BS EN 60297-3-109-2016 Mechanical structures for electrical and electronic equipment Dimensions of mechanical structures of the 482 6 mm (19 in) series Dimensions of chassis for em.pdf

1、BSI Standards PublicationMechanical structures for electrical and electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) seriesPart 3-109: Dimensions of chassis for embedded computing devicesBS EN 60297-3-109:2016National forewordThis British Standard is the UK implementati

2、on of EN 60297-3-109:2016.It is identical to IEC 60297-3-109:2015.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/48, Electromechanical components and mechanical structures for electronic equipment.A list of organizations represented on this committee can be obtained

3、onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 86522 0ICS 31.240Compliance with a Britis

4、h Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 March 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60297-3-109:2016EUROPEAN STANDARD NORME

5、 EUROPENNE EUROPISCHE NORM EN 60297-3-109 February 2016 ICS 31.240 English Version Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (IEC 60297-3-109:20

6、15) Structures mcaniques pour quipements lectriques et lectroniques - Dimensions des structures mcaniques de la srie 482,6 mm (19 pouces) - Partie 3-109: Dimensions des chssis pour dispositifs informatiques intgrs (IEC 60297-3-109:2015) Mechanische Bauweisen fr elektronische Einrichtungen - Mae der

7、482,6-mm-(19-in-)Bauweise - Teil 3-109: Mae von Einschben fr eingebettete Datenverarbeitung (IEC 60297-3-109:2015) This European Standard was approved by CENELEC on 2015-12-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving thi

8、s European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three offici

9、al versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechni

10、cal committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Sl

11、ovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016

12、CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 60297-3-109:2016 E BS EN 60297-3-109:2016EN 60297-3-109:2016 2 European foreword The text of document 48D/598/FDIS, future edition 1 of IEC 60297-3-109, prepared by SC 48D “Mechanical

13、structures for electrical and electronic equipment” of IEC/TC 48 “Electrical connectors and mechanical structures for electrical and electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60297-3-109:2016. The following dates are fixed: latest date by whic

14、h the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-09-28 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-12-28 Attention is drawn to the possibility that some o

15、f the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60297-3-109:2015 was approved by CENELEC as a European Standard without a

16、ny modification. BS EN 60297-3-109:2016EN 60297-3-109:2016 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its

17、application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD appl

18、ies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60297-3-100 - Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in)

19、series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets EN 60297-3-100 - IEC 60529 - Degrees of protection provided by enclosures (IP Code) EN 60529 - IEC 61587-1 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1

20、 Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions EN 61587-1 - IEC 61587-3 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabin

21、ets and subracks EN 61587-3 - IEC 61587-5 - Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks, and plug-in units EN 61587-5 - BS EN 60297-3-109:2016 2 IEC 60297-3-109:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1

22、 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 Arrangement overview . 7 5 Chassis dimensions . 8 Annex A (normative) Printed board dimensions 11 A.1 Illustrative figure . 11 A.2 Maximum printed board dimensions 11 Annex B (normative) Printed board dimensions in conjunction with fan co

23、oling 13 B.1 Illustrative figure . 13 B.2 Maximum printed board dimensions in conjunction with fan cooling 13 Annex C (normative) Chassis mounting options . 16 C.1 Type A: Example for 19” cabinet mounting option . 16 C.2 Type B: Example for 19” cabinet mounting option . 16 C.3 Type C: Chassis mounti

24、ng example 17 C.4 Type D: Chassis mounting option 17 Annex D (normative) Environmental tests 19 D.1 Static and dynamic load test . 19 D.2 Seismic test 19 D.3 Electromagnetic shielding performance test 19 D.4 Degrees of protection 19 Annex E (informative) Extended chassis dimensions 20 E.1 General .

25、20 E.2 Illustrative figure . 20 E.3 Extended chassis dimensions . 20 Figure 1 Three dimensional grid for chassis and associated printed boards . 6 Figure 2 Chassis arrangement of an embedded application . 8 Figure 3 Chassis front dimensions . 8 Figure 4 Chassis depth dimensions 8 Figure A.1 Chassis

26、with printed board 11 Figure A.2 Printed board dimensions . 11 Figure B.1 Chassis with fan cooling . 13 Figure B.2 Printed board dimensions in conjunction with fan cooling, example (fan depth = 28,0 mm) 14 Figure C.1 Type A: Chassis mounting in a 19” cabinet . 16 Figure C.2 Type B: Chassis mounting

27、in a 19” cabinet . 17 Figure C.3 Type C: Vertical flange mounting 17 Figure C.4 Type D: Horizontal flange mounting 18 Figure E.1 Extended chassis example 20 Figure E.2 Extended chassis front dimensions 20 BS EN 60297-3-109:2016IEC 60297-3-109:2015 IEC 2015 3 Figure E.3 Extended chassis depth dimensi

28、ons. 21 Table 1 Chassis height dimensions 9 Table 2 Chassis width dimensions . 9 Table 3 Chassis depth dimensions . 10 Table A.1 Printed board width dimensions . 12 Table A.2 Printed board depth dimensions . 12 Table B.1 Printed board width dimensions in conjunction with fan cooling, example (fan de

29、pth=28,0 mm) . 15 BS EN 60297-3-109:2016 4 IEC 60297-3-109:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRICAL AND ELECTRONIC EQUIPMENT DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 mm (19 in) SERIES Part 3-109: Dimensions of chassis for embedded computi

30、ng devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardiza

31、tion in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is

32、entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the In

33、ternational Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects sin

34、ce each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content

35、 of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible

36、in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity a

37、ssessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, e

38、mployees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of

39、 the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to t

40、he possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60297-3-109 has been prepared by subcommittee 48D: Mechanical structures for electrical an

41、d electronic equipment, of IEC technical committee 48: Electrical connectors and mechanical structures for electrical and electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 48D/598/FDIS 48D/602/RVD Full information on the voting for the approva

42、l of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 60297-3-109:2016IEC 60297-3-109:2015 IEC 2015 5 A list of all parts in the IEC 60297-3 series, published under the general

43、title Mechanical structures for electrical and electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) series, can be found on the IEC website. Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will b

44、e updated at the time of the next edition. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be

45、reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 60297-3-109:2016 6 IEC 60297-3-109:2015 IEC 2015 INTRODUCTION The main applications for embedded computing devices are in machine control, medical, transportation, aerospace and communication environments. For such applications

46、 single board computers are typically used. In order to meet the different environmental conditions and handling requirements, single board computers require for mechanical, thermal and environmental protection by means of appropriate chassis designs. These devices currently reflect a very fragmente

47、d situation in the view of any existing mechanical structures dimensional standard. Due to the lack of standardization the individual solutions are realized with proprietary dimensions. The rapidly growing market for single board computing devices calls for dimensional coordination of chassis and as

48、sociated printed boards, in order to replace proprietary solutions. This standard will establish a three dimensional grid of 44,45 mm (1,75 in) for chassis and the associated printed boards, which meets best the most frequent dimensional environment of the IEC 60297 series. Once this standard is est

49、ablished, the design and manufacturing of embedded computing solutions will gain significant cost efficiency. Figure 1 Three dimensional grid for chassis and associated printed boards IEC nx44,45 mmn x 44,45 mm n x 44,45 mm BS EN 60297-3-109:2016IEC 60297-3-109:2015 IEC 2015 7 MECHANICAL STRUCTURES FOR ELECTRICAL AND ELECTRONIC EQUIPMENT DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 mm (19 in) SERIES Part 3-109: Dimensions of cha