BS EN 60749-31-2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)《半导体器件 机械和气候试验方法 塑料包封器件的易燃性(内部感应.pdf

1、BRITISH STANDARD BS EN 60749-31:2003 Semiconductor devices Mechanical and climatic test methods Part 31: Flammability of plastic-encapsulated devices (internally induced) The European Standard EN 60749-31:2003 has the status of a British Standard ICS 31.080.01 BS EN 60749-31:2003 This British Standa

2、rd was published under the authority of the Standards Policy and Strategy Committee on 4 July 2003 BSI 4 July 2003 ISBN 0 580 42200 3 National foreword This British Standard is the official English language version of EN 60749-31:2003. It is identical with IEC 60749-31:2002. It partially supersedes

3、BS EN 60749:1999 which will be withdrawn on 2005-10-01. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-refer

4、ences The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British

5、 Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present t

6、o the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an insid

7、e front cover, the EN title page, pages 2 to 4, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60749-31 NORME EUROPENNE EUROPISCHE NOR

8、M June 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any mea

9、ns reserved worldwide for CENELEC members. Ref. No. EN 60749-31:2003 E ICS 31.080.01 English version Semiconductor devices - Mechanical and climatic test methods Part 31: Flammability of plastic-encapsulated devices (internally induced) (IEC 60749-31:2002) Dispositifs semiconducteurs - Mthodes dessa

10、is mcaniques et climatiques Partie 31: Inflammabilit des dispositifs encapsulation plastique (cas dune cause interne dinflammation) (CEI 60749-31:2002) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren Teil 31: Entflammbarkeit von Bauelementen in Kunststoffgehusen (Selbstentzndung) (I

11、EC 60749-31:2002) This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists an

12、d bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the respon

13、sibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Irel

14、and, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. EN 64709-1302:30 - - 2 Foreword The text of the International Standard IEC 60749-31:2002 was approved by CENELEC as EN 60749-31 on 2002-09-24. The text of this International Standar

15、d was reproduced from IEC 60749:1996, chapter 4, subclause 1.1 without change. Therefore, it has not been submitted to vote a second time and is still based on document 47/1394/FDIS. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of

16、 an identical national standard or by endorsement (dop) 2004-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-10-01 Each test method governed by this standard and which is part of the series is a stand-alone document, numbered EN 60749-2, EN 6

17、0749-3, etc. The numbering of these test methods is sequential, and there is no relationship between the number and the test method (i.e. no grouping of test methods). The list of these tests will be available in the CENELEC internet site and in the catalogue. Updating of any of the individual test

18、methods is independent of any other part. _ Endorsement notice The text of the International Standard IEC 60749-31:2002 was approved by CENELEC as a European Standard without any modification. _ 2egaP 3002:1394706NEPage2 EN6074931:2003INTRODUCTION Activity within IEC technical committee 47, working

19、group 2, includes the generation, coordination and review of climatic, electrical (of which only ESD, latch-up and electrical conditions for life tests are considered), mechanical test methods, and associated inspection techniques needed to assess the quality and reliability of the design and manufa

20、cture of semiconductor products and processes. Page3 EN6074931:2003SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 31: Flammability of plastic-encapsulated devices (internally induced) 1 Scope and object This part of IEC 60749 is applicable to semiconductor devices (discrete devices

21、and integrated circuits). The object of this test is to determine whether the device ignites due to internal heating caused by excessive overloads. NOTE This test is identical to the test method contained in 1.1 of chapter 4 of IEC 60749 (1996), apart from changes to this clause, the addition of tit

22、les to clauses 2 and 3 and renumbering. 2 Normative references None. 3 Test procedure The device shall be operated in free air without a heat sink and the internal electrical power dissipation slowly increased from the maximum rated value until any of the following occurs: 1) an internal power dissi

23、pation equal to five times the maximum rated power dissipation at 25 C is reached; in this case, the power shall be maintained for a minimum duration of 1 min; or 2) the device becomes either open-circuited or short-circuited, or its resistance increases to such a high value that any further increas

24、e in power dissipation is impracticable; or 3) the device ignites. A device shall constitute a failure only if it smoulders or ignites. _ Page4 EN6074931:2003blankBS EN 60749-31:2003 BSI 389 Chiswick High Road London W4 4AL BSI British Standards Institution BSI is the independent national body respo

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