BS EN 60749-16-2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)《半导体器件 机械和气候试验方法 粒子冲击噪音探测(PIND)》.pdf

1、BRITISH STANDARD BS EN 60749-16:2003 Incorporating Corrigendum No. 1 Semiconductor devices Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND) The European Standard EN 60749-16:2003 has the status of a British Standard ICS 31.080.01 BS EN 60749-16:2003 This British S

2、tandard was published under the authority of the Standards Policy and Strategy Committee on 19 June 2003 BSI 24 June 2004 ISBN 0 580 42062 0 National foreword This British Standard is the official English language version of EN 60749-16:2003. It is identical with IEC 60749-16:2003. The UK participat

3、ion in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European pub

4、lications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the n

5、ecessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the i

6、nterpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 7 and a back cover. The BSI

7、copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date Comments 15224 Corrigendum No. 1 24 June 2004 Changes to National forewordEUROPEAN STANDARD EN 60749-16 NORME EUROPENNE EUROPISCHE NORM April 2003 CENELEC European

8、 Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CE

9、NELEC members. Ref. No. EN 60749-16:2003 E ICS 31.080.01 English version Semiconductor devices - Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques Partie 16: Dtection de brui

10、t dimpact de particules (PIND) (CEI 60749-16:2003) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren Teil 16: Nachweis des Teilchen- Aufprallgerusches (PIND) (IEC 60749-16:2003) This European Standard was approved by CENELEC on 2003-03-01. CENELEC members are bound to comply with the

11、CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or

12、to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the officia

13、l versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. EN 647

14、09-6102:30 - - 2 Foreword The text of document 47/1662/FDIS, future edition 1 of IEC 60749-16, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-16 on 2003-03-01. The following dates were fixed: latest date by which t

15、he EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-12-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2006-03-01 _ Endorsement notice The text of the International Standard IEC

16、60749-16:2003 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1:2001 (not modified). _ Page2 EN6074916:2003067-9416 IE:C2003

17、3 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 16: Particle impact noise detection (PIND) 1 Scope The purpose of this part of IEC 60749 is to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder ball

18、s (prills). The test of particle impact noise detection is classified as non-destructive. 2 Terms and definitions For the purposes of this part of IEC 60749, the following definitions apply. 2.1 run test of all the individual devices of the lot under test which passed the previous run NOTE The first

19、 run includes all the devices of the lot under test, the subsequent runs will include only the devices which passed the previous run(s) and will exclude all the devices which failed. 3 General remarks An acoustic transducer is attached to the test specimen via an acoustic coupling medium and its out

20、put fed via a suitable amplifier to an audio/visual monitoring system. The test specimen is subjected to sinusoidal vibration and a series of controlled mechanical shocks by a suitable mechanical shaker and shock mechanism/impact tool. As a result of this mechanical stimulation, loose particles with

21、in the cavity of the test specimen will impact the internal walls of the cavity, producing noise which will be detected by the acoustic transducer and indicated by the monitoring system. 4 Equipment The following equipment and/or materials (or their equivalents) is required: a) Vibration shaker (sin

22、usoidal). Output: 200 m/s 2peak at 40 Hz 250 Hz. b) Mechanical shock mechanism/tool. Shock pulse: 10 000 m/s 2 2 000 m/s 2peak. Main shock duration: 100 s maximum. NOTE 1 The application of vibration and shock is most practical through the use of an integral vibration/shock system (co-test system).

23、Where a co-test system is used the interruption to the vibration source during the mechanical shock should not exceed 250 ms from initiation of the last shock pulse in the sequence; and the duration of this shock test should be measured at the 50 5 % points. Page3 EN6074916:2003067-9416 IE:C2003 4 c

24、) Impact sensor (acoustic transducer - acoustically coupled to the device under test). Peak sensitivity: 77,5 dB 3 dB with respect to 10 V/Pa at a point in the range 150 kHz 160 kHz. d) Impact sensor amplifier (connected to the output of the impact sensor). Gain: 60 dB 2 dB (centred at peak sensitiv

