BS EN 60512-12-1-2006 Connectors for electronic equipment - Tests and measurements - Soldering tests - Test 12a - Solderability wetting solder bath method《电子设备连接器 试验和测量 焊接试验 试验12a .pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath methodThe Eur

2、opean Standard EN 60512-12-1:2006 has the status of a British StandardICS 31.220.10Connectors for electronic equipment Tests and BRITISH STANDARDBS EN60512-12-1:2006BS EN 60512-12-1:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 June

3、2006 BSI 2006ISBN 0 580 48428 9Cross-referencesThe British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of t

4、he BSI Electronic Catalogue or of British Standards Online.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations.Summary

5、of pagesThis document comprises a front cover, an inside front cover, the EN title page, pages 2 to 6, an inside back cover and a back cover.The BSI copyright notice displayed in this document indicates when the document was last issued.Amendments issued since publicationAmd. No. Date CommentsA list

6、 of organizations represented on this committee can be obtained on request to its secretary. present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep UK interests informed; monitor related international and European developmen

7、ts and promulgate them in the UK.National forewordThis British Standard is the official English language version of EN 60512-12-1:2006. It is identical with IEC 60512-12-1:2006. The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mech

8、anical structures for electronic equipment, which has the responsibility to: aid enquirers to understand the text;EUROPEAN STANDARD EN 60512-12-1 NORME EUROPENNE EUROPISCHE NORM May 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique E

9、uropisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60512-12-1:2006 E ICS 31.220.10 English version Connectors for electro

10、nic equipment - Tests and measurements Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006) Connecteurs pour quipements lectroniques - Essais et mesures Partie 12-1: Essais de soudure - Essai 12a: Soudabilit, mouillage, mthode du bain dalliage (CEI

11、60512-12-1:2006) Steckverbinder fr elektronische Einrichtungen - Mess- und Prfverfahren Teil 12-1: Prfungen der Ltbarkeit - Prfung 12a: Ltbarkeit, Ltbadverfahren (IEC 60512-12-1:2006) This European Standard was approved by CENELEC on 2006-04-01. CENELEC members are bound to comply with the CEN/CENEL

12、EC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CE

13、NELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official version

14、s. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, S

15、lovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 48B/1604/FDIS, future edition 1 of IEC 60512-12-1, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC

16、 parallel vote and was approved by CENELEC as EN 60512-12-1 on 2006-04-01. This standard is to be read in conjunction with EN 60512-1 and EN 60512-1-100 which explains the structure of the EN 60512 series. The following dates were fixed: latest date by which the EN has to be implemented at national

17、level by publication of an identical national standard or by endorsement (dop) 2007-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-04-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 6051

18、2-12-1:2006 was approved by CENELEC as a European Standard without any modification. _ EN 60512-12-1:2006 2 3 EN 60512-12-1:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT TESTS AND MEASUREMENTS Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method 1 Scope and object This part of

19、IEC 60512, when required by the detail specification, is used for testing connectors within the scope of technical committee 48. They may also be used for similar devices when specified in a detail specification. The object of this test is to detail a standard test method to assess the solderability

20、 of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applie

21、s. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60512-1-1, Connectors for electronic equipment Tests and measurements Part 1-1: General examination Test 1a: Visual examination IEC 60068-2-20:1979, Environmental testing Part 2: Tests Te

22、st T: Soldering IEC 60068-2-58, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) 3 Preparations A solder bath at 235 C, as described in 4.6 of IEC 60068-2-20, shall be pr

23、epared. Non-activated flux as specified in Appendix C of IEC 60068-2-20 shall be provided. Current practice may require a higher test temperature, for example, 245 C, in which case this shall be stated in the applicable detail specification. Further, the development of lead-free solder will necessit

24、ate the use of higher temperature (see IEC 60068-2-58). If required by the detail specification, a thermal screen, as described in 4.6.3 of IEC 60068-2-20, shall be provided. EN 60512-12-1:2006 4 3.1 Preparation of specimen The specimen shall consist of a connector with its terminations. Unless othe

25、rwise specified in the detail specification, a screen of thermally insulating material, as specified in 4.6.3 of IEC 60068-2-20, shall be used. Unless otherwise specified in the detail specification, the terminations shall not be cleaned or degreased prior to the application of the solderability tes

26、t. NOTE Care should be taken not to touch or otherwise contaminate the terminations to be tested. 3.2 Conditioning If accelerated ageing before testing solderability is to be applied, one of the ageing pro-cedures detailed in 4.5 of IEC 60068-2-20 shall be prescribed in the detail specification. An

27、ageing time of 16 h at 155 C (method 3 according to IEC 60068-2-20) is the preferred requirement. 4 Method 4.1 Procedure The test shall be performed in accordance with Test Ta, 4.6, of IEC 60068-2-20, method 1, solder bath, at 235 C 5 C. Where a thermal screen is to be used, the terminations shall b

28、e immersed in such a way that the thermal screen nearly touches the surface of the solder bath. An immersion time of 2 s 0,5 s is the preferred requirement. If no screen is to be used, this shall be specified in the detail specification, as shall the depth of immersion to be used. 4.2 Measurements 4

29、.2.1 Initial measurements Visual examination according to IEC 60512-1-1 shall be performed. There shall be no defects, which would impair the normal functioning of the connector. 4.2.2 Final measurements Visual examination according to IEC 60512-1-1 shall be performed. The soldered surface(s) shall

30、be examined at 10 magnification. A surface shall be considered solderable if 95 % of the solderable area is covered with a smooth, bright, uniform coating of adherent solder. The remaining 5 % of the surface may show pinholes, voids, grainy surface or de-wetting areas, provided such defects are not

31、concentrated in one area. It follows that, if more than 5 % of the relevant surface(s) shows defects as described above, the surface is not considered solderable. NOTE These requirements are not in conflict with IEC 60068-2-20 but are additional and clarifying. 5 EN 60512-12-1:2006 5 Details to be s

32、pecified When this test is required by a detail specification, the following information shall be given therein: a) the areas of the specimen that are to be considered as relevant for solderability testing; b) pre-ageing requirements; c) thermal screen and/or immersion depth to be used; d) if the pr

33、eferred requirements, as detailed in 3.2 and 4.1, are not to be used, other requirements shall be given in the detail specification; e) any deviation from the above test method. _ Annex ZA (normative) Normative references to international publications with their corresponding European publications T

34、he following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been mo

35、dified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60512-1-1 1)Connectors for electronic equipment - Tests and measurements Part 1-1: General examination - Test 1a: Visual examination EN 60512-1-1 20022)IEC 60068-2-20 1979 Basic envi

36、ronmental testing procedures Part 2: Tests - Test T: Soldering HD 323.2.20 S33) 1988 IEC 60068-2-58 1)Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 + c

37、orr. December 20042)2004 1)Undated reference. 2)Valid edition at date of issue. 3) HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20. EN 60512-12-1:2006 6 blankBS ENBSI389 Chiswick High RoadLondonW4 4AL60512-12-1:2006BSI British Standards InstitutionBSI is the independent national body responsible f

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