ImageVerifierCode 换一换
格式:PDF , 页数:38 ,大小:1.24MB ,
资源ID:576554      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-576554.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(BS EN 60917-2-3-2006 Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions fo .pdf)为本站会员(刘芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

BS EN 60917-2-3-2006 Modular order for the development of mechanical structures for electronic equipment practices - Sectional specification - Interface co-ordination dimensions fo .pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58for electronic equipment practices Part 2-3: Sectional specification Interface co-ordination dimens

2、ions for the 25 mm equipment practice Extended detail specification Dimensions for subracks, chassis, backplanes, front panels and plug-in units The European Standard EN 60917-2-3:2006 has the status of a British StandardICS 31.240Modular order for the development of mechanical structures BRITISH ST

3、ANDARDBS EN60917-2-3:2006BS EN 60917-2-3:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 August 2006 BSI 2006ISBN 0 580 48896 9Cross-referencesThe British Standards which implement international or European publications referred to in

4、this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online.This publication does not purport to include all the necessary provisions of a c

5、ontract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations.Summary of pagesThis document comprises a front cover, an inside front cover, the EN title page, pages 2 to 35 and a back cover.The BSI copyright n

6、otice displayed in this document indicates when the document was last issued.Amendments issued since publicationAmd. No. Date CommentsA list of organizations represented on this committee can be obtained on request to its secretary. present to the responsible international/European committee any enq

7、uiries on the interpretation, or proposals for change, and keep UK interests informed; monitor related international and European developments and promulgate them in the UK.National forewordThis British Standard is the official English language version of EN 60917-2-3:2006. It is identical with IEC

8、60917-2-3:2006.The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures for electronic equipment, which has the responsibility to: aid enquirers to understand the text;EUROPEAN STANDARD EN 60917-2-3 NORME EUROPENNE EU

9、ROPISCHE NORM July 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form an

10、d by any means reserved worldwide for CENELEC members. Ref. No. EN 60917-2-3:2006 E ICS 31.240 English version Modular order for the development of mechanical structures for electronic equipment practices Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment

11、practice -Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-3:2006) Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques Partie 2-3: Norme intermdiaire - Dimensions de coordination

12、pour les interfaces des infrastructures au pas de 25 mm - Spcification particulire tendue - Dimensions pour bacs, chssis, fonds de panier, faces avant et blocs enfichables (CEI 60917-2-3:2006) Modulordnung fr die Entwicklung von Bauweisen fr elektronische Einrichtungen Teil 2-3: Strukturnorm Schnitt

13、stellen-Koordinationsmae fr die 25-mm-Bauweise Erweiterte Manorm Mae fr Baugruppentrger, Einschbe, Rckplatten, Frontplatten und steckbare Baugruppen (IEC 60917-2-3:2006) This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Re

14、gulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.

15、This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC mem

16、bers are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain

17、, Sweden, Switzerland and the United Kingdom. Foreword The text of document 48D/338/FDIS, future edition 1 of IEC 60917-2-3, prepared by SC 48D, Mechanical structures for electronic equipment, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitte

18、d to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60917-2-3 on 2006-06-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-03-01 latest date by which t

19、he national standards conflicting with the EN have to be withdrawn (dow) 2009-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60917-2-3:2006 was approved by CENELEC as a European Standard without any modification. _ EN 60917-2-3:2006 2 3 EN 6

20、0917-2-3:2006 CONTENTS INTRODUCTION.5 1 Scope and object7 2 Normative references .7 3 Terms and definitions .8 4 Arrangement overview 8 5 Subrack dimensions for injector/extractor handle of plug-in units .9 5.1 Subrack interface dimensions 9 6 Dimensions of injector/extractor handle for plug-in unit

21、s 11 6.1 Injector/extractor handle interface dimensions11 6.2 Handle-locking function .13 7 Subrack and plug-in units with electromagnetic shielding provision13 7.1 Subrack interface dimensions for electromagnetic shielding provision.13 7.2 Front panel/plug-in unit interface dimensions16 8 Key/codin

