BS EN 61189-11-2013 Test methods for electrical materials printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperatu.pdf

1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnectionstructures and assembliesPart 11: Measurement of melting temperature or melting temperature ranges of solder alloysBS EN 61189-11:2013National forewordThis British Standard is the UK implementatio

2、n of EN 61189-11:2013. It isidentical to IEC 61189-11:2013.The UK participation in its preparation was entrusted to Technical Com-mittee EPL/501, Electronic assembly technology & Printed Electronics.A list of organizations represented on this committee can be obtained onrequest to its secretary.This

3、 publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2013.Published by BSI Standards Limited 2013ISBN 978 0 580 68869 0ICS 31.180Compliance with a British Standard cannot confer immuni

4、ty fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 July 2013.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61189-11:2013EUROPEAN STANDARD EN 61189-11 NORME EUROPENNE EUROPISCHE N

5、ORM June 2013 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means

6、 reserved worldwide for CENELEC members. Ref. No. EN 61189-11:2013 E ICS 31.180 English version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC

7、61189-11:2013) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 11: Mesure de la temprature de fusion ou des plages de tempratures de fusion des alliages braser (CEI 61189-11:2013) Prfverfahren fr Elektromaterialien, Leiterpl

8、atten und andere Verbindungsstrukturen und Baugruppen - Teil 11: Messung der Schmelztemperatur und Schmelztemperaturbereiche von Lotlegierungen (IEC 61189-11:2013) This European Standard was approved by CENELEC on 2013-06-11. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulati

9、ons which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC memb

10、er. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official version

11、s. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the N

12、etherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61189-11:2013EN 61189-11:2013 - 2 - Foreword The text of document 91/1086/FDIS, future edition 1 of IEC 61189-11, prepared by IEC TC 91 “Electronics assembly technology

13、“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-11:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-03-11 latest date by wh

14、ich the national standards conflicting with the document have to be withdrawn (dow) 2016-06-11 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent

15、 rights. Endorsement notice The text of the International Standard IEC 61189-11:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 61189-1 NOTE Harmonized as EN 61

16、189-1. BS EN 61189-11:2013- 3 - EN 61189-11:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application.

17、 For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publicati

18、on Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printe

19、d boards) EN 61189-3 - IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - ISO 9453 - Soft solder alloys - Chemical compositions and forms

20、 EN ISO 9453 - ISO 11357-1 - Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles EN ISO 11357-1 - BS EN 61189-11:2013 2 61189-11 IEC:2013 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Summary of measuring methods . 6 5 Test equipment . 6 5.

21、1 Method A:DSC 6 5.1.1 DSC 6 5.1.2 Balance . 6 5.1.3 Pans 6 5.1.4 Inert gas 6 5.1.5 Alumina powder . 6 5.2 Method B:Cooling curve of molten solder 7 5.2.1 Electric furnace . 7 5.2.2 Thermocouple 7 5.2.3 Measuring instrument 7 5.2.4 Recorder . 7 5.2.5 Container. 7 6 Calibration of the temperature 7 7

22、 Procedure for the measuring method 7 7.1 Method A: DSC . 7 7.1.1 Test condition 7 7.1.2 Procedure for measuring the DSC curve 8 7.2 Method B: Cooling curve of molten solder . 10 7.2.1 Test condition 10 7.2.2 Procedure for measuring the cooling curve of molten solder 10 Annex A (normative) Test repo

23、rt on melting temperatures of solder alloys . 12 Annex B (informative) Examples of test result (Method A) 13 Annex C (informative) Example of test result (Method B) . 14 Bibliography 15 Figure 1 Determination of solidus temperature . 8 Figure 2 Determination of temperature of melting ends 9 Figure 3

24、 Determination of liquidus temperature 10 Figure 4 Cooling curves of molten solder . 11 Figure B.1 Example of test result (Method A: Sn96,5Ag3Cu,5 alloy) 13 Figure B.2 Example of test result (Method A: Sn95,8Ag3,5Cu,7 alloy) 13 Figure C.1 Example of test result (Method B: Sn96,5Ag3Cu,5 alloy) 14 Fig

25、ure C.2 Example of test result (Method B: Sn95,8Ag3,5Cu,7 alloy) . 14 Table 1 Metal list for calibration . 7 Table A.1 Report form 12 BS EN 61189-11:201361189-11 IEC:2013 5 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 11: Measurement

26、of melting temperature or melting temperature ranges of solder alloys 1 Scope This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as we

27、ll as for connecting components. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referen

28、ced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions1IEC 61189-3, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures

29、(printed boards) IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications ISO 9453, Soft solder alloys Chemical compositions and forms ISO 11357-1, Plastics Diff

30、erential scanning calorimetry (DSC) Part 1: General principles 3 Terms and definitions For the purposes of this document the terms and definitions of IEC 60194, IEC 61189-3, IEC 61190-1-3, ISO 9453 and ISO 11357-1, as well as the following apply. 3.1 melting temperature ranges total range of solidus

31、 and liquidus temperature of solder alloys 3.2 solidus temperature temperature when solder alloys start to melt measured by DSC (method A) 1Sixth edition to be published. BS EN 61189-11:2013 6 61189-11 IEC:2013 3.3 solidus temperature temperature when solidification of solder alloys ends measured by

32、 the cooling curve of molten solder (method B) 3.4 liquidus temperature temperature when melting ends measured for various heating temperature levels by DSC (method A) 3.5 liquidus temperature solidification temperature measured by the cooling curve of molten solder (method B) 3.6 DSC curve curve me

33、asured by differential scanning calorimetry (DSC) 4 Summary of measuring methods The melting temperature range of solder alloys is measured by using the following methods. Method A: Differential scanning calorimetry (DSC). Method B: Cooling curve of molten solder. Test report shall be made according

34、 to Annex A. 5 Test equipment 5.1 Method A: DSC 5.1.1 DSC See ISO 11357-1. 5.1.2 Balance The balance shall have a resolution of 0,1 mg or better. 5.1.3 Pans Pans shall be constructed of a material with a high heat transfer rate and which is not corroded by the samples. Usually, aluminium is used. 5.

