BS EN 61188-5-4-2007 Printed boards and printed board assemblies - Design and use - Attachments (land joint) considerations - Components with J leads on two sides《印制电路板和印制电路板组件 设计和.pdf

1、BRITISH STANDARDBS EN 61188-5-4:2007Printed boards and printed board assemblies Design and use Part 5-4: Attachment (land/joint) considerations Components with J leads on two sidesThe European Standard EN 61188-5-4:2007 has the status of a British StandardICS 31.180g49g50g3g38g50g51g60g44g49g42g3g58

2、g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61188-5-4:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 Decem

3、ber 2007 BSI 2007ISBN 978 0 580 59957 6National forewordThis British Standard is the UK implementation of EN 61188-5-4:2007. It is identical to IEC 61188-5-4:2007. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizat

4、ions represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.A

5、mendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61188-5-4 NORME EUROPENNE EUROPISCHE NORM November 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Centra

6、l Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61188-5-4:2007 E ICS 31.180 English version Printed boards and printed board assemblies - Design and use - Part 5-4: Attachm

7、ent (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007) Cartes imprimes et cartes imprimes quipes - Conception et utilisation - Partie 5-4: Considrations sur les liaisons pistes-soudures - Composants sorties en J sur deux cts (CEI 61188-5-4:2007) Leiterplatten und

8、 Flachbaugruppen - Konstruktion und Anwendung - Teil 5-4: Betrachtungen zur Montage (Anschlussflche/Verbindung) - Bauelemente mit J-frmigen Anschlssen auf zwei Seiten (IEC 61188-5-4:2007) This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are bound to comply with the CEN/C

9、ENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to an

10、y CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official ver

11、sions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romani

12、a, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/704/FDIS, future edition 1 of IEC 61188-5-5, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61188-5-5 o

13、n 2007-11-01. This standard is to be used in conjunction with EN 61188-5-1. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-08-01 latest date by which the national standa

14、rds conflicting with the EN have to be withdrawn (dow) 2010-11-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61188-5-5:2007 was approved by CENELEC as a European Standard without any modification. _ EN 61188-5-4:2007 2 CONTENTS INTRODUCTION.4

15、1 Scope.5 2 Normative references .5 3 General information5 3.1 General component description .5 3.2 Marking .6 3.3 Packaging .6 3.4 Process considerations .6 4 Small outlined J packages (SOJ) 6 4.1 Component description6 4.2 Component dimensions .7 4.3 Solder joint fillet design .8 4.4 Land pattern

16、dimensions .10 Bibliography14 Figure 1 SOJ construction7 Figure 2 SOJ component dimensions.8 Figure 3 Solder joint fillet design10 Figure 4 SOJ land pattern dimensions .13 EN 61188-5-4:2007 3 Annex ZA (normative) Normative references to international publications with theircorresponding European pub

17、lications15INTRODUCTION This part of IEC 61188 covers land pattern for components with J leads on two sides. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land protrusions and courtyard excesses (see IEC 61188-5-1,

18、Generic requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering process. For application of the wave soldering process (though uncommon

19、 for SOJ components) the land pattern and courtyard dimensions may have to be modified. An orientation parallel to the wave direction is strongly recommended and suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (levels 1, 2, 3) on the ba

20、sis of a threefold set of land protrusions and courtyard excesses: maximum (max.); medium (mdn); and minimum (min.). Nevertheless the user may develop deviating land pattern dimensions based upon the methodology of IEC 61188-5-1, introducing his own special material and assembling process conditions

21、 C, F, P and perhaps his own special land protrusions and courtyard excesses dimensions, as required. If a user has good reasons to use a concept different from that of IEC 61188-5-1 or if the user prefers unusual land protrusions, this standard should be used for checking the resulting solder fille

22、ts. It is the responsibility of the user to verify his used SMD land patterns for achieving an undisturbed mounting process including testing and an ensured reliability for the product stress conditions in use. EN 61188-5-4:2007 4 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-4:

23、Attachment (land/joint) considerations Components with J leads on two sides 1 Scope This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of

24、 the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition ci

25、ted applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-58, Environmental testing Part 2-58: Tests: Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting

26、 devices (SMD) IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes IEC 60286-4, Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of form E and G IEC 6028

27、6-5, Packaging of components for automatic handling Part 5: Matrix trays IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 General information 3.1 General component description The two-sided J lead family is a small outline

28、 family identified by the dimensions of the body size in inches. For example, the SOJ/300 has a body size of 0,300 in or 7,63 mm, the SOJ/350 has a body size of 0,350 in or 8,88 mm, the SOJ/400 has a body size of 0,400 in or 10,12 mm, and the SOJ/450 has a body size of 0,450 in or 11,38 mm. Package

