BS EN 61189-5-1-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies General test methods for materials and assemblies Guid.pdf

1、Test methods for electrical materials, printed boards and other interconnection structures and assembliesPart 5-1: General test methods for materials and assemblies Guidance for printed board assembliesBS EN 61189-5-1:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15

2、:06National forewordThis British Standard is the UK implementation of EN 61189-5-1:2016. It isidentical to IEC 61189-5-1:2016.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can

3、be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 87381 2ICS 31.180Compliance w

4、ith a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 October 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61189-5-1:2016EUROPEAN ST

5、ANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-5-1 September 2016 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblie

6、s (IEC 61189-5-1:2016) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 5-1: Mthodes dessai gnrales pour les matriaux et assemblages - Lignes directrices pour les assemblages de cartes circuit imprim (IEC 61189-5-1:2016) Prfv

7、erfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-1: Allgemeine Prfverfahren fr Materialien und Baugruppen - Leitfaden fr Baugruppen von Leiterplatten (IEC 61189-5-1:2016) This European Standard was approved by CENELEC on 2016-08-09. CENELEC membe

8、rs are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applicatio

9、n to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC

10、Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland

11、, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisch

12、es Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61189-5-1:2016 E BS EN 61189-5-1:2016EN 61189-5-1:2016 European foreword T

13、he text of document 91/1273/CDV, future edition 1 of IEC 61189-5-1, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-5-1:2016. The following dates are fixed: latest date by which the document has to be implemen

14、ted at national level by publication of an identical national standard or by endorsement (dop) 2017-05-09 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-08-09 Attention is drawn to the possibility that some of the elements of this document m

15、ay be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-1:2016 was approved by CENELEC as a European Standard without any modification. In the official ve

16、rsion, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068 (series) NOTE Harmonized as EN 60068 (series). IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014. IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58:2015 NOTE Harmonized as EN 60068-2-

17、58:2015. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-5 (series) NOTE Harmonized as EN 61189-5 (series). IEC 61189-5 NOTE Harmonized as EN 61189-5. IEC 61189-5-1:2016 NOTE Harmonized as EN 61189-5-1:2016. IEC 61189-5-2:2015 NOTE Harmonized as EN 61189-5-2:2015. IEC 61189-5-3:2015 NOTE Harmon

18、ized as EN 61189-5-3:2015. IEC 61189-5-4:2015 NOTE Harmonized as EN 61189-5-4:2015. IEC 61189-6 NOTE Harmonized as EN 61189-6. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3. BS EN 61189-5-1:2016EN 61189-5-1

19、:2016 3 IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Harmonized as EN 62137:2004. ISO 9001 NOTE Harmonized as EN ISO 9001. ISO 9455-1 NOTE Harmonized as EN 29455-1. ISO 9455-2 NOTE Harmonized as EN 29455-2. BS EN 61189-5-1:2016 2 IEC 61189-5-1:2016 IEC 2016 CONTENTS FOREWORD .

20、4 INTRODUCTION . 6 1 Scope 8 2 Normative references. 8 3 Accuracy, precision and resolution . 8 3.1 General . 8 3.2 Accuracy . 8 3.3 Precision . 9 3.4 Resolution. 10 3.5 Report 10 3.6 Students t distribution . 10 3.7 Suggested uncertainty limits 11 4 Catalogue of approved test methods 12 5 List of c

21、ontents of the IEC 61189-5 series 12 Annex A (informative) Tests . 13 Annex B (informative) Guidance documents and handbooks . 15 B.1 General . 15 B.2 Handbook and guide to supplement IPC-J-STD-001 . 15 B.3 Guidelines for Electrically Conductive Surface Mount Adhesives (IPC-3406) . 15 B.4 Users Guid

22、e for Cleanliness of Unpopulated Printed Boards (IPC-5701) . 15 B.5 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards (IPC-5702) 15 B.6 Surface Insulation Resistance Handbook (IPC-9201) . 16 B.7 Material and Process Characterisation / Qualification Tes

23、t Protocol for Assessing Electrochemical Performance (IPC-9202) 16 B.8 User Guide for the IPC/IEC B52 Process Qualification Test Vehicle (IPC-9203) 16 B.9 PWB Assembly Soldering Process Guideline for Electronic Components (IPC-9502) 16 B.10 Aqueous Post Solder Cleaning Handbook (IPC-AC-62A) 17 B.11

24、Guidelines for Cleaning of Printed Boards and Assemblies (IPC-CH-65A) . 17 B.12 Handbook (IPC-J-STD-005) . 17 B.13 Acceptability of Electronic Assemblies (IPC-HDBK-610) . 18 B.14 Guidelines for Design, Selection and Application of Conformal Coatings (IPC-HDBK-830) . 18 B.15 Solder mask Handbook (IPC

25、-HDBK-840) . 18 B.16 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (IPC-9252) 19 B.17 In-Process DPMO and Estimated Yield for PCAs (IPC-9261A) 19 B.18 Assembly Soldering Process Guideline for Electronic Components (IPC-9502 PWB) . 20 B.19 Users Guide for IPC-TM-650

26、, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation (IPC-9631) 20 B.20 High Temperature Printed Board Flatness Guideline (IPC-9641) 20 B.21 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) (IPC-9691A

27、) 21 BS EN 61189-5-1:2016IEC 61189-5-1:2016 IEC 2016 3 B.22 Mechanical Shock Test Guidelines for Solder Joint Reliability (IPC-JEDEC-9703) 21 B.23 Printed Circuit Assembly Strain Gage Test Guideline (IPC-JEDEC-9704A) . 22 Bibliography . 23 Table 1 Students t distribution . 11 Table A.1 General test

28、methods for materials and assemblies . 13 BS EN 61189-5-1:2016 4 IEC 61189-5-1:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5-1: General test methods for materials and assembli

29、es Guidance for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all qu

30、estions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publicati

31、on(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC co

32、llaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinio

33、n on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ens

34、ure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently t

35、o the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certificati

36、on bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall att

37、ach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fee

38、s) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publicati

39、on. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-5-1 has been prepared by IEC technical committee 91: E

40、lectronics assembly technology. The text of this standard is based on the following documents: CDV Report on voting 91/1273/CDV 91/1354/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been dr

41、afted in accordance with the ISO/IEC Directives, Part 2. BS EN 61189-5-1:2016IEC 61189-5-1:2016 IEC 2016 5 A list of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be

42、found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, with

43、drawn, replaced by a revised edition, or amended. BS EN 61189-5-1:2016 6 IEC 61189-5-1:2016 IEC 2016 INTRODUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The

44、standard is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus. Methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test meth

45、ods developed by other technical committees (for example, TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method. If the test method is reproduced with

46、minor revisions, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating printed board assemblies as well as materials used in the manufacture of electronic assemblies. The methods are self-contained, with sufficient detail and description so a

47、s to achieve uniformity and reproducibility in the procedures and test methodologies. It was decided by TC 91 that the contents of IEC 61189-5 and IEC 61189-6 be merged into a series of documents in the following way: IEC 61189-5-1, Test methods for electrical materials, printed boards and other int

48、erconnection structures and assemblies Part 5-1: General test methods for materials and assemblies Guidance for printed board assemblies IEC 61189-5-2:2015, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for ma

49、terials and assemblies Soldering flux for printed board assemblies IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies Soldering paste for printed board assemblies IEC 61189-5-4:2015, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assem