25、ity frequency of the acoustic transducer, in item c) above). Output noise: 10 mV peak maximum. e) Threshold detector (connected to the output of the impact sensor amplifier). Threshold voltage: 20 mV 1 mV peak absolute, reference to system ground and including audio output/oscilloscope output (optio

26、nal). NOTE 2 Total system noise generated by items c), d), and e): 20 mV peak to peak maximum as observed over a period of 3060 s. f) Attachment medium (to provide good acoustic coupling between item c) above and the device under test). Examples of suitable attachment media: water solvent soluble ac

27、oustic couplant, water soluble ultrasonic couplant, double-sided adhesive tape. g) Sensitivity test unit, comprising a d.c. source capable of producing an output of 250 V + 20 % connected to the input of an acoustic transducer (of the same type as in item c) above). 5 Test procedure NOTE ESD precaut

28、ions in accordance with IEC 61340-5-1 should be adopted to protect devices under test. a) Adjust vibration shaker frequency/amplitude to the specified conditions (see Table 1). b) Adjust shock pulse generator for 10 000 m/s 2 2 000 m/s 2peak. c) Verify noise detection equipment operation with the se

29、nsitivity test unit attached to the impact sensor, using the same attachment medium that will be used with the actual devices to be tested. d) Verify system noise is within the specification limits given in item e) of Clause 4. e) Attach the test specimen directly to the shaker with the largest flat

30、 surface centered against the surface of the transducer with the attachment medium. Where more than one large surface exists, attach the thinnest and most uniform thickness surface against the surface of the transducer. Where unusual specimen shapes are encountered, special holding fixtures may be r

31、equired and should be constructed with the following considerations: low mass, high acoustic transmission, full transducer surface contact, no moving parts, suitable for attachment medium mounting. Page4 EN6074916:2003067-9416 IE:C2003 5 f) Start test sequence, of which one cycle comprises the follo

32、wing: 3 pre-test shocks vibration 3 s 1 s 3 shocks vibration 3 s 1 s 3 shocks vibration 3 s 1 s 3 shocks vibration 3 s 1 s accept or reject. g) Measurements each test cycle shall be continuously monitored: the period during the shocks and up to 250 ms after the shocks shall not be included in the fa

33、ilure criteria analysis. 6 Failure criteria Any noise detected by the monitoring system during the measurement period which exceeds the total system noise defined in Item e) of Clause 4 will be noise resulting from particle impact noise and shall therefore constitute a failure. 7 Lot acceptance (for

34、 guidance) Where an inspection lot (or sub-lot) is submitted to a 100 % PIND testing, it is recommended that the test is performed a maximum of five times. When using this regime, PIND prescreening shall not be performed. The lot may be accepted on any of the five runs if the percentage of defective

35、 devices is less than 1 %. All defective devices shall be removed after each run. Lots which do not meet the 1 % PDA 1on the fifth run, or exceed 25 % of the cumulated defectives shall be rejected and resubmission is not allowed. 8 Detail specification The detail specification shall prescribe test c

36、onditions in accordance with Table 1. Table 1 Shaker frequencies Internal cavity height (average a ) mm Frequency Hz 1,00 130 1,01 1,25 120 1,26 1,50 110 1,51 1,75 100 1,76 2,00 90 2,01 2,25 80 2,26 2,50 70 2,50 60 aThe average internal cavity height is measured from the internal package base to the

37、 internal lid or cap surface. 1PDA: Percentage defective allowable. Page5 EN6074916:2003067-9416 IE:C2003 6 9 Summary For each test run (1 to 5 maximum), record the following data: a) Run number (1 to 5 maximum) (see Clause 7). b) Number of devices tested (see Clause 7). c) Number of devices rejecte

38、d (see Clauses 6 and 7). d) Failure percentage of the run (see Clause 7). e) Failure percentage cumulative (total number of failures from the first run up to run number “n” divided by the number of devices submitted to the first run and multiplied by 100) (see Clause 7). Page6 EN6074916:2003067-9416

39、 IE:C2003 7 Bibliography IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements _ Page7 EN6074916:2003BS EN 60749-16:2003 BSI 389 Chiswick High Road London W4 4AL BSI British Standards Institution BSI is the independent nationa

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