BS EN 60191-6-8-2001 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - a.pdf

1、BRITISH STANDARD BS EN 60191-6-8:2001 IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP) The European Stand

2、ard EN 60191-6-8:2001 has the status of a British Standard ICS 31.080.01 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 60191-6-8:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was publis

3、hed under the authority of the Standards Policy and Strategy Committee on 16 November 2001 BSI 16 November 2001 ISBN 0 580 38677 5 National foreword This British Standard is the official English language version of EN 60191-6-8:2001. It is identical with IEC 60191-6-8:2001. The UK participation in i

4、ts preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/4, Mechanical standardization, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publicati

5、ons have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which imple

6、ment international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purpo

7、rt to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible internati

8、onal/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title

9、 page, pages 2 to 11, and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-8 NORME EUROPENNE EUROPISCHE NORM October 2001 CENELEC European Committee for

10、Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

11、Ref. No. EN 60191-6-8:2001 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8

12、:2001) Normalisation mcanique des dispositifs semiconducteurs Partie 6-8: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface - Guide de conception pour les botiers plats quadrangulaires en cramique, scellement verre (CEI 60191-6-8:2001) Mech

13、anische Normung von Halbleiterbauelementen Teil 6-8: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Konstruktionsleitfaden fr Glas-Keramik- Quad-Flatpack (G-QFP) (IEC 60191-6-8:2001) This European Standard was approved by CENELEC on 2001-10-01. CENELEC members

14、are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application t

15、o the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has t

16、he same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingd

17、om.Foreword The text of document 47D/438/FDIS, future edition 1 of IEC 60191-6-8, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-8 on 2001-10-01. Th

18、e following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2002-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2004-10-01 Annexes desi

19、gnated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-8:2001 was approved by CENELEC as a European Standard without any modification. _ Page2 EN6019

20、168:2001 BSI16November2001 2 601-19-6 8 IE:C0201(E) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP) 1 Scope and object This

21、 part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP. 2 Normative r

22、eferences The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amend- ments to, or revisions of, any of these publications do not apply. However, parties to agreements based on th

23、is part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid I

24、nternational Standards. IEC 60191 (all parts), Mechanical standardization of semiconductor devices 3 Definitions For the purpose of this part of IEC 60191, the following definition, as well as those given in the other parts of this standard, apply. 3.1 G-QFP glass sealed package with gull-wing forme

25、d terminals which are led out in four directions to mount on PCB surface 4 Numbering of the pins The index area is positioned at the upper left corner of the package body when it is viewed from the seating plane. The terminal that is closest to the index corner is numbered 1, and continued terminals

26、 that count in counter-clockwise directions are numbered 2, 3. Page3 EN6019168:2001 BSI16November2001061-19-6 8 IE:C0201(E) 3 E e Z E Z D H D Z F D Q e r e D l 2 e A b 2 A 2 A 1 L P L A 3 S Seating plane vM P S Figure 3 Figure 2 Terminal position area Figure 1b Figure 1a See figure 3 w M P S y S P I

27、ndex corner Index corner Zone of a visible index on the top face c IEC 1361/01 IEC 1362/01 IEC 1363/01 IEC 1364/01 Page4 EN6019168:2001 BSI16November2001 4 601-19-6 8 IE:C0201(E) Table 1 Group 1: Dimensions appropriate to mounting and interchangeability Limits to be observed Recommended values for t

28、he dimensions Ref. Min. Nom. Max. mm Note a nX 1 n D X 1 n E X 1 AX A max. = 0,5 m 2 m = 3, 4, 5, 6, 7, 8, 9, 10, 11 A1 X X X A1 min 0,00 0,25 A1 nom 0,10 0,40 A1 max 0,25 0,50 A2 X X X A2 min 0,51 1,01 1,51 2,01 2,51 A2 nom 0,76 1,26 1,76 2,26 2,76 A2 max 1,00 1,50 2,00 2,50 3,00 A2 min 3,01 3,51 4

29、,01 4,51 A2 nom 3,26 3,76 4,26 4,76 A2 max 3,50 4,00 4,50 5,00A 3 i X A 3 i = 0,25 b p XXX iei b p min b p nom b p max 1,0 0,35 0,42 0,50 0,8 0,30 0,37 0,45 0,65 0,25 0,32 0,40 0,5 0,15 0,22 0,30 0,4 0,15 0,18 0,22 DX E nom D nom 4 5 K 0,8 K = 2, 4 EX 6 K 0,8 m = 3, 4, 5 7 K 0,8 Regular square 20 +

30、4m 0,8 Rectangular 7 K 0,8 5 2K 0,8 E nom D nom Square Rectangular 9,2 9,2 13,2 19,2 11,2 11,2 27,2 39,2 13,2 13,2 19,2 19,2 23,2 23,2 27,2 27,2 31,2 31,2 35,2 35,2 39,2 39,2 aSee notes on pages 9 and 10. Page5 EN6019168:2001 BSI16November2001061-19-6 8 IE:C0201(E) 5 Table 1 (continued) Limits to be

31、 observed Recommended values for the dimensions Ref. Min. Nom. Max. mm Note a iei X iei nom. = 1,0; 0,8; 0,65; 0,5; 0,4 5 H D XXX H D nom = D nom+ 2L nom H D min = D nom 0,2 H D max = D nom+ 0,2 H E XXX H E nom = E nom+ 2L nom H E min = H Enom 0,2 H E max = H Enom+ 0,2 LXLnom = 1,8; 2,1; 2,4 L p XXX

