European publications 17 Figure 1 BGA package Type 1 Ball datum5 Figure 2 BGA package Type 2 Body datum6 Figure 3 Datum S.7 Figure 4 Datum A, B Type 1 8 Figu

21、re 5 Centre of ball centres (for an even number) 8 Figure 6 Centre of ball centres (for an odd number)8 Figure 7 Datum A Type 2 9 Figure 8 Datum B Type 2 9 Figure 9 Tolerance w .10 Figure 10 Measuring method of tolerance w10 Figure 11 Profile of a package edge surface v 11 Figure 12 Measuring method

22、 of package edge surface v.11 Figure 13 Mounting height A 12 Figure 14 First stand-off A112 Figure 15 Measuring method of stand-off A1.13 Figure 16 Second stand-off A4 .13 Figure 17 Measuring method of stand-off A4.14 Figure 18 Ball diameter b .14 Figure 19 Ball centre position X 15 Figure 20 Theore

23、tically correct ball centre 15 Figure 21 Measuring method of ball centre position X .15 Figure 22 Ball coplanarity y16 Figure 23 Package top flatness y116 Page3 EN6019164:2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-4: General rules for the preparation of outline drawings of surfa

24、ce mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA) 1 Scope This part of IEC 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. 2 Normative references The following referenced documents are indispensable

25、 for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-6:1990, Mechanical standardization of semiconductor devices Part 6: General rules for the p

26、reparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document, the definitions of IEC 60191-6 apply. The measuring method in this standard is defined for dimension values guaranteed to users on the basis of the following ite

27、ms. 1) In general, measurement may be made either by hand or automatically. 2) If a dimension is difficult to measure, the best alternative measuring method will be defined as the preferred measuring method. Page4 EN6019164:20034 Reference character and drawings 4.1 Ball grid array package (BGA) Typ

28、e 1 Ball datum A B C 1 2 3 SD A3 A4 SE B2 B1 ZD e A1 A A2 v S X4 w SA D Even type b x S B4 B3 B A1 Odd type A1 A2 A2 A e y S A1 E S y1 B S w ZE M IEC 1424/03Figure 1 BGA package Type 1 Ball datum Page5 EN6019164:20034.2 Ball grid array package (BGA) Type 2 Body datum 1 2 3 A B C S A SE B vS y1 S D E

29、 vS A2 y2 S e SD x S A B x1 S bp e A3 A1 A4 y S ZD ZE A M M IEC 1425/03Figure 2 BGA package Type 2 Body datum Page6 EN6019164:20035 Measuring method 5.1 Datum S as pertaining to ball coplanarity The datum S (seating plane) can be determined by either of the following: a) Datum S formed from the tria

30、ngulation of the tallest three balls. The tallest three balls defining the seating plane must fully encompass the projection of the centre of gravity (COG) in order to constitute a valid seating plane. b) Datum S calculated from the LSM (least squares method) plane applies to stand-off A2, stand-off

31、 A1, the ball centre point and coplanarity. Calculate a plane from each lowest point of all balls based on LSM. Datum S shall be the LSM plane shifted to bottom of the lowest ball. (b) S Lowest ball (a) Centre of gravity (COG) Least squares method (LSM) plane IEC 1426/03Figure 3 Datum S 5.2 Datum A,

32、 B a) Type 1 Centres of opposite sides of a package, which are defined below, shall be connected together. An angle subtended by the two crossing lines shall be obtained. A difference | 90 | of the angle from 90 shall be equally distributed to the sides to obtain orthogonal axes. These datum A and B

33、 should be the perpendicular planes to the datum S. Page7 EN6019164:2003Figure 3 B A = 90 2 Definition of the centre of sides IEC 1427/03Figure 4 Datum A, B Type 1 = = = = Ball centre Ball centre Centre of ball centres Centre of ball centres IEC 1429/03 IEC 1428/03Figure 5 Centre of ball centres (fo

34、r an even number) Figure 6 Centre of ball centres (for an odd number) b) Type 2 On the E sides of the package (see Figure 2), a minimum of 4 points shall be selected (points 1-4) (see Figure 7). The lines shall be drawn from these points (1-2 and 3-4). The lines that pass through the midpoints of th