35、1.4 Inert gas Inert gas (example N2 or Ar: of a purity higher than 99,9 %) should be used to avoid the sample oxidation. 5.1.5 Alumina powder Alumina powder should be used as a reference material. It is stable for the temperature range of the measurement. See ISO 11357-1. BS EN 61189-11:201361189-11

36、 IEC:2013 7 5.2 Method B: Cooling curve of molten solder 5.2.1 Electric furnace It shall be capable of heating its content to a temperature of 400 C or higher and provide good heat insulation. 5.2.2 Thermocouple A thermocouple that is suitable for the temperature being used, shall be selected. The c

37、ompensating lead used shall be suitable for the thermocouple being used. 5.2.3 Measuring instrument The heat flow measuring instrument shall be capable of measurements of one second intervals or less. 5.2.4 Recorder The recorder shall be capable of recording a cooling curve and reading in 0,1 C unit

38、s. 5.2.5 Container The graphite or ceramic crucible shall be used. 6 Calibration of the temperature Temperature calibration shall be conducted using the pure materials listed in Table 1, whose purity shall be 99,99 % or higher. The melting points of two or more pure materials that are close to the t

39、emperature to be measured, shall be measured under the same conditions as those applied to the sample, and a compensation formula with a linear function shall be determined for the temperature correction from the obtained measurements and the melting temperatures given in Table 1. Table 1 Metal list

40、 for calibration Metal Melting temperature C In (indium) 156,6 Sn (tin) 231,9 Pb (lead) 327,4 7 Procedure for the measuring method 7.1 Method A: DSC 7.1.1 Test condition 7.1.1.1 Sample mass The sample mass shall be from 5 mg to 50 mg. 7.1.1.2 Inert gas flow Inert gas shall be used. Gas flow rate sha

41、ll be from 10 ml/min to 50 ml/min. BS EN 61189-11:2013 8 61189-11 IEC:2013 7.1.1.3 Heating rate Heating rate shall be from 0,5 C/min to 10 C/min. Recommended heating rate are 0,5, 1, 2, 5 and 10 C/min. 7.1.2 Procedure for measuring the DSC curve 7.1.2.1 Instructions Carry out the measuring DSC curve

42、 as follows. a) The sample is placed in the centre part of pans, and the cap of the pans is put and clamped. b) The pan containing the sample is placed on to the pan holder, and the pan with alumina powder is placed on the other pan holder. c) Flow the inert gas (example N2 or Ar) until the measurem

43、ent ends. d) Carry out the measuring DSC curve with a heating rate of 0,5 C/min up to a temperature about 30 C higher than the heat flow peak. Repeat procedures a) through d) using a new sample, except heating rate of 1, 2, 5 and 10 C/min. 7.1.2.2 Solidus temperature The data of a heating rate of 2

44、C/min are used. A typical DSC curve is shown in Figure 1. T1 or T2 represent the solidus temperature. a) If melting occurs abruptly, then the temperature when melting starts shall be the temperature T1 at the intersection of the extrapolation of the low-temperature side baseline towards the high-tem

45、perature side and the tangent drawn from the low-temperature side endothermic peak at the point with the steepest slope, as shown in Figure 1a. In this case, correct the temperature, using T1 of the pure materials. b) If melting occurs gradually, then determine temperature T2 at the point at which t

46、he curve starts to leave the baseline, as shown in Figure 1b. In this case, correct the temperature, using T2 of the pure materials. Repeat the measurement several times and then determine the average. T1 Temperature (C) T2 Temperature (C) HeatflowHeatflowIEC 1071/13 IEC 1070/13 Figure 1a Abruptly m

47、elting alloy Figure 1b Gradually melting alloy Figure 1 Determination of solidus temperature BS EN 61189-11:201361189-11 IEC:2013 9 7.1.2.3 Liquidus temperature The data of a heating rate of 0,2, 0,5, 1, 2, 5 and 10 C/min are used. A typical DSC curve is shown in Figure 2. T3 or T4 indicate the temp

48、erature where melting ends. a) If melting occurs with a single peak, the temperature of melting ends shall be the temperature T3 at the intersection of the extrapolation of the high-temperature side baseline towards the low-temperature side and the tangent drawn from the high-temperature side endoth

49、ermic peak at the point with the steepest slope, as shown in Figure 2a. b) If melting occurs with double or more peaks, the temperature where the melting ends shall be the temperature T4 at the intersection of the extrapolation of the high-temperature side baseline towards the low-temperature side and the tangent drawn from the most highest-temperature side endothermic peak at the point with the steepest slope, as shown in Figure 2b. T3 Temperature (C) T