32、 Lnom L p min L p nom L p max 1,8, 2,1 0,45 0,60 0,75 2,4 0,73 0,88 1,03 vXv max= 0,3 6 wX iei wmax iei wmax 6 1,0 0,20 0,5 0,10 0,8 0,16 0,4 0,10 0,65 0,13 yXy max= 0,10 XXX min= 0 nom= 3 max= 10 aSee notes on pages 9 and 10. Page6 EN6019168:2001 BSI16November2001 6 601-19-6 8 IE:C0201(E) Table 2 G

33、roup 2: Dimensions appropriate to mounting and gauging Limits to be observed Recommended values for the dimensions Ref. Min. Nom. Max. mm Note a b 2 X b 2 max= b p max+ W max iei b 2 max 1,00 0,70 0,80 0,61 0,65 0,53 0,50 0,40 0,40 0,32 iei X iei nom= 1,0; 0,8; 0,65; 0,5; 0,4 5e D i X e D i = H Dnom

34、 L pnome E i X e E i = H Enom L pnom I 2 X I 2 max= L p max+ V max Lnom I 2 max 1,8; 2,1 1,05 2,4 1,33 aSee notes on pages 9 and 10 Page7 EN6019168:2001 BSI16November2001061-19-6 8 IE:C0201(E) 7 Table 3 Group 3: Dimensions appropriate to automated handling Limits to be observed Recommended values fo

35、r the dimensions Ref. Min. Nom. Max. mm Note A 2 XXX A 2min 0,51 1,01 1,51 2,01 2,51 A 2nom 0,76 1,26 1,76 2,26 2,76 A 2max 1,00 1,50 2,00 2,50 3,00 A 2min 3,01 3,51 4,01 4,51 A 2nom 3,26 3,76 4,26 4,76 A 2max 3,50 4,00 4,50 5,00 DX X D min= D nom 0,3 D max= D nom+ 0,3 EX X E min= E nom 0,3 E max= E

36、 nom+ 0,3 k X No definition Q X No definition X = 45 Table 4 Group 4: Dimensions for information only Limits to be observed Recommended values for the dimensions Ref. Min. Nom. Max. mm Note a cX X iei c min c max 7 iei 0,65 0,12 0,23 iei 0,50 0,10 0,20 Z D XX Z Dnom= (D nom (n D 1) iei ) / 2 8 Z Dma

37、x= (D max (n D 1) iei ) / 2 Z E XX Z Enom= (E nom (n E 1) iei ) / 2 8 Z Emax= (E max (n E 1) iei ) / 2 aSee notes on pages 9 and 10. Page8 EN6019168:2001 BSI16November2001 8 601-19-6 8 IE:C0201(E) NOTE 1 The relation between the package body size and the maximum number of terminals will be as shown

38、in the following table. a) Regular square shape series E D* n nom(n Dnom= n Enom= n nom/ 4) iei 1,00 0,80 0,65 0,50 0,40 10 10 36 44 52 64 80 12 12 48 64 80 100 14 14 52 64 80 100 120 20 20 76 88 112 144 176 24 24 176 216 28 28 128 160 208 256 32 32 184 240 296 36 36 272 336 40 40 232 304 376 b) Rec

39、tangular shape series E D a n nom(n Dnom , n E nom ) iei 1,00 0,80 0,65 0,50 0,40 14 20 64 80 100 (13, 19) (16, 24) (20,30) 28 40 256 (52,76) aThe E, D values shown in this table indicate integral numbers (as shown) minus 0,8 mm. NOTE 2 The values stipulated by the mathematical expression must be ap

40、plied to the individual overall dimensional standards. NOTE 3 The following values are recommended for the thickness of the ceramic excluding the sealing glass. Base 1,27 Cap 1,27 Frame 0,76 Lid 0,76 Cap Base Base Frame Lid Lead frame IEC 1365/01 Page9 EN6019168:2001 BSI16November2001061-19-6 8 IE:C

41、0201(E) 9 NOTE 4 Seal mismatching and glass protrusion are not included. NOTE 5 Stipulates the true geometrical position. NOTE 6 The values v, w are stipulated as v or w M without A, B as a datum line, and eliminate datum A and datum B from figure 1a. The reasons are as follows. a) Generally, in the

42、 case of ceramic packages, a tolerance of the outside dimensions is wider than that of plastic moulded package. Therefore, the lead true position based on ceramic body dimension is a rather large value like 0,6 mm, generally. These large values v and w are not useful for users. b) E and D, the packa

43、ge outside dimension of G-QFP, do not include seal mismatching and glass protrusion according to note 4, so it is meaningless to specify E and D as datum planes. c) In the semiconductor industry, QFP type packages are handled not by package body, but by the tip of the lead frame, in general. For ins

44、tance, QFP is handled in electrical tests or mounting onto printed circuit board by lead frame as a base point, not by package body, especially for a high-pin-count/fine-pitch QFP. Therefore, it is not so significant to stipulate package width/length as a datum line. NOTE 7 These values include the

45、thickness of finish plating. NOTE 8 Since in the G-QFP the part corresponding to this dimension is not the outermost side of the package, the seal mismatching and the glass protrusion are not included, and only the standard values are stipulated. NOTE 9 The pin layout is determined as follows. E D i

46、ei Terminal layout 10 10 10 10 14 14 12 12 1,00 0,80 0,65 0,50 0,40 The package centre coincides with the terminal centre. e 2 e 2 Other combinations of E D and iei besides the afore- mentioned ones The terminal centre is deviated by iei /2 from the package centre. _ IEC 1366/01 IEC 1367/01 Page10 E

47、N6019168:2001 BSI16November2001Annex ZA (normative) Normative references to international publications with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the app

48、ropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191 Series Mechanical standardizati