BS EN 61189-2-2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structu.pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58other interconnection structures and assemblies Part 2: Test methods for materials for interconnect

2、ion structuresThe European Standard EN 61189-2:2006 has the status of a British StandardICS 31.180Test methods for electrical materials, printed boards and BRITISH STANDARDBS EN 61189-2:2006BS EN 61189-2:2006This British Standard was published under the authority of the Standards Policy and Strategy

3、 Committee on 30 November 2006 BSI 2006ISBN 0 580 49650 3Amendments issued since publicationAmd. No. Date CommentsThis publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot conf

4、er immunity from legal obligations.National forewordThis British Standard was published by BSI. It is the UK implementation of EN 61189-2:2006. It is identical with IEC 61189-2:2006. It supersedes BS EN 61189-2:1997, which will be withdrawn on 1 September 2009.The UK participation in its preparation

5、 was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on EPL/501 can be obtained on request to its secretary.EUROPEAN STANDARD EN 61189-2 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standar

6、dization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-2:2006

7、 E ICS 31.180 Supersedes EN 61189-2:1997 + A1:2000English version Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006) Mthodes dessais pour les matriaux lectrique

8、s, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 2: Mthodes dessai des matriaux pour structures dinterconnexion (CEI 61189-2:2006) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen Teil 2: Prfverfahren fr Materialien fr V

9、erbindungsstrukturen (IEC 61189-2:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteratio

10、n. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by transl

11、ation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Fran

12、ce, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/564/FDIS, future edition 2 of IEC 61189-2, prepared

13、 by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61189-2 on 2006-09-01. This European Standard supersedes EN 61189-2:1997 + A1:2000. The significant technical changes with respect to EN 61189-2:1997 + A1:2000 concern the

14、 addition of several new tests in the following categories: - C: Chemical test methods - D: Dimensional test methods - E: Electrical test methods - M: Mechanical test methods - N: Environmental test methods - X: Miscellaneous test methods This standard forms part of a series and should be used in co

15、njunction with other parts in the same series, under the main title Test methods for electrical materials, interconnection structures and assemblies: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnectio

16、n structures (printed boards) Part 4: Test methods for electronic components assembling characteristics Part 5: Test methods for printed board assemblies Part 6: Test methods for materials used in electronic assemblies It should also be read in conjunction with EN 60068, Environmental testing. The f

17、ollowing dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has be

18、en added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61189-2:2006 was approved by CENELEC as a European Standard without any modification. _ EN 61189-2:2006 2 3 EN 61189-2:2006 CONTENTS INTRODUCTION . H7 1 Scope . H8 2 Normative references H8 3 Accuracy, precision and

19、 resolution H8 3.1 Accuracy H9 3.2 Precision H9 3.3 Resolution H10 3.4 Report H10 3.5 Students “t“ distribution . H10 3.6 Suggested uncertainty limits . H11 4 Catalogue of approved test methods H12 5 P: Preparation/conditioning test methods . H12 5.1 Test 2P01: Dry heat (under consideration) H12 5.2

20、 Test 2P02: Solder float stress (under consideration) . H12 6 V: Visual test methods. H12 7 D: Dimensional test methods . H12 7.1 Test 2D01: Thickness of base materials and rigid boards H12 8 C: Chemical test methods H14 8.1 Test 2C01: Resistance to sodium hydroxide of base materials H14 8.2 Test 2C

21、02: Gel time of epoxy based prepreg materials H15 8.3 Test 2C03: Resin content of prepreg materials by treated weight H16 8.4 Test 2C04: Volatile content of prepreg materials . H18 8.5 Test 2C05: Blistering during heat shock H20 8.6 Test 2C06: Flammability, vertical burning test for rigid materials

22、. H22 8.7 Test 2C07: Flammability; horizontal burning test for rigid materials . H26 8.8 Test 2C08: Flammability, flex material H29 8.9 Test 2C09: Melting viscosity of prepreg materials . H33 8.10 Test 2C10: Resin content of prepreg materials by sublimation. H35 8.11 Test 2C11: UV blocking character

23、istics of laminates . H37 8.12 Test 2C12: Total halogen content in base materials H38 9 M: Mechanical test methods H42 9.1 Test 2M01: Test method for bow and twist H42 9.2 Test 2M02: Bow/twist after etching and heating. H43 9.3 Test 2M03: Cure factor of base materials by differential scanning calori

24、metry (DSC) or thermomechanical analysis (TMA) H45 9.4 Test 2M04: Twist after heating (under consideration) H46 9.5 Test 2M05: Pull-off strength H46 9.6 Test 2M06: Peel strength after exposure to solvent vapour . H49 9.7 Test 2M07: Peel strength after immersion in solvent . H51 9.8 Test 2M08: Flexur

25、al strength (under consideration). H52 9.9 Test 2M09: Resin flow of prepreg material H52 9.10 Test 2M10: Glass transition temperature of base materials by differential scanning calorimetry (DSC) H54 9.11 Test 2M11: Glass transition temperature of base materials by thermomechanical analysis (TMA) H56

26、 EN 61189-2:2006 4 9.12 Test 2M12: Surface waviness . H59 9.13 Test 2M13: Peel strength as received . H60 9.14 Test 2M14: Peel strength after heat shock H61 9.15 Test 2M15: Peel strength after dry heat H64 9.16 Test 2M16: Peel strength after simulated plating. H65 9.17 Test 2M17: Peel strength at hi

