1、BSI Standards PublicationSpecifications for particular types of winding wiresPart 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layerBS EN 60317-37:2014National forewordThis British Standard is the UK implementation of EN 60317-37:2014. It isidentical to IEC 60317-37:2013
2、. It supersedes BS EN 60317-37:1995 which iswithdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee GEL/55, Winding wires.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all th
3、e necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 75754 9ICS 29.060.10Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standa
4、rd was published under the authority of theStandards Policy and Strategy Committee on 28 February 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60317-37:2014EUROPEAN STANDARD EN 60317-37 NORME EUROPENNE EUROPISCHE NORM February 2014CENELEC European Commit
5、tee for Electrotechnical StandardizationComit Europen de Normalisation ElectrotechniqueEuropisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CEN
6、ELEC members. Ref. No. EN 60317-37:2014 E ICS 29.060.10 Supersedes EN 60317-37:1994 + A1:1998 + A2:2000 English version Specifications for particular types of winding wires - Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer (IEC 60317-37:2013) Spcifications pour t
7、ypes particuliers defils de bobinage - Partie 37: Fil de section circulaire encuivre maill avec polyesterimide, classe180, avec une couche adhrente (CEI 60317-37:2013) Technische Lieferbedingungen frbestimmte Typen von Wickeldrhten - Teil 37: Runddrhte aus Kupfer,verbackbar, lackisoliert mit Polyest
8、er oderPolyesterimid, Klasse 180 (IEC 60317-37:2013) This European Standard was approved by CENELEC on 2013-11-18. CENELEC members are bound to complywith the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standardthe status of a national standard without an
9、y alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any otherlang
10、uage made by translation under the responsibility of a CENELEC member into its own language and notifiedto the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,the C
11、zech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Ki
12、ngdom. Foreword The text of document 55/1418/FDIS, future edition 2 of IEC 60317-37, prepared by IEC/TC 55 “Winding wires“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60317-37:2014. The following dates are fixed: latest date by which the document has to be implemente
13、d at national level by publication of an identical national standard or by endorsement (dop) 2014-08-18 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-11-18 This document supersedes EN 60317-37:1994. EN 60317-37:2014 includes the following s
14、ignificant technical changes with respect to EN 60317-37:1994: new 3.2.2 containing general notes on winding wire, formerly a part of the scope; revision to references to EN 60317-0-1:2014 to clarify that their application is normative; new Clause 23, Pin hole test. The numbering of clauses in this
15、standard is not continuous from Clauses 20 and 30 in order to reserve space for possible future wire requirements prior to those for wire packaging. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be h
16、eld responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60317-37:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the
17、standards indicated: IEC 60264 Series NOTE Harmonized as EN 60264 Series (not modified). IEC 60317 Series NOTE Harmonized as EN 60317 Series (not modified). IEC 60851 Series NOTE Harmonized as EN 60851 Series (not modified). BS EN 60317-37:2014 EN 60317-37:2014Annex ZA (normative) Normative referenc
18、es to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the lates
19、t edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60317-0-1 2013 Specifications for particular types of windi
20、ng wires - Part 0-1: General requirements - Enamelled round copper wire EN 60317-0-1 2014 BS EN 60317-37:2014 EN 60317-37:2014 2 60317-37 IEC:2013 CONTENTS INTRODUCTION . 5 1 Scope . 6 2 Normative references . 6 3 Terms, definitions, general notes and appearance 6 3.1 Terms and definitions 6 3.2 Gen
21、eral notes 6 3.2.1 Methods of test 6 3.2.2 Winding wire 6 3.3 Appearance . 7 4 Dimensions 7 5 Electrical resistance . 7 6 Elongation 7 7 Springiness 7 8 Flexibility and adherence 7 9 Heat shock . 7 10 Cut-through 7 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and includ
22、ing 1,600 mm) . 7 12 Resistance to solvents 8 13 Breakdown voltage . 8 14 Continuity of insulation . 8 15 Temperature index . 8 16 Resistance to refrigerants . 8 17 Solderability . 9 18 Heat or solvent bonding 9 18.1 Heat bonding . 9 18.1.1 Heat bonding strength of a helical coil . 9 18.1.2 Bond str
23、ength on a twisted coil 10 18.2 Solvent bonding 11 19 Dielectric dissipation factor . 11 20 Resistance to transformer oil 11 21 Loss of mass 11 23 Pin hole test . 11 30 Packaging 11 Bibliography 12 Table 1 Resistance to abrasion 8 Table 2 Loads 10 BS EN 60317-37:2014 EN 60317-37:201460317-37 IEC:201
24、3 5 INTRODUCTION This part of IEC 60317 is one of a series which deals with insulated wires used for windings in electrical equipment. The series has three groups describing: 1) Winding wires Test methods (IEC 60851); 2) Specifications for particular types of winding wires (IEC 60317); 3) Packaging
25、of winding wires (IEC 60264). BS EN 60317-37:2014 EN 60317-37:2014 6 60317-37 IEC:2013 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIRES Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer 1 Scope This part of IEC 60317 specifies the requirements of enamelled roun
26、d copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a th
27、ermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this part is: Grade 1B: 0,020 mm up to and including 1,600 mm