22、g system for subrack and plug-in units .17 8.1 Subrack interface dimensions Key/coding system on the plug-in unit guides 18 8.2 Key dimensions Key/coding system on the plug-in unit guides .19 8.3 Programming of key Key/coding system on the plug-in guides .21 8.4 Keying chamber inspection dimensions

23、21 9 Alignment pin and/or electrical contact for front panels and plug-in units22 9.1 Alignment pins and receptacle plates on the subrack horizontal members.23 9.2 Alignment and/or electrical contact pins and receptacles on the subrack plug-in unit guides .24 10 Electrostatic discharge provision for

24、 plug-in units and subracks.26 10.1 ESD contact interface dimensions27 10.2 ESD strip interface dimensions 27 11 Subrack dimensions for rear-mounted plug-in units .31 Annex A Subrack, plug-in unit and backplane dimensions for using metric connectors.32 Annex ZA (normative) Normative references to in

25、ternational publications with their corresponding European publications35 Figure 1 Typical example of large subracks in a wide cabinet, equipped mass volume of copper/optical cables installation.6 Figure 2 Subject for development of extended connector application packaging and key elements of interc

26、onnection between functional plug-in modules via backplane in the future packaging system .6 Figure 3 Arrangement overview8 Figure 4 Subrack interface dimensions, injector/extractor handles for plug-in units 10 Figure 5 Detail X and detail Y, subrack interface dimensions, injection/extraction handle

27、s for plug-in units11 Figure 6 Plug-in units interface dimensions, injection/extraction handle for plug-in units .12 Figure 7 Detail X and detail Y, plug-in interface dimensions, injector/extractor handles for plug-in units13 Figure 8 Subrack interface dimensions, electromagnetic shielding provision

28、s 14 EN 60917-2-3:2006 4 Figure 9 Detail X and detail Y, subrack interface dimensions, electromagnetic shielding provisions 15 Figure 10 Front panel/plug-in unit interface dimensions, electromagnetic shielding provisions.16 Figure 11 Arrangement of key/coding system for plug-in units.17 Figure 12 Su

29、brack interface dimensions Key/coding system on the plug-in unit guides 18 Figure 13 Plug-in unit interface dimensions Key/coding system on the plug-in unit guides 19 Figure 14 Key dimensions and rotated key positions Key/coding system on the plug-in unit guides 20 Figure 15 Programming of keys21 Fi

30、gure 16 Arrangement of alignment pin system for subracks and plug-in units22 Figure 17 Subrack interface dimensions, alignment pins and receptacle plates on the horizontal members.23 Figure 18 Plug-in unit interface dimensions, alignment pins and receptacle plates on the horizontal members.24 Figure

31、 19 Subrack interface dimensions, alignment and/or electrical contact pin receptacles on the plug-in unit guides .25 Figure 20 Plug-in unit interface dimensions, alignment and/or electrical contact pin receptacles on the plug-in unit guides .26 Figure 21 Subrack interface dimensions, ESD contacts on

32、 the plug-in guides27 Figure 22 Plug-in unit interface dimensions, ESD strips on the plug-in boards .28 Figure 23 Subrack dimensions for rear mounted plug-in units .31 Figure A.1 Subrack, plug-in unit and backplane dimensions for using 2,5 mm metric connectors in accordance with IEC 61076-4-100 .32

33、Figure A.2 Subrack, plug-in unit and backplane dimensions for using 2 mm metric connectors in accordance with IEC 61076-4-101 .33 Figure A.3 Subrack, plug-in unit and backplane dimensions for using 2 mm metric connectors in accordance with IEC 61076-4-104 .34 Table 1 Inspection dimensions of subrack