27、gh temperature. H67 9.18 Test 2M18: Surface quality (under consideration) H69 9.19 Test 2M19: Punching (under consideration) H69 9.20 Test 2M20: Flexural strength H69 9.21 Test 2M21: Rolling fatigue of flexible base materials . H70 9.22 Test 2M22: Weight of foil after lamination . H72 9.23 Test meth

28、od 2M23: Rectangularity of cut panels . H74 9.24 Test 2M24: Coefficient of thermal expansion (under consideration) . H75 9.25 Test 2M25: Time to delamination by thermomechanical analysis (TMA). H75 9.26 Test 2M26: Scaled flow test for prepreg materials . H76 9.27 Test 2M27: The resin flow properties

29、 of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed boards . H79 10 Electrical test methods H84 10.1 Test 2E01: Surface tracking, moisture condition (under consideration) H84 10.2 Test 10.2 2E02: Dielectric breakdown of base materials parallel to lam

30、inations. H84 10.3 Test 2E03: Surface resistance after damp heat, steady state H86 10.4 Test 2E04: Volume resistivity and surface resistivity . H91 10.5 Test 2E05: Permittivity and dielectric dissipation (under consideration) . H95 10.6 Test 2E06: Volume and surface resistivity, 3 electrodes (under

31、consideration)H95 10.7 Test 2E07: Surface and volume resistivity, elevated temperature (under consideration) H95 10.8 Test 2E08: Surface corrosion H95 10.9 Test 2E09: Comparative tracking index (CTI) H97 10.10 Test 2E10: Permittivity and dissipation factor (under consideration) H101 10.11 Test 2E11:

32、 Electric strength (under consideration) H101 10.12 Test 2E12: Resistance of foil (under consideration). H101 10.13 Test 2E13: Corrosion at edge (under consideration) H101 10.14 Test 2E14: Arc resistance. H101 10.15 Test 2E15: Dielectric break-down (under consideration) H105 10.16 Test 2E16: Contact

33、 resistance of printed circuit keypad cont (under consideration) H105 10.17 Test 2E17: Insulation resistance of printed board materials. H105 10.18 Test 2E18: Fungus resistance of printed board materials H107 11 N: Environmental test methods H111 11.1 Test 2N01: Pressure cooker test (under considera

34、tion) . H111 11.2 Test 2N02: Water absorption H111 12 X: Miscellaneous test methods H112 12.1 Test 2X02: Dimensional stability of thin laminates. H112 5 EN 61189-2:2006 Annex A (informative) Worked examples . H116 Annex B (informative) Conversion table H118 Annex C (informative) Laboratory pro forma

35、 (form) H123 Annex D (informative) Laboratory pro forma H124 Annex ZA (normative) Normative references to international publications with their corresponding European publications .125 HFigure 1 Thickness measuring points H13 HFigure 2 Position of specimens . H19 HFigure 3 Fluidized sand bath. H21 H

36、Figure 4 Test fixture . H28 HFigure 5 V method (Vertical flammability method) H32 HFigure 6 VTM method (vertical flammability method for recaltrant specimens) . H32 HFigure 7 Example of prepreg melting viscosity H35 HFigure 8 Position of specimens for resin content . H36 HFigure 9 Absorption of comb

37、ustion gas using a combustion flask set-up H40 HFigure 10 Composition of ion exchange chromatograph H41 HFigure 11 Specimen for peel strength measurement H50 HFigure 12 Differential scanning calorimetry . H55 HFigure 13 Thermomechanical analysis (expansion mode) H58 HFigure 14 Test specimen pattern.

38、 H71 HFigure 15 General arrangement of apparatus H71 HFigure 16 Scaled flow test specimen before lamination . H78 HFigure 17 Scaled flow test specimen measurement points. H78 HFigure 18 Test patterns for clearance filling test H80 HFigure 19 Punched test pattern for squeeze-out test . H81 HFigure 20

39、 Standard lay-up of materials in the press to prepare the test specimens for referee tests. H82 HFigure 21 Profiles of press conditions to prepare the test specimens for referee tests . H83 HFigure 22 Measurement of volume resistance . H90 HFigure 23 Measurement of surface resistance. H90 HFigure 25

40、 Electrode connections for measuring volume resistance H94 HFigure 26 Electrode connections for measuring surface resistance H94 HFigure 27 Ring and disk pattern H96 HFigure 28 Comb pattern H97 HFigure 31 Example of test apparatus. H99 HFigure 32 Example of test circuit. H99 HFigure 33 Arc-resistanc

41、e test circuit H102 HFigure 34 Tungsten steel rod electrode assembly . H103 HFigure 29 Electrode H98 HFigure 30 Electrode arrangement H98 Figure 24 Electrode dimensions for volume resistivity and surface resistivity test91 EN 61189-2:2006 6 HTable 1 Students “t“ distribution. H11 HTable 2 Example of

42、 analysing conditions for the ion exchange chromatography. H41 HTable 3 Specimen dimensions H69 HTable 4 Number of plies per specimen as a function of glass thickness . H77 HTable 6 Specimen dimension (cm) H87 HTable 7 Test pattern dimensions. H92 HTable 8 Arc resistance H104 HFigure 36 Location of

43、specimens on original sheet for dimensional stability test H113 HFigure 37 Location of marks on specimen for dimensional stability H114 Table 5 Cleaning procedures . 84 HFigure 35 Test specimen for insulation resistance. H105 7 EN 61189-2:2006 INTRODUCTION IEC 61189 relates to test methods for print

44、ed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focu

45、s; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (e.g. TC 50) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test meth

46、ods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for materials used to produce interconnection structures (printed boar

47、ds) and electronic assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: P: preparation/condition

48、ing methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test sequence