28、; Grade 2B: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated re
29、ferences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60317-0-1:2013, Specifications for particular types of winding wires Part 0-1: General requirements Enamelled round copper wire 3 Terms, definitions
30、, general notes and appearance 3.1 Terms and definitions Subclause 3.1 of IEC 60317-0-1:2013 applies. 3.2 General notes 3.2.1 Methods of test Subclause 3.2.1 of IEC 60317-0-1:2013 applies. In case of inconsistencies between IEC 60317-0-1:2013 and this part of IEC 60317, the latter shall prevail. 3.2
31、.2 Winding wire Class 180 is a thermal class that requires a minimum temperature index of 180 and a heat shock temperature of at least 200 C. The temperature in degrees Celsius corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and thi
32、s will depend on many factors, including the type of equipment involved. BS EN 60317-37:2014 EN 60317-37:201460317-37 IEC:2013 7 3.3 Appearance Subclause 3.3 IEC 60317-0-1:2013 applies. 4 Dimensions Clause 4 of IEC 60317-0-1:2013 applies. 5 Electrical resistance Clause 5 of IEC 60317-0-1:2013 applie
33、s. 6 Elongation Clause 6 of IEC 60317-0-1:2013 applies. 7 Springiness Clause 7 of IEC 60317-0-1:2013 applies. 8 Flexibility and adherence Clause 8 of IEC 60317-0-1:2013 applies. For 8.4, the constant K used for the calculation of the number of revolutions for the peel test shall be 110 mm. 9 Heat sh
34、ock Clause 9 of IEC 60317-0-1:2013 applies. The minimum heat shock temperature shall be 200 C. 10 Cut-through No failure shall occur within 2 min at 300 C. 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 1,600 mm) The wire shall meet the requirements given in
35、 Table 1. For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken. BS EN 60317-37:2014 EN 60317-37:2014 8 60317-37 IEC:2013 Table 1 Resistance to abrasion Nominal conductor diameter Grade 1B Grade 2B Minimum average force to failure Minimu
36、m force to failure of each measurement Minimum average force to failure Minimum force to failure of each measurement mm N N N N 0,250 2,85 2,45 4,70 4,00 0,280 3,10 2,60 5,05 4,30 0,315 3,35 2,80 5,45 4,60 0,355 3,60 3,05 5,85 4,95 0,400 3,85 3,25 6,25 5,30 0,450 4,15 3,50 6,75 5,70 0,500 4,45 3,75
37、7,20 6,10 0,560 4,75 4,05 7,70 6,50 0,630 5,10 4,35 8,25 7,00 0,710 5,45 4,65 8,85 7,50 0,800 5,85 4,95 9,50 8,05 0,900 6,30 5,35 10,2 8,60 1,000 6,75 5,75 10,9 9,20 1,120 7,35 6,20 11,6 9,80 1,250 7,90 6,70 12,5 10,5 1,400 8,50 7,20 13,3 11,3 1,600 9,20 7,80 14,3 12,1 12 Resistance to solvents Test
38、 inappropriate. 13 Breakdown voltage Clause 13 of IEC 60317-0-1:2013 applies. The elevated temperature shall be 180 C. 14 Continuity of insulation Clause 14 of IEC 60317-0-1:2013 applies. 15 Temperature index Clause 15 of IEC 60317-0-1:2013 applies. The minimum temperature index shall be 180. 16 Res
39、istance to refrigerants Test inappropriate. BS EN 60317-37:2014 EN 60317-37:201460317-37 IEC:2013 9 17 Solderability Test inappropriate. 18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil 18.1.1.1 At room temperature The specimens shall be prepared according
40、to the test method, and the temperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (200 2) C and the suggested temperature for aromatic polyamide bonding enamel
41、is (230 2) C. Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate. 18.1.1.2 At elevated temperature The specimens shall be prepared and shall be conditioned as described
42、in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (155 2) C and the suggested temperature for aromatic polyamide bond-ing enamel is (170 2) C. Resu
43、lts: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate. BS EN 60317-37:2014 EN 60317-37:2014 10 60317-37 IEC:2013 Table 2 Loads Nominal conductor diameter mm Load N Over Up to a
44、nd including Room temperature Elevated temperature 0,050 aa0,050 0,071 0,05 0,04 0,071 0,100 0,08 0,06 0,100 0,160 0,12 0,08 0,160 0,200 0,25 0,19 0,200 0,315 0,35 0,25 0,315 0,400 0,70 0,55 0,400 0,500 1,10 0,80 0,500 0,630 1,60 1,20 0,630 0,710 2,20 1,70 0,710 0,800 2,80 2,10 0,800 0,900 3,40 2,60
45、 0,900 1,000 4,20 3,20 1,000 1,120 5,00 3,80 1,120 1,250 5,80 4,40 1,250 1,400 6,50 4,90 1,400 1,600 8,50 6,40 aFor nominal conductor diameters up to and including 0,050 mm, the test method and requirements shall be agreed between purchaser and supplier. 18.1.2 Bond strength on a twisted coil 18.1.2
46、.1 General This test shall be considered only as a special test and is applicable to the diameter 0,315 mm. 18.1.2.2 At room temperature When preparing a test sample of diameter 0,315 mm according to the test method, the time shall be 30 s and the current shall be fixed as agreed between purchaser a
47、nd supplier. The suggested value for polyamide bonding enamel is (2,7 0,1) A and the suggested value for aromatic polyamide bonding enamel is (3,0 0,1) A. Results: when testing the samples according to the test method, under the action of the deflection force of 100 N, the sample shall not break. 18
48、.1.2.3 At elevated temperature The samples of diameter 0,315 mm shall be prepared according to the test method, using the parameters listed in 18.1.2.2 and shall then be conditioned as described in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier. The
49、 suggested temperature for polyamide bonding enamel is (155 2) C and the suggested temperature for aromatic polyamide bonding enamel is (170 2) C. BS EN 60317-37:2014 EN 60317-37:201460317-37 IEC:2013 11 Results: when testing the samples according to the test method, under the action of the deflection force of 10 N, the sample shall not break. 18.2 Solvent bonding Test required but not yet under consideration. 19 Dielectric dissipation factor Test inappropriate. 20
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