29、lead counts range from 14 to 28 pins. Pitch is uniformly for all sizes, i.e. 1,27 mm. The small-outline J (SOJ) package has leads on two sides, similar to a DIP. The lead configuration, like the letter J, extends out the side of the package and bends under the package forming a J bend. The point of

30、contact of the lead to the land pattern is at the apex of the J bend and is the basis for the span of the land pattern. The (inner) end of the J is called the heel, and the outer side of the J is called the toe. EN 61188-5-4:2007 5 The leads shall be coplanar within 0,1 mm. That is, when the compone

31、nt is placed on a flat surface, no lead may be more than 0,1 mm off the flat surface. The SOJ package takes advantage of chips having parallel address or data line layouts. For example, memory ICs are often used in multiples, and bus lines connect to the same pin on each chip. Memory chips in SOJ pa

32、ckages can be placed close to one another because of the parallel pin layout and the use of J leads. With high capacity memory systems, the space savings can be significant compared with a dual in-line. 3.2 Marking The marking of the SOIC family of parts shall comply with the definitions in the rele

33、vant IEC product specifications. 3.3 Packaging Components may be provided in tape packaging: reference IEC 60286-3, stick magazine: reference IEC 60286-4, tray packaging: reference IEC 60286-5. Bulk packaging is not recommended because of lead coplanarity conditions required for placement and solder

34、ing. 3.4 Process considerations Together with other components assembled on PC boards, J lead packages are normally processed using standard solder reflow processes. Parts should therefore have an adequate solderability and resistance to soldering heat. These capabilities shall be demonstrated by su

35、bmitting the parts to the test conditions of IEC 60068-2-58 and by complying with the conditions defined in IEC 61760-1. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform

36、 that is capable of establishing a reliable solder joint no matter what the solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above the liquidus temperat

37、ure of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond. 4 Small outlined J packages (SOJ) 4.1 Component description Figure 1 shows a typical construction example. EN 61188-5-4:2007 6 IEC 2018/07 Figure 1 SOJ construction 4.2 Component dimensions

38、Figure 2 shows the component dimensions for SOJ components. H P1,02 1,17 L S A W TA (in) A (mm) ref. min. max. 0,300 0,350 7,49 7,75 8,76 9,02 BIEC 2019/07 Dimensions in millimetresEN 61188-5-4:2007 7 L S W T B H P Component identification Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic

39、SOJ 14/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27 SOJ 16/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27 SOJ 18/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27 SOJ 20/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27 SOJ 22/300 8,38 8,

40、76 4,38 5,06 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27 SOJ 24/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27 SOJ 26/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27 SOJ 28/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27 SOJ 14/350 9,65 10,03 5,65 6,33 0,

41、38 0,51 1,6 2,0 9,65 9,96 3,75 1,27 SOJ 16/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27 SOJ 18/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27 SOJ 20/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27 SOJ 22/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,

42、0 14,73 15,04 3,75 1,27 SOJ 24/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27 SOJ 26/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27 SOJ 28/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27 SOJ 14/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 9,65 9,96

43、 3,75 1,27 SOJ 16/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27 SOJ 18/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27 SOJ 20/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27 SOJ 22/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,

44、27 SOJ 24/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27 SOJ 26/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27 SOJ 28/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27 SOJ 14/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27 SOJ 16/

45、450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27 SOJ 18/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27 SOJ 20/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27 SOJ 22/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27 SOJ 24/450 12,1

46、9 12,57 8,19 8,87 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27 SOJ 26/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27 SOJ 28/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27 Figure 2 SOJ component dimensions Land pattern dimensional data may need to be adjusted if the c

47、omponent dimensional data does not match JEDEC and/or JEITA data sheets. 4.3 Solder joint fillet design Figure 3 shows the shape and dimensions of the solder fillet after the soldering process. The minimum, median and maximum dimensions of each of toe, heel and side fillet are determined by taking i

48、nto consideration solder joint reliability as well as quality and productivity in the mounting process of parts. EN 61188-5-4:2007 8 In designing land patterns, three accuracy factors need to be taken into consideration: parts dimensions accuracy (C); parts mount accuracy on PWBs (P); land shape acc

49、uracy of PWBs (F), in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these factors are basically as follows: a) Design consideration when soldered without self-alignment effect (level 1) In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot be simpified but remain the same as follows: Zmax = Lmin + 2JHmax + TH TH=CPFL21L21L2+ Gmin = Smax (rms) 2JT max TTTT= CPFS21L21L2+ Xmax = Wmin + 2JSmax + TSTS = CPFW21