35、ese two lines (5 and 6) will hereafter be referred to as datum A. On the D sides of the package (see Figure 2) coinciding with datum A, 2 points shall be selected (7 and 8) (see Figure 8). The line perpendicular to datum A passing through the midpoint of this line (7-8) will hereafter be referred to

36、 as datum B. Page8 EN6019164:20032 4 (Datum A) 3 5 6 1 IEC 1430/03Figure 7 Datum A Type 2 2 4 (Datum B) 7 8 3 5 6 1 IEC 1431/03Figure 8 Datum B Type 2 5.3 Definition of specified dimensions and measuring method a) Tolerance w of the centre position of package length and width The package width and l

37、ength should be defined as a distance between parallel tangent lines which touched package profile. The centre of the package should be defined as the centre of these parallels. Tolerance w of the centre position of package length and width should be defined as a tolerance of it. Page9 EN6019164:200

38、3E B w D A wThe centreline of package length D The centreline of package width E The centre of E should be within the range w The centre of D should be within the range w IEC 1432/03Figure 9 Tolerance w b) Measuring method Put the package on the surface plate. 1) The package width and length should

39、be defined as a distance between parallel tangent lined which touches package profile. 2) Make sure the centre of it is within the range w centring on datum A and B. E = = w w D = = B A IEC 1433/03Figure 10 Measuring method of tolerance w Page10 EN6019164:20035.4 Profile of a package edge surface v

40、Profile of a package edge surface v should be defined as the range centring on the position which is a theoretically correct distance of D or E. D v E IEC 1434/03Figure 11 Profile of a package edge surface v Measuring method The package size in both directions shall be determined by the length and w

41、idth of the maximum and minimum square (or rectangle) to the package perimeter. Place the package on the seating plane and align pin one of the package to the gauge block to assure the package edges fall within the package tolerances (see Figure 12). Gauge block Best fit square (maximum dimension) A

42、ctual board edge D + v D v E + v E v Best fit square (minimum dimension) Pine one 0 IEC 1435/03NOTE Excluding parts of chamfer. Figure 12 Measuring method of package edge surface v Page11 EN6019164:20035.5 Mounting height A Let the height of a package from the seating plane to the top of the package

43、 be defined as the mounting height. The mounting height therefore includes inclination and warping of the package. Figure 13 S A S A First priority IEC 1436/03Figure 13 Mounting height A Measuring method 1) Put the package on the surface plate. 2) From the top or side, measure the distance to the hi

44、ghest point. Let the distance be denoted as the mounting height. 5.6 First stand-off A1 First stand-off is defined as the distance from the seating plane to the lowest point of the package except the cavity. A1 S S A1 IEC 1437/03Figure 14 First stand-off A1 Page12 EN6019164:2003Measuring method Firs

45、t stand-off is the distance measured from the calculate datum S based on the LSM (least squares method) to the lowest point on the package except the cavity. A1 S S Datum S based on LSM Datum S based on LSM A1 IEC 1438/03Figure 15 Measuring method of stand-off A1 5.7 Second stand-off A4 Second stand

46、-off is defined as the distance from the seating plane to the lowest point of the cavity. S S A4 A4 IEC 1439/03Figure 16 Second stand-off A4 Measuring method Second stand-off is the distance measured from the calculate datum S based on LSM (least squares method) to the lowest point on the cavity. Pa

47、ge13 EN6019164:2003S S A4 Datum S based on LSM A4 Datum S based on LSM IEC 1440/03Figure 17 Measuring method of stand-off A4 5.8 Ball diameter b Ball diameter is defined as the diameter of a circle circumscribed about a vertical projection of the ball from the seating plane. b IEC 1441/03Figure 18 B

48、all diameter b Measuring method 1) Make the calculate datum S based on LSM (least squares method) coincide with the measuring reference. 2) Measure the diameter of a circle circumscribed about the ball. 5.9 Ball centre position X Based on datum A, B and S, determine the difference between the theoretically correct position of each balls centre and the actual position. That allowable distance to be the ball centre position tolerance (X/2). Page14 EN6019164:2003x SA B b B A Theoretically correct ball centre Actual ball centre X/2 area M IEC 1442/03 IEC 1443/