34、 and plug-in unit keying chambers .21 Table 2 Dimensions of subracks and plug-in units based on IEC 60917-2-2.29 Table 3 Dimensions of subracks and boards for rear-mounted plug-in units.31 5 EN 60917-2-3:2006 INTRODUCTION The dimensions in the detail specification for the 25 mm equipment practice st

35、andard are laid down in the IEC 60917-2 series. Significant progress in electronics circuitry, with increasing signal speed and the demand for high availability of the electronics systems, has made an impact on the structural parts of the equipment, as specified in IEC 60917-2-2. a) Considerations o

36、n the general tendency of the enclosure system At the moment, the general tendencies of the enclosure system for telecom/IT equipment application and associated application are considered to be: the changing form of conventional centralized networking for telecommunication to flexible distributed ne

37、tworking to realize ubiquitous communication and computing environment by broad-band/IP and photonics-networking-based technology; flexible configuration of networking equipment from the open market is requested; a scalable and high-performance packaging/enclosure system is requested for new network

38、ing equipment; in addition, such a packaging/enclosure system will be widely applied for general electronic equipment, because IP networking technology is becoming one of the common interfaces for all of industrial systems. Consequently, the following general requirements for the new enclosure syste

39、m arise. Standard-based but various sized networking/IT equipment from the open market should be installed in one cabinet (see figure 1). The mass volume of copper/optical cables from the equipment should be managed in the cabinet. Networking/IT cabinets will be increasingly sited at general offices

40、 in enterprise buildings rather than at traditional technical rooms in telecom-central offices. In order to meet these market needs, the implementation of additional specified dimensions for extended features based on IEC 60917-2-2 became necessary. b) Subject for development of extended connector a

41、pplication packaging based on IEC 60917 series The existing IEC 60917 series, which is structured on the modular concept of 25 mm, is based on the IEC standardized metric connector. However, the system packaging uses to many non-standardized enhanced connectors, which are necessary to realize the sy

42、stem functions and level of performance (see Figure 2). NOTE IEC Subcommittee 48D, Working Group 2, reviews the trends in system packaging, in which key elements are electrical/optical signal interfaces and connectors, as well as the general tendency of the new enclosure system. From these aspects,

43、the IEC Subcommittee 48D, Working Group 2 has recently developed IEC 60917-2-3 which will be applicable to system packaging for high-speed and other system applications in the near future. EN 60917-2-3:2006 6 IEC 681/06 Figure 1 Typical example of large subracks in a wide cabinet, equipped mass volu

44、me of copper/optical cables installation High density andhigh speed connector High speed fibreoptic connector High density multi-chip module (3D structured ICmounted functional SMD/BGA unit) Metal wired/fibre-optic linked backplane or middleplane Rear plug-in module Front plug-in module Functional m

45、odule unit with high density multi-chip module BGA Internal interface inter SMDs/BGAs on the module IEC 682/06 Key SMD: Surface Mount Device. BGA: Ball Grid Array. Figure 2 Subject for development of extended connector application packaging and key elements of interconnection between functional plug

46、-in modules via backplane in the future packaging system 7 EN 60917-2-3:2006 MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES Part 2-3: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Extended detail specificati

47、on Dimensions for subracks, chassis, backplanes, front panels and plug-in units 1 Scope and object This part of IEC 60917 provides additional dimensions for a modular range of subracks and associated plug-in units based on IEC 60917-2-2. A typical subrack consists of a frame design with mounting dim

48、ensions for installation into racks or cabinets in accordance with IEC 60917-2-1. The aperture dimensions of a subrack are specified in order to meet the mounting dimensions of front plug-in units. This part of IEC 60917 comprises additional dimensions for subracks and subrack associated plug-in uni

49、ts with injector/ extractor handle; dimensions for basic electromagnetic shielding provisions; dimensions of the key/coding system for subrack and plug-in units; dimensions of the alignment pin for front panel and plug-in unit; dimensions of electrostatic discharge provisions; dimensions of rear-mounted plug-in units. Connector-related dimensions are given in A

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1